73780-0247

73780-0247

  • 厂商:

    MOLEX8

  • 封装:

  • 描述:

    73780-0247 - 2.00mm (.079") Pitch HDM Board-to-Board Daughtercard Receptacle, Vertical, Signal Modul...

  • 详情介绍
  • 数据手册
  • 价格&库存
73780-0247 数据手册
This document was generated on 05/14/2010 PLEASE CHECK WWW.MOLEX.COM FOR LATEST PART INFORMATION Part Number: Status: Overview: Description: 0737800247 Active hdm 2.00mm (.079") Pitch HDM® Board-to-Board Daughtercard Receptacle, Vertical, Signal Module, 72 Circuits, Mounted Height 17.00mm (.669"), Pin Length 3.00mm (.118"), Solder Tail Documents: 3D Model Drawing (PDF) Test Summary (PDF) Product Specification PS-73780-999 (PDF) RoHS Certificate of Compliance (PDF) image - Reference only Series General Product Family Series Application Comments Component Type Overview Product Name Style Backplane Connectors 73780 Daughtercard, Mezzanine Solder Tail PCB Receptacle hdm HDM® N/A EU RoHS China RoHS ELV and RoHS Compliant REACH SVHC Contains SVHC: No Halogen-Free Status Not Reviewed Need more information on product environmental compliance? Email productcompliance@molex.com For a multiple part number RoHS Certificate of Compliance, click here Please visit the Contact Us section for any non-product compliance questions. Physical Circuits (Loaded) Circuits (maximum) Color - Resin Durability (mating cycles max) First Mate / Last Break Guide to Mating Part Keying to Mating Part Material - Metal Material - Plating Mating Material - Plating Termination Material - Resin Number of Columns Number of Pairs Number of Rows Orientation PC Tail Length (in) PC Tail Length (mm) PCB Locator PCB Retention PCB Thickness Recommended (in) PCB Thickness Recommended (mm) Packaging Type Pitch - Mating Interface (in) Pitch - Mating Interface (mm) Pitch - Term. Interface (in) Pitch - Term. Interface (mm) Plating min: Mating (µin) Plating min: Mating (µm) Plating min: Termination (µin) Plating min: Termination (µm) Polarized to PCB Stackable Surface Mount Compatible (SMC) 72 72 Black 250 No No None Copper-Nickel-Tin Gold Tin High Temperature Thermoplastic 12 Open Pin Field 6 Vertical 0.118 In 3.00 mm No None 0.063 In 1.60 mm Tube 0.079 In 2.00 mm 0.079 In 2.00 mm 30 0.75 100 2.5 No Yes Yes Search Parts in this Series 73780Series Mates With HDM® Board-to-Board Backplane Header 73642 , 73643 , 73644 , 73942 , 73943 , 73944 , 74349 , 74428. HDM® Board-toBoard Stacking Header 73769 , 73770 , 73782 , 73783 , 73771 Temperature Range - Operating Termination Interface: Style -55°C to +105°C Through Hole Electrical Current - Maximum per Contact Data Rate Real Signals (per 25mm) Shielded Voltage - Maximum 15A, 1A 1.0 Gbps 75 No 250V AC Solder Process Data Duration at Max. Process Temperature (seconds) Lead-free Process Capability Max. Cycles at Max. Process Temperature Process Temperature max. C 5 Wave Capable (TH only) 1 260 Material Info Reference - Drawing Numbers Packaging Specification PK-70873-0872 Product Specification PS-73780-999 Sales Drawing SD-73780-004 HDM and High Density Metric are trademarks of Amphenol Corporation This document was generated on 05/14/2010 PLEASE CHECK WWW.MOLEX.COM FOR LATEST PART INFORMATION
73780-0247
1. 物料型号: - 型号:0737800247 - 状态:Active

2. 器件简介: - 描述:2.00mm (.079") 间距HDM®板对板母卡插座,垂直安装,信号模块,72路,安装高度17.00mm (.669"),引脚长度3.00mm (.118"),焊尾。

3. 引脚分配: - 引脚数量:72路 - 引脚间距:2.00mm (.079") - 引脚长度:3.00mm (.118")

4. 参数特性: - 温度范围:-55°C至+105°C - 最大电流每接触点:15A(1A) - 数据速率:1.0 Gbps - 屏蔽电压最大值:75V - 焊接过程数据:5秒内最大处理温度260°C,无铅焊接能力

5. 功能详解: - 该连接器为板对板连接,具有高密度、高可靠性的特点,适用于需要高数据传输速率和高电流承载能力的应用。

6. 应用信息: - 适用于HDM®板对板背板插座73642、73643、73644、73942、73943、73944、74349、74428。HDM®板对板堆叠插座73769、73770、73782、73783、73771。

7. 封装信息: - 封装类型:垂直安装 - 引脚间距:2.00mm (.079") - 尾长:3.00mm (.118") - PCB定位:无 - PCB保持:有 - PCB厚度推荐:0.063in (1.60mm)、0.079in (2.00mm)
73780-0247 价格&库存

很抱歉,暂时无法提供与“73780-0247”相匹配的价格&库存,您可以联系我们找货

免费人工找货