73780-3864

73780-3864

  • 厂商:

    MOLEX8

  • 封装:

  • 描述:

    73780-3864 - 2.00mm (.079") Pitch HDM® Board-to-Board Daughtercard Receptacle, Vertical, SignalModul...

  • 详情介绍
  • 数据手册
  • 价格&库存
73780-3864 数据手册
This document was generated on 05/14/2010 PLEASE CHECK WWW.MOLEX.COM FOR LATEST PART INFORMATION Part Number: Status: Overview: Description: 0737803864 Active hdm 2.00mm (.079") Pitch HDM® Board-to-Board Daughtercard Receptacle, Vertical, Signal Module, 144 Circuits, Mounted Height 14.00mm (.551"), Pin Length 4.00mm (.157"), Press Fit Documents: Drawing (PDF) Product Specification PS-73780-999 (PDF) RoHS Certificate of Compliance (PDF) Series image - Reference only General Product Family Series Application Comments Component Type Overview Product Name Style Backplane Connectors 73780 Daughtercard, Mezzanine Part Number and Date Code Markings PCB Receptacle hdm HDM® N/A EU RoHS China RoHS ELV and RoHS Compliant REACH SVHC Contains SVHC: No Halogen-Free Status Not Reviewed Need more information on product environmental compliance? Email productcompliance@molex.com For a multiple part number RoHS Certificate of Compliance, click here Please visit the Contact Us section for any non-product compliance questions. Physical Circuits (Loaded) Circuits (maximum) Color - Resin Durability (mating cycles max) First Mate / Last Break Guide to Mating Part Keying to Mating Part Material - Metal Material - Resin Number of Columns Number of Pairs Number of Rows Orientation PC Tail Length (in) PC Tail Length (mm) PCB Locator PCB Retention PCB Thickness Recommended (in) PCB Thickness Recommended (mm) Packaging Type Pitch - Mating Interface (in) Pitch - Mating Interface (mm) Pitch - Term. Interface (in) Pitch - Term. Interface (mm) Plating min: Mating (µin) Plating min: Mating (µm) Plating min: Termination (µin) Plating min: Termination (µm) Polarized to PCB Stackable Surface Mount Compatible (SMC) Temperature Range - Operating Termination Interface: Style 144 144 Black 250 No No None Copper-Nickel-Tin High Temperature Thermoplastic 24 Open Pin Field 6 Vertical 0.157 In 4.00 mm No None 0.063 In 1.60 mm Tube 0.079 In 2.00 mm 0.079 In 2.00 mm 30 0.75 35 0.88 No Yes Yes -55°C to +105°C Through Hole - Compliant Pin Search Parts in this Series 73780Series Mates With HDM® Board-to-Board Backplane Header 73642 , 73643 , 73644 , 73942 , 73943 , 73944 , 74349 , 74428. HDM® Board-toBoard Stacking Header 73769 , 73770 , 73782 , 73783 , 73771 Electrical Current - Maximum per Contact Data Rate Real Signals (per 25mm) Shielded Voltage - Maximum 15A, 1A 1.0 Gbps 75 No 250V AC Material Info Reference - Drawing Numbers Product Specification PS-73780-999 Sales Drawing SD-73780-001 HDM and High Density Metric are trademarks of Amphenol Corporation This document was generated on 05/14/2010 PLEASE CHECK WWW.MOLEX.COM FOR LATEST PART INFORMATION
73780-3864
1. 物料型号: - 型号:0737803864 - 状态:Active(活跃)

2. 器件简介: - 概述:2.00mm (0.079") 间距 HDM® 板对板女座,垂直式,信号模块,144路,安装高度 14.00mm (0.551"),引脚长度 4.00mm (0.157"),压配合。 - 产品系列:73780 - 应用:Daughtercard, Mezzanine(子卡,夹层) - 组件类型:PCB Receptacle(PCB插座) - 产品名称:HDMR - 物理参数:144路(最大值也是144路),黑色树脂,最大耐久性为250次插拔,材料为铜镍锡和高温热塑性塑料。

3. 引脚分配: - 列数:24 - 行数:6 - 引脚配置:开放式引脚场

4. 参数特性: - 操作温度范围:-55°C至+105°C - 电气参数:每个接触点最大电流15A,数据速率1.0 Gbps,屏蔽电压最大值75 - 引脚镀层:最小镀层厚度为30微英寸(mating)和35微英寸(termination)

5. 功能详解: - 该连接器为HDM®板对板连接器,适用于子卡和夹层应用,支持高达1.0 Gbps的数据速率,并且每个接触点能承受最大15A的电流。 - 支持堆叠(Stackable),兼容表面贴装(SMC)。

6. 应用信息: - 适用于需要高密度连接的应用,如子卡和夹层之间的连接。

7. 封装信息: - 推荐PCB厚度:1.60mm(0.063英寸) - 引脚间距:2.00mm(0.079英寸) - 包装类型:管装
73780-3864 价格&库存

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