73780-3245

73780-3245

  • 厂商:

    MOLEX8

  • 封装:

  • 描述:

    73780-3245 - 2.00mm (.079") Pitch HDM® Board-to-Board Daughtercard Receptacle, Vertical, SignalModul...

  • 详情介绍
  • 数据手册
  • 价格&库存
73780-3245 数据手册
This document was generated on 05/14/2010 PLEASE CHECK WWW.MOLEX.COM FOR LATEST PART INFORMATION Part Number: Status: Overview: Description: 0737803245 Active hdm 2.00mm (.079") Pitch HDM® Board-to-Board Daughtercard Receptacle, Vertical, Signal Module, 144 Circuits, Mounted Height 15.00mm (.591"), Pin Length 3.00mm (.118"), Press Fit Documents: 3D Model Drawing (PDF) Product Specification PS-73780-999 (PDF) RoHS Certificate of Compliance (PDF) image - Reference only Series General Product Family Series Application Comments Component Type Overview Product Name Style Backplane Connectors 73780 Daughtercard, Mezzanine Press Fit Tail PCB Receptacle hdm HDM® N/A EU RoHS China RoHS RoHS Compliant by Exemption REACH SVHC Contains SVHC: No Halogen-Free Status Not Reviewed Need more information on product environmental compliance? Email productcompliance@molex.com For a multiple part number RoHS Certificate of Compliance, click here Please visit the Contact Us section for any non-product compliance questions. Physical Circuits (Loaded) Circuits (maximum) Color - Resin Durability (mating cycles max) First Mate / Last Break Guide to Mating Part Keying to Mating Part Material - Metal Material - Plating Mating Material - Plating Termination Material - Resin Number of Columns Number of Pairs Number of Rows Orientation PC Tail Length (in) PC Tail Length (mm) PCB Locator PCB Retention PCB Thickness Recommended (in) PCB Thickness Recommended (mm) Packaging Type Pitch - Mating Interface (in) Pitch - Mating Interface (mm) Pitch - Term. Interface (in) Pitch - Term. Interface (mm) Plating min: Mating (µin) Plating min: Mating (µm) Plating min: Termination (µin) Plating min: Termination (µm) Polarized to PCB Stackable Surface Mount Compatible (SMC) Temperature Range - Operating 144 144 Black 250 No No None Copper-Nickel-Tin Gold Tin-Lead High Temperature Thermoplastic 24 Open Pin Field 6 Vertical 0.118 In 3.00 mm No None 0.063 In 1.60 mm Tube 0.079 In 2.00 mm 0.079 In 2.00 mm 30 0.75 35 0.88 No Yes Yes -55°C to +105°C Search Parts in this Series 73780Series Mates With HDM® Board-to-Board Backplane Header 73642 , 73643 , 73644 , 73942 , 73943 , 73944 , 74349 , 74428. HDM® Board-toBoard Stacking Header 73769 , 73770 , 73782 , 73783 , 73771 Termination Interface: Style Through Hole - Compliant Pin Electrical Current - Maximum per Contact Data Rate Real Signals (per 25mm) Shielded Voltage - Maximum 15A, 1A 1.0 Gbps 75 No 250V AC Material Info Reference - Drawing Numbers Product Specification PS-73780-999 Sales Drawing SD-73780-001 HDM and High Density Metric are trademarks of Amphenol Corporation This document was generated on 05/14/2010 PLEASE CHECK WWW.MOLEX.COM FOR LATEST PART INFORMATION
73780-3245
1. 物料型号: - Part Number: 0737803245

2. 器件简介: - 产品名称:HDMR - 产品家族:Backplane Connectors - 系列:73780 - 应用:Daughtercard, Mezzanine - 概述:Active hdm 2.00mm (.079") Pitch HDM® Board-to-Board Daughtercard Receptacle, Vertical, Signal Module, 144 Circuits

3. 引脚分配: - 引脚数量:144 - 列数:24 - 行数:6

4. 参数特性: - 颜色 - 树脂:黑色 - 耐久性(最大插拔次数):250 - 材料 - 金属:Copper-Nickel-Tin com - 材料 - 镀层接触:Gold - 材料 - 镀层终止:Tin-Lead - 材料 - 树脂:高温热塑性塑料 - 推荐PCB厚度:1.60 mm (0.063 In) - 接口 - 接触界面间距:2.00 mm (0.079 In) - 电压 - 最大:250V AC - 电流 - 每个接触最大:15A, 1A - 数据速率:1.0 Gbps - 屏蔽:75 - 操作温度范围:-55°C 至 +105°C

5. 功能详解: - 该器件为HDM® Board-to-Board Daughtercard Receptacle,垂直安装,信号模块,具有144个电路,安装高度为15.00mm (0.591"),引脚长度为3.00mm (0.118")。适用于背板连接器产品家族,适用于女儿卡和中间卡应用。

6. 应用信息: - 适用于背板连接器产品家族,适用于女儿卡和中间卡应用。

7. 封装信息: - 封装类型:Tube - 极化到PCB:否 - 堆叠:是 - 表面安装兼容(SMC):是
73780-3245 价格&库存

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