73782-7300

This document was generated on 05/14/2010 PLEASE CHECK WWW.MOLEX.COM FOR LATEST PART INFORMATION Part Number: Status: Overview: Description: 0737827300 Active hdm 2.00mm (.079") Pitch HDM® Board-to-Board Stacking Header, High Rise Vertical, SMC, Closed End Option, 144 Circuits Documents: 3D Model Drawing (PDF) Product Specification PS-73780-999 (PDF) RoHS Certificate of Compliance (PDF) Series image - Reference only LR19980 E29179 EU RoHS China RoHS ELV and RoHS Compliant REACH SVHC Contains SVHC: No Halogen-Free Status Not Reviewed Need more information on product environmental compliance? Email productcompliance@molex.com For a multiple part number RoHS Certificate of Compliance, click here Please visit the Contact Us section for any non-product compliance questions. Agency Certification CSA UL General Product Family Series Application Component Type Overview Product Name Style Backplane Connectors 73782 Backplane, Mezzanine PCB Header hdm HDM® N/A Physical Circuits (Loaded) Circuits (maximum) Color - Resin Durability (mating cycles max) First Mate / Last Break Flammability Guide to Mating Part Keying to Mating Part Material - Metal Material - Plating Mating Material - Plating Termination Material - Resin Number of Columns Number of Pairs Number of Rows Orientation PC Tail Length (in) PC Tail Length (mm) PCB Retention PCB Thickness Recommended (in) PCB Thickness Recommended (mm) Packaging Type Pitch - Mating Interface (in) Pitch - Mating Interface (mm) Plating min: Mating (µin) Plating min: Mating (µm) Plating min: Termination (µin) Plating min: Termination (µm) Polarized to PCB Stackable Surface Mount Compatible (SMC) Temperature Range - Operating 144 144 Black 200 No 94V-0 No None Phosphor Bronze Gold Tin-Lead High Temperature Thermoplastic 24 Open Pin Field 6 Vertical 0.138 In 3.50 mm None 0.055 In 1.40 mm Tube 0.079 In 2.00 mm 30 0.75 100 2.5 No Yes Yes -55°C to +105°C Search Parts in this Series 73782Series Mates With 73632 HDM PLUS® Board-to-Board Daughtercard Receptacle. 73780 HDM® Board-to-Board Daughtercard Receptacle Termination Interface: Style Through Hole Electrical Current - Maximum per Contact Data Rate Real Signals (per 25mm) Voltage - Maximum 1A 1.0 Gbps 72 100V AC Solder Process Data Duration at Max. Process Temperature (seconds) Lead-free Process Capability Max. Cycles at Max. Process Temperature Process Temperature max. C 5 Wave Capable (TH only) 1 260 Material Info Reference - Drawing Numbers Packaging Specification PK-70873-0871 Product Specification PS-73780-999 Sales Drawing SD-73782-001 HDM and High Density Metric are trademarks of Amphenol Corporation This document was generated on 05/14/2010 PLEASE CHECK WWW.MOLEX.COM FOR LATEST PART INFORMATION