73944-1003

73944-1003

  • 厂商:

    MOLEX8

  • 封装:

  • 描述:

    73944-1003 - 2.00mm (.079") Pitch HDM® Board-to-Board Backplane Header, Vertical, SMC, SolderGuide P...

  • 详情介绍
  • 数据手册
  • 价格&库存
73944-1003 数据手册
This document was generated on 05/14/2010 PLEASE CHECK WWW.MOLEX.COM FOR LATEST PART INFORMATION Part Number: Status: Overview: Description: 0739441003 Active hdm 2.00mm (.079") Pitch HDM® Board-to-Board Backplane Header, Vertical, SMC, Solder Tail, Guide Pin Option, 144 Circuits Documents: Drawing (PDF) Product Specification PS-73670-9999 (PDF) RoHS Certificate of Compliance (PDF) Series Agency Certification CSA UL LR19980 E29179 image - Reference only EU RoHS China RoHS ELV and RoHS Compliant REACH SVHC Not Reviewed Halogen-Free Status Not Reviewed Need more information on product environmental compliance? Email productcompliance@molex.com For a multiple part number RoHS Certificate of Compliance, click here Please visit the Contact Us section for any non-product compliance questions. General Product Family Series Application Component Type Overview Product Name Style Backplane Connectors 73944 Backplane PCB Header hdm HDM® N/A Physical Circuits (Loaded) Circuits (maximum) Color - Resin Durability (mating cycles max) First Mate / Last Break Flammability Guide to Mating Part Keying to Mating Part Material - Metal Material - Plating Mating Material - Plating Termination Material - Resin Number of Columns Number of Pairs Number of Rows Orientation PC Tail Length (in) PC Tail Length (mm) PCB Locator PCB Retention PCB Thickness Recommended (in) PCB Thickness Recommended (mm) Packaging Type Pitch - Mating Interface (in) Pitch - Mating Interface (mm) Pitch - Term. Interface (in) Pitch - Term. Interface (mm) Plating min: Mating (µin) Plating min: Mating (µm) Plating min: Termination (µin) Plating min: Termination (µm) Polarized to PCB 144 144 Black, Natural 250 No 94V-0 Yes Yes Phosphor Bronze, Stainless Steel Gold Tin High Temperature Thermoplastic 24 Open Pin Field 6 Vertical 0.079 In 2.00 mm No None 0.098 In 2.50 mm Tube 0.079 In 2.00 mm 0.079 In 2.00 mm 30 0.75 100 2.5 No Search Parts in this Series 73944Series Mates With 73632 HDM PLUS® Board-to-Board Daughtercard Receptacle. 73780 HDM® Board-to-Board Daughtercard Receptacle Application Tooling | FAQ Tooling specifications and manuals are found by selecting the products below. Crimp Height Specifications are then contained in the Application Tooling Specification document. Global Description Product # HDM® Backplane 0621001400 Insertion Signal Contact Tool Extraction Tool 0621001000 Stackable Surface Mount Compatible (SMC) Temperature Range - Operating Termination Interface: Style No Yes -55°C to +105°C Through Hole Electrical Current - Maximum per Contact Data Rate Real Signals (per 25mm) Shielded Voltage - Maximum 1A 1.0 Gbps 75 No 250V AC Material Info Reference - Drawing Numbers Packaging Specification PK-70873-0818 Product Specification PS-73670-9999 Sales Drawing SD-73944-001 HDM and High Density Metric are trademarks of Amphenol Corporation This document was generated on 05/14/2010 PLEASE CHECK WWW.MOLEX.COM FOR LATEST PART INFORMATION
73944-1003
物料型号: - 型号:0739441003 - 状态:Active

器件简介: - 描述:2.00mm (.079") Pitch HDM® Board-to-Board Backplane Header, Vertical, SMC, Solder Tail, Guide Pin Option, 144 Circuits - 产品系列:73944 - 应用:Backplane - 组件类型:PCB Header - 产品名称:HDMR

引脚分配: - 引脚数量:144 - 列数:24 - 行数:6

参数特性: - 电路数(已加载):144 - 电路数(最大):144 - 树脂颜色:Black, Natural - 耐久性(最大插拔次数):250 - 阻燃等级:94V-0 - 镀层:Gold (Mating), Tin (Termination) - 镀层最小厚度:Mating (0.75um), Termination (2.5um) - 工作温度范围:-55°C to +105°C - 最大每针电气电流:1A - 最大数据速率:1.0 Gbps - 屏蔽:No - 电压:250V AC

功能详解: - 该器件为HDM® Backplane Header,用于板对板或背板连接,具有垂直的SMC(表面贴装兼容)设计,焊接尾选项,并可选择引导销。支持144个电路,具有高密度的2.00mm引脚间距。

应用信息: - 应用:Backplane - 配合使用的器件:Mates With 73632 HDM PLUS® Board-to-Board Daughtercard Receptacle. 73780 HDM® Board-to-Board Daughtercard Receptacle

封装信息: - 引脚间距:2.00mm - PCB厚度推荐:2.50mm - 包装类型:Tube
73944-1003 价格&库存

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