74061-2502

74061-2502

  • 厂商:

    MOLEX8

  • 封装:

  • 描述:

    74061-2502 - 2.00mm (.079") Pitch VHDM® Board-to-Board Backplane Header, Vertical, 8-Row, Guide Pin ...

  • 详情介绍
  • 数据手册
  • 价格&库存
74061-2502 数据手册
This document was generated on 06/01/2010 PLEASE CHECK WWW.MOLEX.COM FOR LATEST PART INFORMATION Part Number: Status: Overview: Description: 0740612502 Active vhdm 2.00mm (.079") Pitch VHDM® Board-to-Board Backplane Header, Vertical, 8-Row, Guide Pin Signal Module, Pin End Version, 200 Circuits, Pin Length 6.25mm (.246") Documents: 3D Model Drawing (PDF) RoHS Certificate of Compliance (PDF) Series General Product Family Series Application Application Tooling Documents Comments Component Type Overview Product Name Style Backplane Connectors 74061 Backplane Tooling Manual No Keying Position PCB Header vhdm VHDM® N/A image - Reference only EU RoHS China RoHS RoHS Compliant by Exemption REACH SVHC Not Reviewed Halogen-Free Status Halogen-Free Need more information on product environmental compliance? Email productcompliance@molex.com For a multiple part number RoHS Certificate of Compliance, click here Please visit the Contact Us section for any non-product compliance questions. Physical Circuits (Loaded) Circuits (maximum) Color - Resin Durability (mating cycles max) First Mate / Last Break Guide to Mating Part Keying to Mating Part Material - Metal Material - Plating Mating Material - Plating Termination Material - Resin Number of Columns Number of Pairs Number of Rows Orientation PC Tail Length (in) PC Tail Length (mm) PCB Locator PCB Retention PCB Thickness Recommended (in) PCB Thickness Recommended (mm) Packaging Type Pitch - Mating Interface (in) Pitch - Mating Interface (mm) Pitch - Term. Interface (in) Pitch - Term. Interface (mm) Plating min: Mating (µin) Plating min: Mating (µm) Plating min: Termination (µin) Plating min: Termination (µm) Polarized to PCB Stackable 200 200 Black 200 No Yes None Beryllium Copper, High Performance Alloy (HPA), Stainless Steel Gold Tin-Lead High Temperature Thermoplastic N/A Open Pin Field 8 Vertical 0.098 In 2.50 mm No None 0.070 In 1.80 mm Tube 0.079 In 2.00 mm 0.079 In 2.00 mm 30 0.75 30 0.75 Yes No Search Parts in this Series 74061Series Mates With 74040 VHDM® Board-to-Board Daughtercard Receptacle Application Tooling | FAQ Tooling specifications and manuals are found by selecting the products below. Crimp Height Specifications are then contained in the Application Tooling Specification document. Global Description Product # VHDM® Signal Pin 0622015700 Inserter Repair Tool VHDM® 8 Row Pin 0622015900 and Shield Repair Tool VHDM® 8 Row 0622016100 Shield Extraction Tool Surface Mount Compatible (SMC) Temperature Range - Operating Termination Interface: Style Yes 105°C max Through Hole - Compliant Pin Electrical Current - Maximum per Contact Data Rate Real Signals (per 25mm) Shield Type Shielded Voltage - Maximum 1A 3.125 Gbps 100 Ground Plane Shield Yes 120V AC (RMS)/DC Material Info Reference - Drawing Numbers Sales Drawing SD-74061-002 VHDM and Very High Density Metric are trademarks of Amphenol Corporation VHDM® Insertion 0622020206 Module for Advanced Mate Signal Header, 6 Row by 25 Wide, 50.00mm (1.97") VHDM® Insertion 0622020210 Module for Standard Shield Signal Header, 8 Row by 25 Wide, 50.00mm (1.97") Flat Rock Tooling for 0622013700 Pneumatic Press This document was generated on 06/01/2010 PLEASE CHECK WWW.MOLEX.COM FOR LATEST PART INFORMATION
74061-2502
1. 物料型号: - 型号:0740612502 - 状态:Active(活跃) - 符合欧盟RoHS和中国RoHS指令的豁免条款。

2. 器件简介: - 产品家族:Backplane Connectors(背板连接器) - 系列:74061 - 应用:Backplane(背板) - 组件类型:PCB Header(PCB插座) - 产品名称:VHDMR - 概述:2.00mm (.079") 间距 VHDM 板对板背板头,垂直,8行导向销信号模块,销端版本,200路,销长6.25mm (.246")。

3. 引脚分配: - 电路(已加载):200 - 电路(最大):200 - 行数:8 - 列数:未提供(Open Pin Field,即开放引脚场)

4. 参数特性: - 颜色 - 树脂:黑色 - 耐用性(最大插拔次数):200 - 导向配合部件:是 - 配合部件的键控:无 - 金属材质:铍铜,高性能合金(HPA),不锈钢 - 配合界面镀层:金 - 终止界面镀层:锡铅 - 树脂材质:高温热塑性塑料 - PCB厚度推荐(英寸):0.070 In - PCB厚度推荐(毫米):1.80 mm - 配合界面间距(英寸):0.079 In - 配合界面间距(毫米):2.00 mm - 终止界面间距(英寸):0.079In - 终止界面间距(毫米):2.00 mm - 配合界面最小镀层厚度:30微英寸(0.75微米) - 终止界面最小镀层厚度:30微英寸(0.75微米)

5. 功能详解: - 极性化到PCB:是 - 可堆叠:否

6. 应用信息: - 与74040 VHDM®板对板女儿卡插座配合使用。

7. 封装信息: - 包装类型:管装 - 引脚长度:0.098英寸(2.50毫米)
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