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73780-3253

73780-3253

  • 厂商:

    MOLEX8

  • 封装:

  • 描述:

    73780-3253 - 2.00mm (.079") Pitch HDM® Board-to-Board Daughtercard Receptacle, Vertical, SignalModul...

  • 详情介绍
  • 数据手册
  • 价格&库存
73780-3253 数据手册
This document was generated on 05/25/2010 PLEASE CHECK WWW.MOLEX.COM FOR LATEST PART INFORMATION Part Number: Status: Overview: Description: 0737803253 Active hdm 2.00mm (.079") Pitch HDM® Board-to-Board Daughtercard Receptacle, Vertical, Signal Module, 144 Circuits, Mounted Height 13.00mm (.512"), Pin Length 3.50mm (.138"), Press Fit Documents: 3D Model Drawing (PDF) Product Specification PS-73780-999 (PDF) RoHS Certificate of Compliance (PDF) image - Reference only Series General Product Family Series Application Comments Component Type Overview Product Name Style Backplane Connectors 73780 Daughtercard, Mezzanine Press Fit Tail PCB Receptacle hdm HDM® N/A EU RoHS China RoHS RoHS Compliant by Exemption REACH SVHC Contains SVHC: No Halogen-Free Status Halogen-Free Need more information on product environmental compliance? Email productcompliance@molex.com For a multiple part number RoHS Certificate of Compliance, click here Please visit the Contact Us section for any non-product compliance questions. Physical Circuits (Loaded) Circuits (maximum) Color - Resin Durability (mating cycles max) First Mate / Last Break Guide to Mating Part Keying to Mating Part Material - Metal Material - Plating Mating Material - Plating Termination Material - Resin Number of Columns Number of Pairs Number of Rows Orientation PC Tail Length (in) PC Tail Length (mm) PCB Locator PCB Retention PCB Thickness Recommended (in) PCB Thickness Recommended (mm) Packaging Type Pitch - Mating Interface (in) Pitch - Mating Interface (mm) Pitch - Term. Interface (in) Pitch - Term. Interface (mm) Plating min: Mating (µin) Plating min: Mating (µm) Plating min: Termination (µin) Plating min: Termination (µm) Polarized to PCB Stackable Surface Mount Compatible (SMC) Temperature Range - Operating 144 144 Black 250 No No None Copper-Nickel-Tin Gold Tin-Lead High Temperature Thermoplastic 24 Open Pin Field 6 Vertical 0.138 In 3.50 mm No None 0.063 In 1.60 mm Tube 0.079 In 2.00 mm 0.079 In 2.00 mm 30 0.75 35 0.88 No Yes Yes -55°C to +105°C Search Parts in this Series 73780Series Mates With HDM® Board-to-Board Backplane Header 73642 , 73643 , 73644 , 73942 , 73943 , 73944 , 74349 , 74428. HDM® Board-toBoard Stacking Header 73769 , 73770 , 73782 , 73783 , 73771 Termination Interface: Style Through Hole - Compliant Pin Electrical Current - Maximum per Contact Data Rate Real Signals (per 25mm) Shielded Voltage - Maximum 15A, 1A 1.0 Gbps 75 No 250V AC Material Info Reference - Drawing Numbers Product Specification PS-73780-999 Sales Drawing SD-73780-001 HDM and High Density Metric are trademarks of Amphenol Corporation This document was generated on 05/25/2010 PLEASE CHECK WWW.MOLEX.COM FOR LATEST PART INFORMATION
73780-3253
1. 物料型号: - 型号:0737803253 - 状态:Active(活跃)

2. 器件简介: - 描述:HDM 2.00mm (.079") 间距 HDM® 板对板母卡插座,垂直安装,信号模块,144路,安装高度13.00mm (.512"),引脚长度3.50mm (.138"),压配合尾。 - 产品规格:PS-73780-999 (PDF) - 产品家族:Backplane Connectors(背板连接器) - 系列:73780 - 应用:Daughtercard, Mezzanine(子卡,夹层) - 组件类型:PCB Receptacle(PCB插座)

3. 引脚分配: - 引脚数量:144 - 列数:24 - 行数:6 - 引脚间距:2.00mm(.079")

4. 参数特性: - 颜色 - 树脂:黑色 - 耐久性(最大插拔次数):250次 - 材料 - 金属:铜镍锡合金 - 材料 - 镀层 - 配合:金 - 材料 - 镀层 - 终止:锡铅 - 材料 - 树脂:高温热塑性塑料 - PCB厚度推荐:1.60mm(0.063") - 配合界面间距:2.00mm(.079") - 终止界面间距:2.00mm(.079") - 镀层最小厚度 - 配合:0.75um(30uin) - 镀层最小厚度 - 终止:0.88um(35uin)

5. 功能详解应用信息: - 配合尾:压配合尾 - 堆叠:是 - 表面贴装兼容(SMC):是 - 工作温度范围:-55°C至+105°C - 配合件:HDM® 板对板背板插座 73642, 73643, 73644, 73942, 73943, 73944, 74349, 74428;HDM® 板对板堆叠插座 73769, 73770, 73782, 73783, 73771

6. 封装信息: - 封装类型:Tube(管装)
73780-3253 价格&库存

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