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73800-2000

73800-2000

  • 厂商:

    MOLEX8

  • 封装:

  • 描述:

    73800-2000 - 2.00mm (.079") Pitch HDM® Board-to-Board Midplane Header, Vertical, SMC, Press-Fit, Lon...

  • 详情介绍
  • 数据手册
  • 价格&库存
73800-2000 数据手册
This document was generated on 05/14/2010 PLEASE CHECK WWW.MOLEX.COM FOR LATEST PART INFORMATION Part Number: Status: Overview: Description: 0738002000 Active hdm 2.00mm (.079") Pitch HDM® Board-to-Board Midplane Header, Vertical, SMC, PressFit, Long Pin, Open End Option, 72 Circuits Documents: Drawing (PDF) Product Specification PS-73780-999 (PDF) RoHS Certificate of Compliance (PDF) Series General Product Family Series Application Component Type Overview Product Name Style Backplane Connectors 73800 Midplane PCB Header hdm HDM® N/A image - Reference only EU RoHS China RoHS Compliance Status Not Reviewed REACH SVHC Not Reviewed Halogen-Free Status Not Reviewed Need more information on product environmental compliance? Email productcompliance@molex.com For a multiple part number RoHS Certificate of Compliance, click here Please visit the Contact Us section for any non-product compliance questions. Physical Circuits (Loaded) Circuits (maximum) Color - Resin Durability (mating cycles max) First Mate / Last Break Guide to Mating Part Keying to Mating Part Material - Plating Mating Material - Plating Termination Material - Resin Number of Columns Number of Pairs Number of Rows Orientation PC Tail Length (in) PC Tail Length (mm) PCB Locator PCB Retention PCB Thickness Recommended (in) PCB Thickness Recommended (mm) Packaging Type Pitch - Mating Interface (in) Pitch - Mating Interface (mm) Pitch - Term. Interface (in) Pitch - Term. Interface (mm) Plating min: Mating (µin) Plating min: Mating (µm) Plating min: Termination (µin) Plating min: Termination (µm) Polarized to PCB Stackable Surface Mount Compatible (SMC) Temperature Range - Operating 72 72 Black, Natural 250 No No None Gold Tin-Lead High Temperature Thermoplastic 12 Open Pin Field 6 Vertical 0.453 In 11.50 mm No Yes 0.156 In 3.95 mm Tube 0.079 In 2.00 mm 0.079 In 2.00 mm 30 0.75 35.2 0.88 No No Yes -55°C to +105°C Search Parts in this Series 73800Series Mates With 73632 HDM PLUS® Board-to-Board Daughtercard Receptacle. 73780 HDM® Board-to-Board Daughtercard Receptacle Application Tooling | FAQ Tooling specifications and manuals are found by selecting the products below. Crimp Height Specifications are then contained in the Application Tooling Specification document. Global Description Product # Flat Rock Tooling for 0622013700 Pneumatic Press Electrical Current - Maximum per Contact 1A Data Rate Real Signals (per 25mm) Shielded Voltage - Maximum 1.0 Gbps 75 No 250V AC Material Info Reference - Drawing Numbers Packaging Specification PK-70873-0868 Product Specification PS-73780-999 Sales Drawing SD-73800-001 HDM and High Density Metric are trademarks of Amphenol Corporation This document was generated on 05/14/2010 PLEASE CHECK WWW.MOLEX.COM FOR LATEST PART INFORMATION
73800-2000
物料型号: - Part Number: 0738002000

器件简介: - 产品家族:Backplane Connectors - 系列:73800 - 应用:Midplane - 概述:2.00mm (.079") Pitch HDM® Board-to-Board Midplane Header, Vertical, SMC, PressFit, Long Pin, Open End Option, 72 Circuits

引脚分配: - 列数:12 - 行数:6 - 电路(已加载):72 - 电路(最大):72 - 开放引脚场

参数特性: - 颜色 - 树脂:黑色,自然色 - 耐用性(最大配对周期):250 - 材料 - 镀层配对:金 - 材料 - 镀层终止:锡铅 - 材料 - 树脂:高温热塑性塑料 - PCB厚度推荐(英寸):0.156 - PCB厚度推荐(毫米):3.95 - 间距 - 配对接口(英寸):0.079 - 间距 - 配对接口(毫米):2.00 - 电镀最小:配对(微英寸):30 - 电镀最小:配对(微米):0.75 - 电镀最小:终止(微英寸):35.2 - 电镀最小:终止(微米):0.88 - 电流 - 每个接触最大:1A

功能详解: - 该产品为HDM® Board-to-Board Midplane Header,具有72个电路,垂直安装,表面安装兼容(SMC),PressFit,长引脚,开放式末端选项。

应用信息: - 适用于板对板中平面应用,与73632 HDM PLUS® Board-to-Board Daughtercard Receptacle和73780 HDM® Board-to-Board Daughtercard Receptacle配合使用。

封装信息: - 封装类型:管装 - 温度范围 - 操作:-55°C至+105°C
73800-2000 价格&库存

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