73944-1016

厂商：
MOLEX8
封装：
描述：
73944-1016 - 2.00mm (.079") Pitch HDM® Board-to-Board Backplane Header, Vertical, SMC, SolderTail, G...

数据手册：

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73944-1016 数据手册

This document was generated on 05/14/2010 PLEASE CHECK WWW.MOLEX.COM FOR LATEST PART INFORMATION Part Number: Status: Overview: Description: 0739441016 Active hdm 2.00mm (.079") Pitch HDM® Board-to-Board Backplane Header, Vertical, SMC, Solder Tail, Guide Pin Option, 144 Circuits Documents: 3D Model Drawing (PDF) Product Specification PS-73670-9999 (PDF) RoHS Certificate of Compliance (PDF) Series image - Reference only LR19980 E29179 EU RoHS China RoHS ELV and RoHS Compliant REACH SVHC Not Reviewed Halogen-Free Status Not Reviewed Need more information on product environmental compliance? Email productcompliance@molex.com For a multiple part number RoHS Certificate of Compliance, click here Please visit the Contact Us section for any non-product compliance questions. Agency Certification CSA UL General Product Family Series Application Component Type Overview Product Name Style Backplane Connectors 73944 Backplane PCB Header hdm HDM® N/A Physical Circuits (Loaded) Circuits (maximum) Color - Resin Durability (mating cycles max) First Mate / Last Break Flammability Guide to Mating Part Keying to Mating Part Material - Metal Material - Plating Mating Material - Plating Termination Material - Resin Number of Columns Number of Pairs Number of Rows Orientation PC Tail Length (in) PC Tail Length (mm) PCB Locator PCB Retention PCB Thickness Recommended (in) PCB Thickness Recommended (mm) Packaging Type Pitch - Mating Interface (in) Pitch - Mating Interface (mm) Pitch - Term. Interface (in) Pitch - Term. Interface (mm) Plating min: Mating (µin) Plating min: Mating (µm) Plating min: Termination (µin) Plating min: Termination (µm) Polarized to PCB 144 144 Black, Natural 250 No 94V-0 Yes Yes Phosphor Bronze, Stainless Steel Gold Tin High Temperature Thermoplastic 24 Open Pin Field 6 Vertical 0.079 In 2.00 mm Yes None 0.098 In 2.50 mm Tube 0.079 In 2.00 mm 0.079 In 2.00 mm 30 0.75 100 2.5 No Search Parts in this Series 73944Series Mates With 73632 HDM PLUS® Board-to-Board Daughtercard Receptacle. 73780 HDM® Board-to-Board Daughtercard Receptacle Application Tooling | FAQ Tooling specifications and manuals are found by selecting the products below. Crimp Height Specifications are then contained in the Application Tooling Specification document. Global Description Product # HDM® Backplane 0621001400 Insertion Signal Contact Tool Extraction Tool 0621001000 Stackable Surface Mount Compatible (SMC) Temperature Range - Operating Termination Interface: Style No No -55°C to +105°C Through Hole Electrical Current - Maximum per Contact Data Rate Shielded Voltage - Maximum 1A 1.0 Gbps No 250V AC Material Info Reference - Drawing Numbers Packaging Specification PK-70873-0818 Product Specification PS-73670-9999 Sales Drawing SD-73944-001 HDM and High Density Metric are trademarks of Amphenol Corporation This document was generated on 05/14/2010 PLEASE CHECK WWW.MOLEX.COM FOR LATEST PART INFORMATION

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73944-1016

1. 物料型号： - 型号：0739441016 - 状态：Active（活跃）

2. 器件简介： - 描述：2.00mm (.079") 间距 HDM@ 板对板背板连接器头，V尾，导引销选项，144路 - 文档：3D模型图纸（PDF）、产品规格PS-73670-9、RoHS合规证书等 - 认证：CSA LR19980、UL E29179

3. 引脚分配： - 电路（已加载）：144 - 电路（最大）：144 - 列数：24 - 行数：6 - 开放引脚场：无

4. 参数特性： - 颜色 - 树脂：黑色、自然色 - 耐用性（最大插拔次数）：250次 - 阻燃等级：94V-0 - 镀层 - 插接（最小厚度um）：0.75 - 镀层 - 终止（最小厚度um）：2.5

5. 功能详解： - 产品家族：背板连接器 - 系列：73944 - 应用：背板 - 组件类型：PCB头 - 物理特性：垂直0.079英寸PC尾长、2.00mm PCB厚度推荐等

6. 应用信息： - 与73632 HDM PLUS® 板对板女儿卡插座和73780 HDM® 板对板女儿卡插座兼容 - 操作温度范围：-55°C至+105°C - 最大每接触电气电流：1A - 数据速率：1.0 Gbps - 屏蔽：否 - 最大电压：250V AC

7. 封装信息： - 包装类型：管装 - 插接界面间距（mm）：2.00mm - 终止界面间距（mm）：2.00mm

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