74300-2143

74300-2143

  • 厂商:

    MOLEX8

  • 封装:

  • 描述:

    74300-2143 - 2.00mm (.079") Pitch HDM® Board-to-Board Daughtercard Receptacle, Vertical, SignalModul...

  • 详情介绍
  • 数据手册
  • 价格&库存
74300-2143 数据手册
This document was generated on 05/25/2010 PLEASE CHECK WWW.MOLEX.COM FOR LATEST PART INFORMATION Part Number: Status: Overview: Description: 0743002143 Active hdm 2.00mm (.079") Pitch HDM® Board-to-Board Daughtercard Receptacle, Vertical, Signal Module, with Guide, 72 Circuits, Mounted Height 13.00mm (.512"), Press-Fit Pin Length 3.00mm (.118") Documents: 3D Model Drawing (PDF) Product Specification PS-73780-999 (PDF) RoHS Certificate of Compliance (PDF) image - Reference only Series General Product Family Series Application Component Type Overview Product Name Style Backplane Connectors 74300 Daughtercard, Mezzanine PCB Receptacle hdm HDM® N/A EU RoHS China RoHS RoHS Compliant by Exemption REACH SVHC Contains SVHC: No Halogen-Free Status Halogen-Free Need more information on product environmental compliance? Email productcompliance@molex.com For a multiple part number RoHS Certificate of Compliance, click here Please visit the Contact Us section for any non-product compliance questions. Physical Circuits (Loaded) Circuits (maximum) Color - Resin Durability (mating cycles max) First Mate / Last Break Guide to Mating Part Keying to Mating Part Material - Metal Material - Plating Mating Material - Plating Termination Material - Resin Number of Columns Number of Pairs Number of Rows Orientation PC Tail Length (in) PC Tail Length (mm) PCB Locator PCB Retention PCB Thickness Recommended (in) PCB Thickness Recommended (mm) Packaging Type Pitch - Mating Interface (in) Pitch - Mating Interface (mm) Pitch - Term. Interface (in) Pitch - Term. Interface (mm) Plating min: Mating (µin) Plating min: Mating (µm) Plating min: Termination (µin) Plating min: Termination (µm) Polarized to PCB Stackable Surface Mount Compatible (SMC) Temperature Range - Operating Termination Interface: Style 72 72 Black 250 No Yes None Copper-Nickel-Tin Gold Tin-Lead High Temperature Thermoplastic 12 Open Pin Field 6 Vertical 0.118 In 3.00 mm No None 0.063 In 1.60 mm Tube 0.079 In 2.00 mm 0.079 In 2.00 mm 30 0.76 30 .88 No Yes Yes -55°C to +105°C Through Hole - Compliant Pin Search Parts in this Series 74300Series Mates With HDM® Board-to-Board Backplane Header 73642 , 73643 , 73644 , 74349 , 74428 , 73769 , 73781 , 73770 , 73782 , 73783 , 73771 Electrical Current - Maximum per Contact Data Rate Real Signals (per 25mm) Shielded Voltage - Maximum 1A 1.0 Gbps 76 Yes 250V AC Material Info Reference - Drawing Numbers Product Specification PS-73780-999 Sales Drawing SD-74300-002 HDM and High Density Metric are trademarks of Amphenol Corporation This document was generated on 05/25/2010 PLEASE CHECK WWW.MOLEX.COM FOR LATEST PART INFORMATION
74300-2143
### 物料型号 - 型号:0743002143 - 状态:Active(活跃)

### 器件简介 - 产品家族:Backplane Connectors(背板连接器) - 系列:74300 - 应用:Daughtercard, Mezzanine(子卡,夹层) - 组件类型:PCB Receptacle(PCB插座) - 概述:hdm 2.00mm (.079") 间距 HDM® 板对板女儿卡插座,垂直,信号模块,带导向,72电路,安装高度13.00mm (.512"),压接针长3.00mm (.118")。

### 引脚分配 - 电路(已加载):72 - 电路(最大):72 - 列数:12 - 行数:6

### 参数特性 - 颜色 - 树脂:黑色 - 耐久性(最大插拔次数):250 - 首次配对/最后断开:否 - 导向至配对部件:是 - 配对部件的键控:无 - 材料 - 金属:铜镍锡 - 材料 - 镀层配对:金 - 材料 - 镀层终止:锡铅 - 材料 - 树脂:高温热塑性塑料 - PC尾长(英寸):0.118 In - PC尾长(毫米):3.00 mm - PCB厚度推荐(英寸):0.063 In - PCB厚度推荐(毫米):1.60 mm - 间距 - 配对接口(英寸):0.079 In - 间距 - 配对接口(毫米):2.00 mm - 镀层最小:配对(微英寸):30 - 镀层最小:配对(微米):0.76 - 镀层最小:终止(微英寸):30 - 镀层最小:终止(微米):0.88

### 功能详解 - 该产品支持高达1.0 Gbps的数据速率,每个25mm部分有76个真实信号,并且是屏蔽的。最大电压为250V AC。

### 应用信息 - 与HDM®板对板背板头73642、73643、73644、74349、74428、73769、73781、73770、73782、73783、73771配对使用。

### 封装信息 - 包装类型:管装 - 极化至PCB:否 - 堆叠:是 - 表面贴装兼容(SMC):是 - 操作温度范围:-55°C至+105°C - 终止接口风格:通孔 - 顺从针
74300-2143 价格&库存

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