73800-1200

73800-1200

  • 厂商:

    MOLEX8

  • 封装:

  • 描述:

    73800-1200 - 2.00mm (.079") Pitch HDM® Board-to-Board Midplane Header, Vertical, SMC, PressFit, Long...

  • 详情介绍
  • 数据手册
  • 价格&库存
73800-1200 数据手册
This document was generated on 05/14/2010 PLEASE CHECK WWW.MOLEX.COM FOR LATEST PART INFORMATION Part Number: Status: Overview: Description: 0738001200 Active hdm 2.00mm (.079") Pitch HDM® Board-to-Board Midplane Header, Vertical, SMC, PressFit, Long Pin, Open End Option, 144 Circuits Documents: 3D Model Drawing (PDF) Test Summary (PDF) Product Specification PS-73780-999 (PDF) RoHS Certificate of Compliance (PDF) Series image - Reference only Agency Certification CSA UL LR19980 E29179 EU RoHS China RoHS ELV and RoHS Compliant REACH SVHC Not Reviewed Halogen-Free Status Not Reviewed Need more information on product environmental compliance? Email productcompliance@molex.com For a multiple part number RoHS Certificate of Compliance, click here Please visit the Contact Us section for any non-product compliance questions. General Product Family Series Application Component Type Overview Product Name Style Backplane Connectors 73800 Midplane PCB Header hdm HDM® N/A Physical Circuits (Loaded) Circuits (maximum) Color - Resin Durability (mating cycles max) First Mate / Last Break Flammability Guide to Mating Part Keying to Mating Part Material - Plating Mating Material - Plating Termination Material - Resin Number of Columns Number of Pairs Number of Rows Orientation PC Tail Length (in) PC Tail Length (mm) PCB Locator PCB Retention PCB Thickness Recommended (in) PCB Thickness Recommended (mm) Packaging Type Pitch - Mating Interface (in) Pitch - Mating Interface (mm) Pitch - Term. Interface (in) Pitch - Term. Interface (mm) Plating min: Mating (µin) Plating min: Mating (µm) Plating min: Termination (µin) Plating min: Termination (µm) Polarized to PCB 144 144 Black, Natural 250 No 94V-0 No None Gold Gold High Temperature Thermoplastic 24 Open Pin Field 6 Vertical 0.453 In 11.50 mm No Yes 0.157 In 4.00 mm Tube 0.079 In 2.00 mm 0.079 In 2.00 mm 30 0.75 2 0.05 No Search Parts in this Series 73800Series Mates With 73632 HDM PLUS® Board-to-Board Daughtercard Receptacle. 73780 HDM® Board-to-Board Daughtercard Receptacle Application Tooling | FAQ Tooling specifications and manuals are found by selecting the products below. Crimp Height Specifications are then contained in the Application Tooling Specification document. Global Description Product # Flat Rock Tooling for 0622013700 Pneumatic Press HDM® Backplane 0622005703 Insertion Head for 144 Positions Stackable Surface Mount Compatible (SMC) Temperature Range - Operating No Yes -55°C to +105°C Electrical Current - Maximum per Contact Data Rate Real Signals (per 25mm) Shielded Voltage - Maximum 1A 1.0 Gbps 75 No 250V AC Material Info Reference - Drawing Numbers Packaging Specification PK-70873-0868 Product Specification PS-73780-999 Sales Drawing SD-73800-001 HDM and High Density Metric are trademarks of Amphenol Corporation This document was generated on 05/14/2010 PLEASE CHECK WWW.MOLEX.COM FOR LATEST PART INFORMATION
73800-1200
1. 物料型号: - 型号:0738001200 - 状态:Active(活跃) - 符合欧盟RoHS、中国RoHS、ELV和RoHS指令,REACH SVHC未审核,卤素含量未审核。

2. 器件简介: - 产品家族:Backplane Connectors(背板连接器) - 系列:73800 - 应用:Midplane(中平面) - 组件类型:PCB Header(PCB插座) - 产品名称:HDMR - 概述:2.00mm (.079") 间距 HDM@ 板对板中平面头,Ve Fit,长引脚,开放式末端选项,144路。

3. 引脚分配: - 列数:24 - 对数:开放式引脚场 - 行数:6

4. 参数特性: - 电路数(已加载):144 - 电路数(最大):144 - 树脂颜色:黑色,自然色 - 耐久性(最大插拔次数):250次 - 阻燃性:94V-0 - 镀层:接触区域选择性冷镀金(AU),最小厚度0.00076mm;整体选择性镍(NT)和金闪;接触区域选择性金(AU),最小厚度0.00076mm;合规区域选择性锡/钯(Sn/Pd)镍(Ni)整体。

5. 功能详解: - 该产品符合Molex产品规格PS-73780-999。对于混合接触插拔长度,请咨询工厂以获取可用性信息。

6. 应用信息: - 与73632 HDM PLUS® 板对板女儿卡插座和73780 HDM® 板对板女儿卡插座配合使用。

7. 封装信息: - 包装类型:管装 - 推荐PCB厚度:0.157英寸(4.00mm) - 引脚间距:2.00mm - 镀层最小厚度:接触区域金(AU)30微英寸(0.75微米),终止区域金(AU)2微英寸(0.05微米)。
73800-1200 价格&库存

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