74300-2167

74300-2167

  • 厂商:

    MOLEX8

  • 封装:

  • 描述:

    74300-2167 - 2.00mm (.079") Pitch HDM® Board-to-Board Daughtercard Receptacle, Vertical, SignalModul...

  • 详情介绍
  • 数据手册
  • 价格&库存
74300-2167 数据手册
This document was generated on 05/15/2010 PLEASE CHECK WWW.MOLEX.COM FOR LATEST PART INFORMATION Part Number: Status: Overview: Description: 0743002167 Active hdm 2.00mm (.079") Pitch HDM® Board-to-Board Daughtercard Receptacle, Vertical, Signal Module, with Guide, 72 Circuits, Mounted Height 17.00mm (.669"), Press-Fit Pin Length 4.00mm (.157") Documents: 3D Model Drawing (PDF) Product Specification PS-73780-999 (PDF) RoHS Certificate of Compliance (PDF) image - Reference only Series General Product Family Series Application Component Type Overview Product Name Style Backplane Connectors 74300 Daughtercard, Mezzanine PCB Receptacle hdm HDM® N/A EU RoHS China RoHS RoHS Compliant by Exemption REACH SVHC Contains SVHC: No Halogen-Free Status Not Reviewed Need more information on product environmental compliance? Email productcompliance@molex.com For a multiple part number RoHS Certificate of Compliance, click here Please visit the Contact Us section for any non-product compliance questions. Physical Circuits (Loaded) Circuits (maximum) Color - Resin Durability (mating cycles max) First Mate / Last Break Guide to Mating Part Keying to Mating Part Material - Metal Material - Plating Mating Material - Plating Termination Material - Resin Number of Columns Number of Pairs Number of Rows Orientation PC Tail Length (in) PC Tail Length (mm) PCB Locator PCB Retention PCB Thickness Recommended (in) PCB Thickness Recommended (mm) Packaging Type Pitch - Mating Interface (in) Pitch - Mating Interface (mm) Pitch - Term. Interface (in) Pitch - Term. Interface (mm) Plating min: Mating (µin) Plating min: Mating (µm) Plating min: Termination (µin) Plating min: Termination (µm) Polarized to PCB Stackable Surface Mount Compatible (SMC) Temperature Range - Operating Termination Interface: Style 72 72 Black 250 No Yes None Copper-Nickel-Tin Gold Tin-Lead High Temperature Thermoplastic 12 Open Pin Field 6 Vertical 0.157 In 4.00 mm No None 0.063 In 1.60 mm Tube 0.079 In 2.00 mm 0.079 In 2.00 mm 30 0.76 30 .88 No Yes Yes -55°C to +105°C Through Hole - Compliant Pin Search Parts in this Series 74300Series Mates With HDM® Board-to-Board Backplane Header 73642 , 73643 , 73644 , 74349 , 74428 , 73769 , 73781 , 73770 , 73782 , 73783 , 73771 Electrical Current - Maximum per Contact Data Rate Real Signals (per 25mm) Shielded Voltage - Maximum 1A 1.0 Gbps 76 Yes 250V AC Material Info Reference - Drawing Numbers Product Specification PS-73780-999 Sales Drawing SD-74300-002 HDM and High Density Metric are trademarks of Amphenol Corporation This document was generated on 05/15/2010 PLEASE CHECK WWW.MOLEX.COM FOR LATEST PART INFORMATION
74300-2167
物料型号: - Part Number: 0743002167

器件简介: - 产品系列:Backplane Connectors - 应用:Daughtercard, Mezzanine - 组件类型:PCB Receptacle - 产品名称:HDMR - 概述:Active hdm 2.00mm (.079") Pitch HDM® Board-to-Board Daughtercard Receptacle, Vertical, Signal Module, with Guide, 72 Circuits, Mounted Height 17.00mm (.669"), Press-Fit Pin Length 4.00mm (.157")。

引脚分配: - 电路数(已加载):72 - 电路(最大):72 - 列数:12 - 行数:6 - 开放引脚场:无对数

参数特性: - 颜色 - 树脂:黑色 - 耐久性(最大插配次数):250次 - 导向到配对部件:是 - 金属材质:铜镍锡 - 插配界面镀层材质:金 - 终止镀层材质:锡铅 - 树脂材质:高温热塑性塑料 - 插配界面间距:2.00mm(0.079") - 终止界面间距:2.00mm(0.079") - 插配镀层最小厚度:0.76um(30uin) - 终止镀层最小厚度:0.88um(30uin)

功能详解: - 产品符合Molex产品规范PS-73780-999。 - 具有72个电路,垂直方向,带有导向,适用于板对板连接。 - 支持高达1.0 Gbps的数据速率和76个真实信号(每25mm)。 - 电压最大值:屏蔽。

应用信息: - 与HDM® Board-to-Board Backplane Header型号73642、73643、73644、74349、74428、73769、73781、73770、73782、73783、73771配对使用。

封装信息: - 封装类型:Tube - 推荐PCB厚度:1.60mm(0.063") - 操作温度范围:-55°C至+105°C - 表面贴装兼容(SMC):是
74300-2167 价格&库存

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