73780-1265

厂商：
MOLEX8
封装：
描述：
73780-1265 - 2.00mm (.079") Pitch HDM® Board-to-Board Daughtercard Receptacle, Vertical, SignalModul...

数据手册：

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73780-1265 数据手册

This document was generated on 05/14/2010 PLEASE CHECK WWW.MOLEX.COM FOR LATEST PART INFORMATION Part Number: Status: Overview: Description: 0737801265 Active hdm 2.00mm (.079") Pitch HDM® Board-to-Board Daughtercard Receptacle, Vertical, Signal Module, 144 Circuits, Mounted Height 15.00mm (.591"), Pin Length 4.00mm (.157"), Solder Tail Documents: 3D Model Test Summary (PDF) Drawing (PDF) Product Specification PS-73780-999 (PDF) RoHS Certificate of Compliance (PDF) image - Reference only Series General Product Family Series Application Comments Component Type Overview Product Name Style Backplane Connectors 73780 Daughtercard, Mezzanine Solder Tail PCB Receptacle hdm HDM® N/A EU RoHS China RoHS ELV and RoHS Compliant REACH SVHC Contains SVHC: No Halogen-Free Status Not Reviewed Need more information on product environmental compliance? Email productcompliance@molex.com For a multiple part number RoHS Certificate of Compliance, click here Please visit the Contact Us section for any non-product compliance questions. Physical Circuits (Loaded) Circuits (maximum) Color - Resin Durability (mating cycles max) First Mate / Last Break Guide to Mating Part Keying to Mating Part Material - Metal Material - Plating Mating Material - Plating Termination Material - Resin Number of Columns Number of Pairs Number of Rows Orientation PC Tail Length (in) PC Tail Length (mm) PCB Locator PCB Retention PCB Thickness Recommended (in) PCB Thickness Recommended (mm) Packaging Type Pitch - Mating Interface (in) Pitch - Mating Interface (mm) Pitch - Term. Interface (in) Pitch - Term. Interface (mm) Plating min: Mating (µin) Plating min: Mating (µm) Plating min: Termination (µin) Plating min: Termination (µm) Polarized to PCB Stackable Surface Mount Compatible (SMC) 144 144 Black 250 No No None Copper-Nickel-Tin Gold Tin High Temperature Thermoplastic 24 Open Pin Field 6 Vertical 0.157 In 4.00 mm No None 0.063 In 1.60 mm Tube 0.079 In 2.00 mm 0.079 In 2.00 mm 30 0.75 100 2.5 No Yes Yes Search Parts in this Series 73780Series Mates With HDM® Board-to-Board Backplane Header 73642 , 73643 , 73644 , 73942 , 73943 , 73944 , 74349 , 74428. HDM® Board-toBoard Stacking Header 73769 , 73770 , 73782 , 73783 , 73771 Temperature Range - Operating Termination Interface: Style -55°C to +105°C Through Hole Electrical Current - Maximum per Contact Data Rate Real Signals (per 25mm) Shielded Voltage - Maximum 15A, 1A 1.0 Gbps 75 No 250V AC Solder Process Data Duration at Max. Process Temperature (seconds) Lead-free Process Capability Max. Cycles at Max. Process Temperature Process Temperature max. C 5 Wave Capable (TH only) 1 260 Material Info Reference - Drawing Numbers Product Specification PS-73780-999 Sales Drawing SD-73780-004 HDM and High Density Metric are trademarks of Amphenol Corporation This document was generated on 05/14/2010 PLEASE CHECK WWW.MOLEX.COM FOR LATEST PART INFORMATION

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73780-1265

1. 物料型号： - 型号：0737801265 - 状态：Active（活跃）

2. 器件简介： - 产品家族：Backplane Connectors - 系列：73780 - 应用：Daughtercard, Mezzanine（板对板女儿卡，夹层） - 组件类型：PCB Receptacle（PCB插座） - 概述：hdm 2.00mm (.079") 间距 HDM® 板对板母头插座，垂直安装，信号模块，144路，安装高度15.00mm (.591")，引脚长度4.00mm (.157")，焊尾。

3. 引脚分配： - 列数：24 - 行数：6 - 电路（已加载）：144 - 电路（最大）：144

4. 参数特性： - 颜色 - 树脂：黑色 - 耐久性（最大配对周期）：250 - 材料 - 金属：铜镍锡 - 材料 - 镀层配对：金 - 材料 - 镀层终止：锡 - 材料 - 树脂：高温热塑性塑料 - PCB厚度推荐（英寸）：0.063 - PCB厚度推荐（毫米）：1.60 - 配对接口间距（英寸）：0.079 - 配对接口间距（毫米）：2.00 - 终止接口间距（英寸）：0.079 - 终止接口间距（毫米）：2.00

5. 功能详解： - 操作温度范围：-55°C至+105°C - 电气特性：每个接触点最大电流15A，1A 1.0 Gbps数据速率 - 实信号（每25mm）屏蔽电压最大：75 - 无Halo（高频连接）：否 - 250V交流电 - 焊接过程数据：最大处理温度下持续时间5秒，无铅过程能力，波峰焊接能力（仅限TH）

6. 应用信息： - 与HDM®板对板背板头73642、73643、73644、73942、73943、73944、74349、74428兼容。 - 与HDM®板对板堆叠头73769、73770、73782、73783、73771兼容。

7. 封装信息： - 封装类型：管装 - 引脚长度（英寸）：0.157 - 引脚长度（毫米）：4.00

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