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73780-2944

73780-2944

  • 厂商:

    MOLEX8

  • 封装:

  • 描述:

    73780-2944 - 2.00mm (.079) Pitch HDM® Board-to-Board Daughtercard Receptacle, Vertical, Signal Modul...

  • 详情介绍
  • 数据手册
  • 价格&库存
73780-2944 数据手册
This document was generated on 05/14/2010 PLEASE CHECK WWW.MOLEX.COM FOR LATEST PART INFORMATION Part Number: Status: Overview: Description: 0737802944 Active hdm 2.00mm (.079") Pitch HDM® Board-to-Board Daughtercard Receptacle, Vertical, Signal Module, 72 Circuits, Mounted Height 14.00mm (.551"), Pin Length 3.00mm (.118"), Lead Free Documents: Drawing (PDF) Product Specification PS-73780-999 (PDF) RoHS Certificate of Compliance (PDF) Series image - Reference only General Product Family Series Application Comments Component Type Overview Product Name Style Backplane Connectors 73780 Daughtercard, Mezzanine Press Fit Tail PCB Receptacle hdm HDM® N/A EU RoHS China RoHS ELV and RoHS Compliant REACH SVHC Contains SVHC: No Halogen-Free Status Not Reviewed Need more information on product environmental compliance? Email productcompliance@molex.com For a multiple part number RoHS Certificate of Compliance, click here Please visit the Contact Us section for any non-product compliance questions. Physical Circuits (Loaded) Circuits (maximum) Color - Resin Durability (mating cycles max) First Mate / Last Break Guide to Mating Part Keying to Mating Part Material - Metal Material - Plating Mating Material - Plating Termination Material - Resin Number of Columns Number of Pairs Number of Rows Orientation PC Tail Length (in) PC Tail Length (mm) PCB Locator PCB Retention PCB Thickness Recommended (in) PCB Thickness Recommended (mm) Packaging Type Pitch - Mating Interface (in) Pitch - Mating Interface (mm) Pitch - Term. Interface (in) Pitch - Term. Interface (mm) Plating min: Mating (µin) Plating min: Mating (µm) Plating min: Termination (µin) Plating min: Termination (µm) Polarized to PCB Stackable Surface Mount Compatible (SMC) Temperature Range - Operating 72 72 Black 250 No No None Copper-Nickel-Tin Gold Tin High Temperature Thermoplastic 24 Open Pin Field 6 Vertical 0.118 In 3.00 mm No None 0.063 In 1.60 mm Tube 0.079 In 2.00 mm 0.079 In 2.00 mm 30 0.75 35 0.88 No Yes Yes -55°C to +105°C Search Parts in this Series 73780Series Mates With HDM® Board-to-Board Backplane Header 73642 , 73643 , 73644 , 73942 , 73943 , 73944 , 74349 , 74428. HDM® Board-toBoard Stacking Header 73769 , 73770 , 73782 , 73783 , 73771 Termination Interface: Style Through Hole - Compliant Pin Electrical Current - Maximum per Contact Data Rate Real Signals (per 25mm) Shielded Voltage - Maximum 15A, 1A 1.0 Gbps 75 No 250V AC Material Info Reference - Drawing Numbers Product Specification PS-73780-999 Sales Drawing SD-73780-001 HDM and High Density Metric are trademarks of Amphenol Corporation This document was generated on 05/14/2010 PLEASE CHECK WWW.MOLEX.COM FOR LATEST PART INFORMATION
73780-2944
1. 物料型号: - 型号:0737802944 - 状态:Active(活跃)

2. 器件简介: - 描述:HDM 2.00mm (.079") 间距 HDM® 板对板母头,垂直,信号模块,72路,安装高度14.00mm (.551"),引脚长度3.00mm (.118"),无铅。 - 产品系列:73780 - 应用:子卡,夹层卡 - 组件类型:PCB插座

3. 引脚分配: - 电路(已加载):72 - 电路(最大):72 - 列数:24 - 行数:6 - 引脚方向:垂直

4. 参数特性: - 颜色 - 树脂:黑色 - 耐久性(最大插拔次数):250 - 材料 - 金属:铜镍锡 - 材料 - 镀层配合:金 - 材料 - 镀层终止:锡 - 材料 - 树脂:高温热塑性塑料 - 操作温度范围:-55°C至+105°C

5. 功能详解: - 该器件为HDM®板对板母头,适用于子卡和夹层卡应用,具有72个电路,垂直安装,无铅制程。

6. 应用信息: - 配合使用的HDM®板对板背板公头型号包括73642、73643、73644、73942、73943、73944、74349、74428。HDM®板对板堆叠公头型号包括73769、73770、73782、73783、73771。

7. 封装信息: - 配合界面间距:2.00mm(0.079英寸) - 引脚长度:3.00mm(0.118英寸) - PCB厚度推荐:1.60mm(0.063英寸) - 包装类型:管装
73780-2944 价格&库存

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