74300-1144

厂商：
MOLEX8
封装：
描述：
74300-1144 - 2.00mm (.079") Pitch HDM® Board-to-Board Daughtercard Receptacle, Vertical, SignalModul...

数据手册：

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74300-1144 数据手册

This document was generated on 05/15/2010 PLEASE CHECK WWW.MOLEX.COM FOR LATEST PART INFORMATION Part Number: Status: Overview: Description: 0743001144 Active hdm 2.00mm (.079") Pitch HDM® Board-to-Board Daughtercard Receptacle, Vertical, Signal Module, with Guide, 144 Circuits, Mounted Height 14.00mm (.551"), Press-Fit Pin Length 3.00mm (.118"), Lead-Free Documents: 3D Model Drawing (PDF) Product Specification PS-73780-999 (PDF) RoHS Certificate of Compliance (PDF) image - Reference only Series General Product Family Series Application Component Type Overview Product Name Style Backplane Connectors 74300 Daughtercard, Mezzanine PCB Receptacle hdm HDM® N/A EU RoHS China RoHS ELV and RoHS Compliant REACH SVHC Contains SVHC: No Halogen-Free Status Halogen-Free Need more information on product environmental compliance? Email productcompliance@molex.com For a multiple part number RoHS Certificate of Compliance, click here Please visit the Contact Us section for any non-product compliance questions. Physical Circuits (Loaded) Circuits (maximum) Color - Resin Durability (mating cycles max) First Mate / Last Break Guide to Mating Part Keying to Mating Part Material - Metal Material - Plating Mating Material - Plating Termination Material - Resin Number of Columns Number of Pairs Number of Rows Orientation PC Tail Length (in) PC Tail Length (mm) PCB Locator PCB Retention PCB Thickness Recommended (in) PCB Thickness Recommended (mm) Packaging Type Pitch - Mating Interface (in) Pitch - Mating Interface (mm) Pitch - Term. Interface (in) Pitch - Term. Interface (mm) Plating min: Mating (µin) Plating min: Mating (µm) Plating min: Termination (µin) Plating min: Termination (µm) Polarized to PCB Stackable Surface Mount Compatible (SMC) Temperature Range - Operating Termination Interface: Style 144 144 Black 250 No Yes None Copper-Nickel-Tin Gold Matte Tin High Temperature Thermoplastic 24 Open Pin Field 6 Vertical 0.118 In 3.00 mm No None 0.063 In 1.60 mm Tube 0.079 In 2.00 mm 0.079 In 2.00 mm 30 0.76 100 2.50 No Yes Yes -55°C to +105°C Through Hole - Compliant Pin Search Parts in this Series 74300Series Mates With HDM® Board-to-Board Backplane Header 73642 , 73643 , 73644 , 74349 , 74428 , 73769 , 73781 , 73770 , 73782 , 73783 , 73771 Electrical Current - Maximum per Contact Data Rate Real Signals (per 25mm) Shielded Voltage - Maximum 1A 1.0 Gbps 76 Yes 250V AC Solder Process Data Duration at Max. Process Temperature (seconds) Lead-free Process Capability Max. Cycles at Max. Process Temperature Process Temperature max. C 5 Wave Capable (TH only) 1 260 Material Info Reference - Drawing Numbers Product Specification PS-73780-999 Sales Drawing SD-74300-004 HDM and High Density Metric are trademarks of Amphenol Corporation This document was generated on 05/15/2010 PLEASE CHECK WWW.MOLEX.COM FOR LATEST PART INFORMATION

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74300-1144

1. 物料型号： - 型号：0743001144 - 描述：Activehdm 2.00mm (.079") Pitch HDM® Board-to-Board Daughtercard Receptacle, Vertical, Signal Module, with Guide, 144 Circuits, Mounted Height 14.00mm (.551"), Press-Fit Pin Length 3.00mm (.118"), Lead-Free

2. 器件简介： - 产品系列：Backplane Connectors - 应用：Daughtercard, Mezzanine PCB Receptacle - 特点：HDM® N/A 144 144 Black 250 No Yes None Copper-Nickel-Tin Gold Matte Tin High Temperature Thermoplastic 24 Open Pin Field 6 Vertical 0.118 In 3.00 mm

3. 引脚分配： - 引脚数量：144个电路 - 引脚排列：垂直排列，6行

4. 参数特性： - 电气参数：最大每接触1A电流，数据速率1.0 Gbps - 屏蔽：是 - 电压：最大250V AC - 焊接过程：波峰焊接能力（仅限TH）

5. 功能详解： - 该器件为HDM®板对板连接器，具有144个电路，垂直安装，带导向功能，适用于信号模块。 - 材料：金属部分为铜镍锡，塑料部分为高温热塑性材料。

6. 应用信息： - 与HDM®板对板背板头73642, 73643, 73644, 74349, 74428, 73769, 73781, 73770, 73782, 73783, 73771兼容。

7. 封装信息： - 封装类型：通孔兼容引脚 - 封装材料：金属部分为铜镍锡，塑料部分为高温热塑性材料。 - 封装尺寸：安装高度14.00mm (.551")，压接引脚长度3.00mm (.118")。

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