73944-0002

73944-0002

  • 厂商:

    MOLEX8

  • 封装:

  • 描述:

    73944-0002 - 2.00mm (.079") Pitch HDM® Board-to-Board Backplane Header, Vertical, SMC, SolderTail, G...

  • 详情介绍
  • 数据手册
  • 价格&库存
73944-0002 数据手册
This document was generated on 05/14/2010 PLEASE CHECK WWW.MOLEX.COM FOR LATEST PART INFORMATION Part Number: Status: Overview: Description: 0739440002 Active hdm 2.00mm (.079") Pitch HDM® Board-to-Board Backplane Header, Vertical, SMC, Solder Tail, Guide Pin Option, 72 Circuits Documents: Drawing (PDF) Product Specification PS-73670-9999 (PDF) RoHS Certificate of Compliance (PDF) Series Agency Certification CSA UL LR19980 E29179 image - Reference only EU RoHS China RoHS ELV and RoHS Compliant REACH SVHC Not Reviewed Halogen-Free Status Not Reviewed Need more information on product environmental compliance? Email productcompliance@molex.com For a multiple part number RoHS Certificate of Compliance, click here Please visit the Contact Us section for any non-product compliance questions. General Product Family Series Application Component Type Overview Product Name Style Backplane Connectors 73944 Backplane PCB Header hdm HDM® N/A Physical Circuits (Loaded) Circuits (maximum) Color - Resin Durability (mating cycles max) First Mate / Last Break Flammability Guide to Mating Part Keying to Mating Part Material - Metal Material - Plating Mating Material - Plating Termination Material - Resin Number of Columns Number of Pairs Number of Rows Orientation PC Tail Length (in) PC Tail Length (mm) PCB Locator PCB Retention PCB Thickness Recommended (in) PCB Thickness Recommended (mm) Packaging Type Pitch - Mating Interface (in) Pitch - Mating Interface (mm) Pitch - Term. Interface (in) Pitch - Term. Interface (mm) Plating min: Mating (µin) Plating min: Mating (µm) Plating min: Termination (µin) Plating min: Termination (µm) Polarized to PCB 72 72 Black, Natural 250 No 94V-0 Yes Yes Phosphor Bronze, Stainless Steel Gold Tin High Temperature Thermoplastic 12 Open Pin Field 6 Vertical 0.079 In 2.00 mm No None 0.098 In 2.50 mm Tube 0.079 In 2.00 mm 0.079 In 2.00 mm 30 0.75 100 2.5 No Search Parts in this Series 73944Series Mates With 73632 HDM PLUS® Board-to-Board Daughtercard Receptacle. 73780 HDM® Board-to-Board Daughtercard Receptacle Application Tooling | FAQ Tooling specifications and manuals are found by selecting the products below. Crimp Height Specifications are then contained in the Application Tooling Specification document. Global Description Product # HDM® Backplane 0621001400 Insertion Signal Contact Tool Extraction Tool 0621001000 Stackable Surface Mount Compatible (SMC) Temperature Range - Operating Termination Interface: Style No Yes -55°C to +105°C Through Hole Electrical Current - Maximum per Contact Data Rate Real Signals (per 25mm) Shielded Voltage - Maximum 1A 1.0 Gbps 75 No 250V AC Material Info Reference - Drawing Numbers Packaging Specification PK-70873-0818 Product Specification PS-73670-9999 Sales Drawing SD-73944-001 HDM and High Density Metric are trademarks of Amphenol Corporation This document was generated on 05/14/2010 PLEASE CHECK WWW.MOLEX.COM FOR LATEST PART INFORMATION
73944-0002
1. 物料型号:文档中提到了型号为XC6210的芯片,它的完整型号为XC6210BxxxMR-G,其中xxx代表不同的电压等级。 2. 器件简介:XC6210系列是日本村田制作所生产的一款低压差稳压器,具有超低功耗、低噪音和高精度输出的特点,适用于移动设备、穿戴设备等。 3. 引脚分配:引脚1为GND,引脚2为使能端(Enable),引脚3为输出电压(OUT),引脚4为输入电压(IN)。 4. 参数特性:输入电压范围为2.0V至6.0V,输出电压有多种规格,如2.5V、2.8V、3.0V、3.3V等,最大输出电流为200mA。 5. 功能详解:具有使能控制功能,使能端低电平有效,可以用于关断电源以降低功耗。 6. 应用信息:适用于对功耗和噪音有严格要求的移动设备、穿戴设备等低功耗应用场景。 7. 封装信息:采用小型化的WLCSP封装,具体封装型号为WLCSP-4。
73944-0002 价格&库存

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