73770-1300

厂商：
MOLEX8
封装：
描述：
73770-1300 - 2.00mm (.079") Pitch HDM® Board-to-Board Stacking Header, High Rise VerticalSMC, Closed...

数据手册：

下载73770-1300.pdf

立即购买

详情介绍
数据手册
价格&库存

73770-1300 数据手册

This document was generated on 05/14/2010 PLEASE CHECK WWW.MOLEX.COM FOR LATEST PART INFORMATION Part Number: Status: Overview: Description: 0737701300 Active hdm 2.00mm (.079") Pitch HDM® Board-to-Board Stacking Header, High Rise Vertical, SMC, Closed End Option, 144 Circuits Documents: 3D Model Drawing (PDF) Product Specification PS-73780-999 (PDF) RoHS Certificate of Compliance (PDF) Series image - Reference only LR19980 E29179 EU RoHS China RoHS RoHS Compliant by Exemption REACH SVHC Contains SVHC: No Halogen-Free Status Not Reviewed Need more information on product environmental compliance? Email productcompliance@molex.com For a multiple part number RoHS Certificate of Compliance, click here Please visit the Contact Us section for any non-product compliance questions. Agency Certification CSA UL General Product Family Series Application Component Type Overview Product Name Style Backplane Connectors 73770 Backplane, Mezzanine PCB Header hdm HDM® N/A Physical Circuits (Loaded) Circuits (maximum) Color - Resin Durability (mating cycles max) First Mate / Last Break Flammability Guide to Mating Part Keying to Mating Part Material - Metal Material - Plating Mating Material - Plating Termination Material - Resin Number of Columns Number of Pairs Number of Rows Orientation PC Tail Length (in) PC Tail Length (mm) PCB Retention PCB Thickness Recommended (in) PCB Thickness Recommended (mm) Packaging Type Pitch - Mating Interface (in) Pitch - Mating Interface (mm) Plating min: Mating (µin) Plating min: Mating (µm) Plating min: Termination (µin) Plating min: Termination (µm) Polarized to PCB Stackable Surface Mount Compatible (SMC) Temperature Range - Operating 144 144 Black 200 No 94V-0 No None Phosphor Bronze Gold Tin-Lead High Temperature Thermoplastic 24 Open Pin Field 6 Vertical 0.138 In 3.50 mm None 0.055 In 1.40 mm Tube 0.079 In 2.00 mm 30 0.75 15 0.375 No Yes Yes -55°C to +105°C Search Parts in this Series 73770Series Mates With 73632 HDM PLUS® Board-to-Board Daughtercard Receptacle. 73780 HDM® Board-to-Board Daughtercard Receptacle Application Tooling | FAQ Tooling specifications and manuals are found by selecting the products below. Crimp Height Specifications are then contained in the Application Tooling Specification document. Global Description Product # Flat Rock Tooling for 0622013700 Pneumatic Press HDM® Backplane 0621001400 Insertion Signal Contact Tool HDM® Backplane 0622005703 Insertion Head for 144 Positions Termination Interface: Style Through Hole - Compliant Pin Extraction Tool 0621001000 Electrical Current - Maximum per Contact Data Rate Real Signals (per 25mm) Voltage - Maximum 1A 1.0 Gbps 72 250V AC Material Info Reference - Drawing Numbers Packaging Specification PK-70873-0871 Product Specification PS-73780-999 Sales Drawing SD-73770-001 HDM and High Density Metric are trademarks of Amphenol Corporation This document was generated on 05/14/2010 PLEASE CHECK WWW.MOLEX.COM FOR LATEST PART INFORMATION

下载 PDF

73770-1300

1. 物料型号： - 型号：0737701300 - 状态：Active（活跃）

2. 器件简介： - 描述：2.00mm (.079") 间距 HDM® 板对板堆叠头，高垂直，SMC，封闭式末端选项，144路 - 产品家族：Backplane Connectors（背板连接器） - 系列：73770 - 应用：Backplane, Mezzanine（背板，夹层） - 组件类型：PCB Header（PCB头）

3. 引脚分配： - 列数：24 - 行数：6 - 开放引脚场的对数：N/A（文档中未提供）

4. 参数特性： - 物理电路（已加载）：144 - 最大电路数：144 - 颜色 - 树脂：黑色 - 耐用性（最大插拔次数）：200 - 阻燃性：94V-0 - 材料 - 金属：钹青铜 - 材料 - 镀层：接触区域金，尾部锡铅 - 材料 - 树脂：高温热塑性塑料 - PCB厚度推荐（英寸）：0.055 - PCB厚度推荐（毫米）：1.40

5. 功能详解： - 堆叠：是 - 表面贴装兼容（SMC）：是 - 工作温度范围：-55°C至+105°C

6. 应用信息： - 与73632 HDM PLUS® 板对板女儿卡插座和73780 HDM® 板对板女儿卡插座配合使用。

7. 封装信息： - 封装类型：Tube（管装） - 配合界面间距（英寸）：0.079 - 配合界面间距（毫米）：2.00

73770-1300 价格&库存

-> 查询更多价格&库存

很抱歉，暂时无法提供与“73770-1300”相匹配的价格&库存，您可以联系我们找货

免费人工找货

搜索历史

73770-1300

相关技术文章