73780-3246

73780-3246

  • 厂商:

    MOLEX8

  • 封装:

  • 描述:

    73780-3246 - 2.00mm (.079") Pitch HDM Board-to-Board Daughtercard Receptacle, Vertical, Signal Modul...

  • 详情介绍
  • 数据手册
  • 价格&库存
73780-3246 数据手册
This document was generated on 05/14/2010 PLEASE CHECK WWW.MOLEX.COM FOR LATEST PART INFORMATION Part Number: Status: Overview: Description: 0737803246 Active hdm 2.00mm (.079") Pitch HDM® Board-to-Board Daughtercard Receptacle, Vertical, Signal Module, 144 Circuits, Mounted Height 16.00mm (.630"), Pin Length 3.00mm (.118"), Press Fit Documents: 3D Model Drawing (PDF) Product Specification PS-73780-999 (PDF) RoHS Certificate of Compliance (PDF) image - Reference only Series General Product Family Series Application Comments Component Type Overview Product Name Style Backplane Connectors 73780 Daughtercard, Mezzanine Press Fit Tail PCB Receptacle hdm HDM® N/A EU RoHS China RoHS RoHS Compliant by Exemption REACH SVHC Contains SVHC: No Halogen-Free Status Halogen-Free Need more information on product environmental compliance? Email productcompliance@molex.com For a multiple part number RoHS Certificate of Compliance, click here Please visit the Contact Us section for any non-product compliance questions. Physical Circuits (Loaded) Circuits (maximum) Color - Resin Durability (mating cycles max) First Mate / Last Break Guide to Mating Part Keying to Mating Part Material - Metal Material - Plating Mating Material - Plating Termination Material - Resin Number of Columns Number of Pairs Number of Rows Orientation PC Tail Length (in) PC Tail Length (mm) PCB Locator PCB Retention PCB Thickness Recommended (in) PCB Thickness Recommended (mm) Packaging Type Pitch - Mating Interface (in) Pitch - Mating Interface (mm) Pitch - Term. Interface (in) Pitch - Term. Interface (mm) Plating min: Mating (µin) Plating min: Mating (µm) Plating min: Termination (µin) Plating min: Termination (µm) Polarized to PCB Stackable Surface Mount Compatible (SMC) Temperature Range - Operating 144 144 Black 250 No No None Copper-Nickel-Tin Gold Tin-Lead High Temperature Thermoplastic 24 Open Pin Field 6 Vertical 0.118 In 3.00 mm No None 0.063 In 1.60 mm Tube 0.079 In 2.00 mm 0.079 In 2.00 mm 30 0.75 35 0.88 No Yes Yes -55°C to +105°C Search Parts in this Series 73780Series Mates With HDM® Board-to-Board Backplane Header 73642 , 73643 , 73644 , 73942 , 73943 , 73944 , 74349 , 74428. HDM® Board-toBoard Stacking Header 73769 , 73770 , 73782 , 73783 , 73771 Termination Interface: Style Through Hole - Compliant Pin Electrical Current - Maximum per Contact Data Rate Real Signals (per 25mm) Shielded Voltage - Maximum 15A, 1A 1.0 Gbps 75 No 250V AC Material Info Reference - Drawing Numbers Product Specification PS-73780-999 Sales Drawing SD-73780-001 HDM and High Density Metric are trademarks of Amphenol Corporation This document was generated on 05/14/2010 PLEASE CHECK WWW.MOLEX.COM FOR LATEST PART INFORMATION
73780-3246
物料型号: - 型号:0737803246 - 状态:Active(活跃)

器件简介: - 产品家族:Backplane Connectors(背板连接器) - 系列:73780 - 应用:Daughtercard, Mezzanine(子卡,夹层) - 组件类型:PCB Receptacle(PCB插座) - 概述:hdm 2.00mm (.079") 间距 HDM® 板对板母头插座,垂直,信号模块,144路,安装高度16.00mm (.630"),引脚长度3.00mm (.118"),压配合尾

引脚分配: - 电路数(已加载):144 - 电路数(最大):144 - 列数:24 - 行数:6 - 引脚场:Open Pin Field(开放引脚场)

参数特性: - 颜色 - 树脂:黑色 - 耐久性(最大插拔次数):250 - 金属接点材料:铜镍锡合金 - 接点镀层:金 - 终止镀层:锡铅 - 树脂材料:高温热塑性塑料 - 推荐PCB厚度:1.60mm - 配合界面间距:2.00mm - 终止界面间距:2.00mm - 接点镀层最小厚度:0.75um(配合)/0.88um(终止) - 操作温度范围:-55°C至+105°C

功能详解应用信息: - 与HDM®板对板背板母头73642、73643、73644、73942、73943、73944、74349、74428配合使用。HDM®板对板堆叠母头73769、73770、73782、73783、73771。 - 电气特性:最大电流每接触点15A,1A;数据速率1.0 Gbps;屏蔽电压最大值250V AC。

封装信息: - 封装类型:Tube(管装) - 尾长(PC尾长):3.00mm(英寸0.118 In)
73780-3246 价格&库存

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