73769-0200

73769-0200

  • 厂商:

    MOLEX8

  • 封装:

  • 描述:

    73769-0200 - 2.00mm (.079") Pitch HDM® Board-to-Board Stacking Header - Molex Electronics Ltd.

  • 详情介绍
  • 数据手册
  • 价格&库存
73769-0200 数据手册
This document was generated on 05/14/2010 PLEASE CHECK WWW.MOLEX.COM FOR LATEST PART INFORMATION Part Number: Status: Overview: Description: 0737690200 Active hdm 2.00mm (.079") Pitch HDM® Board-to-Board Stacking Header, High Rise Vertical, Press-Fit, Open End Option, 72 Circuits Documents: 3D Model Drawing (PDF) Product Specification PS-73780-999 (PDF) RoHS Certificate of Compliance (PDF) Series image - Reference only LR19980 E29179 EU RoHS Not RoHS Compliant REACH SVHC Not Reviewed Halogen-Free Status Not Reviewed China RoHS Agency Certification CSA UL General Product Family Series Application Component Type Overview Product Name Style Backplane Connectors 73769 Backplane, Mezzanine PCB Header hdm HDM® N/A Need more information on product environmental compliance? Email productcompliance@molex.com For a multiple part number RoHS Certificate of Compliance, click here Please visit the Contact Us section for any non-product compliance questions. Physical Circuits (Loaded) Circuits (maximum) Color - Resin Durability (mating cycles max) First Mate / Last Break Flammability Guide to Mating Part Keying to Mating Part Material - Metal Material - Plating Mating Material - Plating Termination Material - Resin Number of Columns Number of Pairs Number of Rows Orientation PC Tail Length (in) PC Tail Length (mm) PCB Retention PCB Thickness Recommended (in) PCB Thickness Recommended (mm) Packaging Type Pitch - Mating Interface (in) Pitch - Mating Interface (mm) Plating min: Mating (µin) Plating min: Mating (µm) Plating min: Termination (µin) Plating min: Termination (µm) Polarized to PCB Stackable Surface Mount Compatible (SMC) Temperature Range - Operating 72 72 Black 200 No 94V-0 No None Phosphor Bronze Gold Tin-Lead High Temperature Thermoplastic 12 Open Pin Field 6 Vertical 0.138 In 3.50 mm None 0.055 In 1.40 mm Tube 0.079 In 2.00 mm 30 0.75 15 0.375 No Yes Yes -55°C to +105°C Search Parts in this Series 73769Series Mates With 73632 HDM PLUS® Board-to-Board Daughtercard Receptacle. 73780 HDM® Board-to-Board Daughtercard Receptacle Application Tooling | FAQ Tooling specifications and manuals are found by selecting the products below. Crimp Height Specifications are then contained in the Application Tooling Specification document. Global Description Product # Flat Rock Tooling for 0622013700 Pneumatic Press Termination Interface: Style Through Hole - Compliant Pin Electrical Current - Maximum per Contact Data Rate Real Signals (per 25mm) Voltage - Maximum 1A 1.0 Gbps 72 100V AC Solder Process Data Replacement RoHS Compliant Part Number None Material Info Reference - Drawing Numbers Packaging Specification PK-70873-0875 Product Specification PS-73780-999 HDM and High Density Metric are trademarks of Amphenol Corporation This document was generated on 05/14/2010 PLEASE CHECK WWW.MOLEX.COM FOR LATEST PART INFORMATION
73769-0200
物料型号: - 型号:0737690200 - 状态:Active(活跃)

器件简介: - 描述:2.00mm (.079") 间距 HDM@ 板对板堆叠式连接器头,高压力-适配,开口端选项,72电路 - 文档:3D模型图(PDF)、产品规格PS-73780-9、RoHS合规证书等

引脚分配: - 电路(已加载):72 - 最大电路:72 - 引脚数量:12列,6行

参数特性: - 颜色 - 树脂:黑色 - 耐用性(最大插拔次数):200次 - 阻燃性:94V-0 - 金属材质:磷青铜 - 镀层 - 接触:金 - 镀层 - 终止:锡-铅 - 树脂材质:高温热塑性材料 - 极化到PCB:否 - 堆叠:是 - 表面贴装兼容(SMC):是 - 工作温度范围:-55°C至+105°C

功能详解: - 产品家族:背板连接器 - 系列:73769 - 应用:背板、中间层、PCB头

应用信息: - 与73632 HDM PLUS® 板对板女儿卡插座和73780 HDM® 板对板女儿卡插座兼容

封装信息: - 包装类型:管装 - 接口 - 配合界面(英寸):0.079英寸 - 接口 - 配合界面(毫米):2.00毫米 - 镀层最小值:接触部位30微英寸(0.75微米),终止部位15微英寸(0.375微米)
73769-0200 价格&库存

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