74061-2514

74061-2514

  • 厂商:

    MOLEX8

  • 封装:

  • 描述:

    74061-2514 - 2.00mm (.079") Pitch VHDM® Board-to-Board Backplane Header, Vertical, 8-Row,Guide Pin S...

  • 详情介绍
  • 数据手册
  • 价格&库存
74061-2514 数据手册
This document was generated on 06/01/2010 PLEASE CHECK WWW.MOLEX.COM FOR LATEST PART INFORMATION Part Number: Status: Overview: Description: 0740612514 Active vhdm 2.00mm (.079") Pitch VHDM® Board-to-Board Backplane Header, Vertical, 8-Row, Guide Pin Signal Module, Pin End Version, 200 Circuits, Pin Length 5.15mm (.203") Documents: Drawing (PDF) RoHS Certificate of Compliance (PDF) Series Backplane Connectors 74061 Backplane Tooling Manual Keying Position A PCB Header vhdm VHDM® N/A image - Reference only EU RoHS Not RoHS Compliant REACH SVHC Not Reviewed Halogen-Free Status Not Reviewed China RoHS General Product Family Series Application Application Tooling Documents Comments Component Type Overview Product Name Style Physical Circuits (Loaded) Circuits (maximum) Color - Resin Durability (mating cycles max) First Mate / Last Break Guide to Mating Part Keying to Mating Part Material - Metal Material - Plating Mating Material - Plating Termination Material - Resin Number of Columns Number of Pairs Number of Rows Orientation PC Tail Length (in) PC Tail Length (mm) PCB Locator PCB Retention PCB Thickness Recommended (in) PCB Thickness Recommended (mm) Packaging Type Pitch - Mating Interface (in) Pitch - Mating Interface (mm) Pitch - Term. Interface (in) Pitch - Term. Interface (mm) Plating min: Mating (µin) Plating min: Mating (µm) Plating min: Termination (µin) Plating min: Termination (µm) Polarized to PCB Stackable Surface Mount Compatible (SMC) 200 200 Black 200 No Yes Yes Beryllium Copper, High Performance Alloy (HPA), Stainless Steel Gold Tin-Lead High Temperature Thermoplastic N/A Open Pin Field 8 Vertical 0.098 In 2.50 mm No None 0.070 In 1.80 mm Tube 0.079 In 2.00 mm 0.079 In 2.00 mm 30 0.75 30 0.75 Yes No Yes Need more information on product environmental compliance? Email productcompliance@molex.com For a multiple part number RoHS Certificate of Compliance, click here Please visit the Contact Us section for any non-product compliance questions. Search Parts in this Series 74061Series Mates With 74040 VHDM® Board-to-Board Daughtercard Receptacle Application Tooling | FAQ Tooling specifications and manuals are found by selecting the products below. Crimp Height Specifications are then contained in the Application Tooling Specification document. Global Description Product # VHDM® Signal Pin 0622015700 Inserter Repair Tool VHDM® 8 Row Pin 0622015900 and Shield Repair Tool VHDM® 8 Row 0622016100 Shield Extraction Tool VHDM® Insertion 0622020206 Module for Advanced Temperature Range - Operating Termination Interface: Style 105°C max Through Hole - Compliant Pin Electrical Current - Maximum per Contact Data Rate Real Signals (per 25mm) Shield Type Shielded Voltage - Maximum 1A 3.125 Gbps 100 Ground Plane Shield Yes 120V AC (RMS)/DC Material Info Reference - Drawing Numbers Sales Drawing SD-74061-002 VHDM and Very High Density Metric are trademarks of Amphenol Corporation Mate Signal Header, 6 Row by 25 Wide, 50.00mm (1.97") VHDM® Insertion 0622020210 Module for Standard Shield Signal Header, 8 Row by 25 Wide, 50.00mm (1.97") Flat Rock Tooling for 0622013700 Pneumatic Press This document was generated on 06/01/2010 PLEASE CHECK WWW.MOLEX.COM FOR LATEST PART INFORMATION
74061-2514
1. 物料型号: - 型号:0740612514 - 状态:Active - 描述:VHDM® Board-to-Board Backplane Header, Vertical, 8-Row, Guide Pin Signal Module, Pin End Version, 200 Circuits, Pin Length 5.15mm (.203")。

2. 器件简介: - 产品家族:Backplane Connectors - 系列:74061 - 应用:Backplane - 组件类型:PCB Header - 概述:vhdm - 产品名称:VHDMR - 电路(已加载):200 - 电路(最大):200 - 颜色 - 树脂:黑色 - 耐用性(最大配对周期):200 - 材料 - 金属:铍铜,高性能合金(HPA),不锈钢 - 材料 - 镀层配对:金 - 材料 - 镀层终止:锡-铅 - 材料 - 树脂:高温热塑性塑料 - 行数:8 - 导向到配对部件:是 - 与配对部件的键控:是

3. 引脚分配: - 列数:不适用 - 对数:开放引脚场 - 行数:8 - 引脚配置:25列锡铅90-10列镀锡92-12列镀锡85=25列镀锡

4. 参数特性: - 接触最大电流每接触:1A - 数据速率真实信号(每25mm):3.125 Gbps - 屏蔽类型:有,100接地平面屏蔽 - 电压最大值:120V AC (RMS)/DC

5. 功能详解: - 极化到PCB:是 - 堆叠:否 - 表面安装兼容(SMC):是

6. 应用信息: - 与74040 VHDM® Board-to-Board Daughtercard Receptacle配对使用。

7. 封装信息: - 包装类型:管装 - 接口间距 - 配对界面(英寸):0.079英寸 - 接口间距 - 配对界面(毫米):2.00毫米 - 接口间距 - 终端界面(英寸):0.079英寸 - 接口间距 - 终端界面(毫米):2.00毫米 - 镀层最小值:配对30微英寸,终止30微英寸
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