73944-1217

This document was generated on 05/14/2010 PLEASE CHECK WWW.MOLEX.COM FOR LATEST PART INFORMATION Part Number: Status: Overview: Description: 0739441217 Active hdm 2.00mm (.079") Pitch HDM® Board-to-Board Backplane Header, Vertical, SMC, Solder Tail, Guide Pin Option, 144 Circuits Documents: 3D Model Drawing (PDF) Product Specification PS-73670-9999 (PDF) RoHS Certificate of Compliance (PDF) Series image - Reference only LR19980 E29179 EU RoHS China RoHS ELV and RoHS Compliant REACH SVHC Not Reviewed Halogen-Free Status Not Reviewed Need more information on product environmental compliance? Email productcompliance@molex.com For a multiple part number RoHS Certificate of Compliance, click here Please visit the Contact Us section for any non-product compliance questions. Agency Certification CSA UL General Product Family Series Application Component Type Overview Product Name Style Backplane Connectors 73944 Backplane PCB Header hdm HDM® N/A Physical Circuits (Loaded) Circuits (maximum) Color - Resin Durability (mating cycles max) First Mate / Last Break Flammability Guide to Mating Part Keying to Mating Part Material - Metal Material - Plating Mating Material - Plating Termination Material - Resin Number of Columns Number of Pairs Number of Rows Orientation PC Tail Length (in) PC Tail Length (mm) PCB Locator PCB Retention PCB Thickness Recommended (in) PCB Thickness Recommended (mm) Packaging Type Pitch - Mating Interface (in) Pitch - Mating Interface (mm) Pitch - Term. Interface (in) Pitch - Term. Interface (mm) Plating min: Mating (µin) Plating min: Mating (µm) Plating min: Termination (µin) Plating min: Termination (µm) Polarized to PCB 144 144 Black, Natural 250 No 94V-0 Yes Yes Phosphor Bronze, Stainless Steel Gold Tin High Temperature Thermoplastic 24 Open Pin Field 6 Vertical 0.079 In 2.00 mm Yes None 0.098 In 2.50 mm Tube 0.079 In 2.00 mm 0.079 In 2.00 mm 30 0.75 100 2.5 No Search Parts in this Series 73944Series Mates With 73632 HDM PLUS® Board-to-Board Daughtercard Receptacle. 73780 HDM® Board-to-Board Daughtercard Receptacle Application Tooling | FAQ Tooling specifications and manuals are found by selecting the products below. Crimp Height Specifications are then contained in the Application Tooling Specification document. Global Description Product # HDM® Backplane 0621001400 Insertion Signal Contact Tool Extraction Tool 0621001000 Stackable Surface Mount Compatible (SMC) Temperature Range - Operating Termination Interface: Style No No -55°C to +105°C Through Hole Electrical Current - Maximum per Contact Data Rate Shielded Voltage - Maximum 1A 1.0 Gbps No 250V AC Material Info Reference - Drawing Numbers Packaging Specification PK-70873-0818 Product Specification PS-73670-9999 Sales Drawing SD-73944-001 HDM and High Density Metric are trademarks of Amphenol Corporation This document was generated on 05/14/2010 PLEASE CHECK WWW.MOLEX.COM FOR LATEST PART INFORMATION