73780-5143

73780-5143

  • 厂商:

    MOLEX8

  • 封装:

  • 描述:

    73780-5143 - 2.00mm (.079") Pitch HDM® Board-to-Board Daughtercard Receptacle, Vertical, SignalModul...

  • 详情介绍
  • 数据手册
  • 价格&库存
73780-5143 数据手册
This document was generated on 05/14/2010 PLEASE CHECK WWW.MOLEX.COM FOR LATEST PART INFORMATION Part Number: Status: Overview: Description: 0737805143 Active hdm 2.00mm (.079") Pitch HDM® Board-to-Board Daughtercard Receptacle, Vertical, Signal Module, 120 Circuits, Mounted Height 13.00mm (.511"), Pin Length 3.00mm (.118"), Press Fit Documents: Drawing (PDF) RoHS Certificate of Compliance (PDF) Series image - Reference only Backplane Connectors 73780 Daughtercard, Mezzanine Press Fit Tail PCB Receptacle hdm HDM® N/A EU RoHS Not RoHS Compliant REACH SVHC Not Reviewed Halogen-Free Status Not Reviewed China RoHS General Product Family Series Application Comments Component Type Overview Product Name Style Physical Circuits (Loaded) Circuits (maximum) Color - Resin Durability (mating cycles max) First Mate / Last Break Guide to Mating Part Keying to Mating Part Material - Metal Material - Plating Mating Material - Plating Termination Material - Resin Number of Columns Number of Pairs Number of Rows Orientation PC Tail Length (in) PC Tail Length (mm) PCB Locator PCB Retention PCB Thickness Recommended (in) PCB Thickness Recommended (mm) Packaging Type Pitch - Mating Interface (in) Pitch - Mating Interface (mm) Pitch - Term. Interface (in) Pitch - Term. Interface (mm) Plating min: Mating (µin) Plating min: Mating (µm) Plating min: Termination (µin) Plating min: Termination (µm) Polarized to PCB Stackable Surface Mount Compatible (SMC) Temperature Range - Operating Termination Interface: Style 120 120 Black 250 No No None Copper-Nickel-Tin Gold Tin-Lead High Temperature Thermoplastic 24 Open Pin Field 6 Vertical 0.118 In 3.00 mm No None 0.063 In 1.60 mm Tube 0.079 In 2.00 mm 0.079 In 2.00 mm 30 0.75 35 0.88 No No Yes -55°C to +105°C Through Hole - Compliant Pin Need more information on product environmental compliance? Email productcompliance@molex.com For a multiple part number RoHS Certificate of Compliance, click here Please visit the Contact Us section for any non-product compliance questions. Search Parts in this Series 73780Series Mates With HDM® Board-to-Board Backplane Header 73642 , 73643 , 73644 , 73942 , 73943 , 73944 , 74349 , 74428. HDM® Board-toBoard Stacking Header 73769 , 73770 , 73782 , 73783 , 73771 Electrical Current - Maximum per Contact Data Rate Real Signals (per 25mm) Shielded Voltage - Maximum 1A 1.0 Gbps 75 No 250V AC Material Info Reference - Drawing Numbers Sales Drawing SD-73780-003 HDM and High Density Metric are trademarks of Amphenol Corporation This document was generated on 05/14/2010 PLEASE CHECK WWW.MOLEX.COM FOR LATEST PART INFORMATION
73780-5143
1. 物料型号: - 型号:0737805143 - 状态:Active(活跃)

2. 器件简介: - 产品家族:Backplane Connectors(背板连接器) - 系列:73780 - 应用:Daughtercard, Mezzanine(子卡,夹层) - 评论:Press Fit Tail(压配合尾) - 组件类型:PCB Receptacle(PCB插座)

3. 引脚分配: - 电路(已加载):120 - 电路(最大):120 - 列数:24 - 行数:6 - 方向:Vertical(垂直)

4. 参数特性: - 颜色 - 树脂:Black(黑色) - 耐久性(最大插配周期):250 - 首次配对/最后断开:No(否) - 配对部分的导向:No(否) - 配对部分的键控:None(无) - 材料 - 金属:Copper-Nickel-Tin(铜-镍-锡) - 材料 - 镀层配对:Gold(金) - 材料 - 镀层终止:Tin-Lead(锡-铅) - 材料 - 树脂:High Temperature Thermoplastic(高温热塑性塑料) - PC尾长(英寸):0.118 In - PC尾长(毫米):3.00 mm - PCB厚度推荐(英寸):0.063 In - PCB厚度推荐(毫米):1.60 mm - 间距 - 配对接口(英寸):0.079 In - 间距 - 配对接口(毫米):2.00 mm - 镀层最小:配对(uin):30 - 镀层最小:配对(um):0.75 - 镀层最小:终止(uin):35 - 镀层最小:终止(um):0.88

5. 功能详解: - 该产品为HDM®板对板女儿卡插座,垂直安装,信号模块,120路,安装高度13.00mm(0.511"),引脚长度3.00mm(0.118"),压配合。

6. 应用信息: - 适用于子卡和夹层应用。

7. 封装信息: - 包装类型:Tube(管装) - 表面安装兼容(SMC):Yes(是)
73780-5143 价格&库存

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