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73780-4143

73780-4143

  • 厂商:

    MOLEX8

  • 封装:

  • 描述:

    73780-4143 - 2.00mm (.079") Pitch HDM® Board-to-Board Daughtercard Receptacle, Vertical, SignalModul...

  • 详情介绍
  • 数据手册
  • 价格&库存
73780-4143 数据手册
This document was generated on 05/14/2010 PLEASE CHECK WWW.MOLEX.COM FOR LATEST PART INFORMATION Part Number: Status: Overview: Description: 0737804143 Active hdm 2.00mm (.079") Pitch HDM® Board-to-Board Daughtercard Receptacle, Vertical, Signal Module, 60 Circuits, Mounted Height 13.00mm (.511"), Pin Length 3.00mm (.118"), Press Fit Documents: Drawing (PDF) RoHS Certificate of Compliance (PDF) Series image - Reference only Backplane Connectors 73780 Daughtercard, Mezzanine Press Fit Tail PCB Receptacle hdm HDM® N/A EU RoHS Not RoHS Compliant REACH SVHC Not Reviewed Halogen-Free Status Not Reviewed China RoHS General Product Family Series Application Comments Component Type Overview Product Name Style Physical Circuits (Loaded) Circuits (maximum) Color - Resin Durability (mating cycles max) First Mate / Last Break Guide to Mating Part Keying to Mating Part Material - Metal Material - Plating Mating Material - Plating Termination Material - Resin Number of Columns Number of Pairs Number of Rows Orientation PC Tail Length (in) PC Tail Length (mm) PCB Locator PCB Retention PCB Thickness Recommended (in) PCB Thickness Recommended (mm) Packaging Type Pitch - Mating Interface (in) Pitch - Mating Interface (mm) Pitch - Term. Interface (in) Pitch - Term. Interface (mm) Plating min: Mating (µin) Plating min: Mating (µm) Plating min: Termination (µin) Plating min: Termination (µm) Polarized to PCB Stackable Surface Mount Compatible (SMC) Temperature Range - Operating Termination Interface: Style 60 60 Black 250 No No None Copper-Nickel-Tin Gold Tin-Lead High Temperature Thermoplastic 12 Open Pin Field 6 Vertical 0.118 In 3.00 mm No None 0.063 In 1.60 mm Tube 0.079 In 2.00 mm 0.079 In 2.00 mm 30 0.75 35 0.88 No No Yes -55°C to +105°C Through Hole - Compliant Pin Need more information on product environmental compliance? Email productcompliance@molex.com For a multiple part number RoHS Certificate of Compliance, click here Please visit the Contact Us section for any non-product compliance questions. Search Parts in this Series 73780Series Mates With HDM® Board-to-Board Backplane Header 73642 , 73643 , 73644 , 73942 , 73943 , 73944 , 74349 , 74428. HDM® Board-toBoard Stacking Header 73769 , 73770 , 73782 , 73783 , 73771 Electrical Current - Maximum per Contact Data Rate Real Signals (per 25mm) Shielded Voltage - Maximum 1A 1.0 Gbps 75 No 250V AC Material Info Reference - Drawing Numbers Sales Drawing SD-73780-003 HDM and High Density Metric are trademarks of Amphenol Corporation This document was generated on 05/14/2010 PLEASE CHECK WWW.MOLEX.COM FOR LATEST PART INFORMATION
73780-4143
1. 物料型号: - 型号:0737804143 - 状态:Active(活跃)

2. 器件简介: - 产品家族:Backplane Connectors(背板连接器) - 系列:73780 - 应用:Daughtercard, Mezzanine(子卡,夹层) - 组件类型:PCB Receptacle(PCB插座) - 概述:HDM 2.00mm (.079") 间距 HDM® 板对板母头插座,垂直安装,信号模块,60路,安装高度13.00mm (.511"),引脚长度3.00mm (.118"),压配合尾。

3. 引脚分配: - 电路(已加载):60 - 列数:12 - 行数:6 - 引脚方向:垂直

4. 参数特性: - 颜色 - 树脂:黑色 - 耐久性(最大插拔次数):250 - 材料 - 金属:铜镍锡 - 材料 - 镀层配合:金 - 材料 - 镀层终止:锡铅 - 材料 - 树脂:高温热塑性塑料 - PCB厚度推荐(英寸):0.063 In - PCB厚度推荐(毫米):1.60 mm - 配合界面间距(英寸):0.079 In - 配合界面间距(毫米):2.00 mm

5. 功能详解: - 该产品为HDM®板对板母头插座,适用于子卡和夹层应用,具有60个电路,垂直安装,压配合尾设计。

6. 应用信息: - 与HDM®板对板背板母头73642、73643、73644、73942、73943、73944、74349、74428配合使用。HDM®板对板堆叠母头73769、73770、73782、73783、73771。

7. 封装信息: - 包装类型:管装 - 配合界面间距:2.00 mm - 终止界面风格:通孔 - 合规引脚
73780-4143 价格&库存

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