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74300-3144

74300-3144

  • 厂商:

    MOLEX8

  • 封装:

  • 描述:

    74300-3144 - 2.00mm (.079") Pitch HDM® Board-to-Board Daughtercard Receptacle, Vertical, SignalModul...

  • 详情介绍
  • 数据手册
  • 价格&库存
74300-3144 数据手册
This document was generated on 05/15/2010 PLEASE CHECK WWW.MOLEX.COM FOR LATEST PART INFORMATION Part Number: Status: Overview: Description: 0743003144 Active hdm 2.00mm (.079") Pitch HDM® Board-to-Board Daughtercard Receptacle, Vertical, Signal Module, with Guide, 144 Circuits, Mounted Height 14.00mm (.551"), Press-Fit Pin Length 3.00mm (.118") Documents: 3D Model Drawing (PDF) Product Specification PS-73780-999 (PDF) RoHS Certificate of Compliance (PDF) image - Reference only Series General Product Family Series Application Component Type Overview Product Name Style Backplane Connectors 74300 Daughtercard, Mezzanine PCB Receptacle hdm HDM® N/A EU RoHS China RoHS ELV and RoHS Compliant REACH SVHC Contains SVHC: No Halogen-Free Status Not Reviewed Need more information on product environmental compliance? Email productcompliance@molex.com For a multiple part number RoHS Certificate of Compliance, click here Please visit the Contact Us section for any non-product compliance questions. Physical Circuits (Loaded) Circuits (maximum) Color - Resin Durability (mating cycles max) First Mate / Last Break Guide to Mating Part Keying to Mating Part Material - Metal Material - Plating Mating Material - Plating Termination Material - Resin Number of Columns Number of Pairs Number of Rows Orientation PC Tail Length (in) PC Tail Length (mm) PCB Locator PCB Retention PCB Thickness Recommended (in) PCB Thickness Recommended (mm) Packaging Type Pitch - Mating Interface (in) Pitch - Mating Interface (mm) Pitch - Term. Interface (in) Pitch - Term. Interface (mm) Plating min: Mating (µin) Plating min: Mating (µm) Plating min: Termination (µin) Plating min: Termination (µm) Polarized to PCB Stackable Surface Mount Compatible (SMC) Temperature Range - Operating Termination Interface: Style 144 144 Black 250 No Yes None Copper-Nickel-Tin Gold Tin-Lead High Temperature Thermoplastic 24 Open Pin Field 6 Vertical 0.118 In 3.00 mm No None 0.063 In 1.60 mm Tube 0.079 In 2.00 mm 0.079 In 2.00 mm 30 0.76 30 .88 No Yes Yes -55°C to +105°C Through Hole - Compliant Pin Search Parts in this Series 74300Series Mates With HDM® Board-to-Board Backplane Header 73642 , 73643 , 73644 , 74349 , 74428 , 73769 , 73781 , 73770 , 73782 , 73783 , 73771 Electrical Current - Maximum per Contact Data Rate Real Signals (per 25mm) Shielded Voltage - Maximum 1A 1.0 Gbps 76 Yes 250V AC Material Info Reference - Drawing Numbers Product Specification PS-73780-999 Sales Drawing SD-74300-002 HDM and High Density Metric are trademarks of Amphenol Corporation This document was generated on 05/15/2010 PLEASE CHECK WWW.MOLEX.COM FOR LATEST PART INFORMATION
74300-3144
### 物料型号 - 型号:0743003144 - 状态:Active(活跃)

### 器件简介 - 产品家族:Backplane Connectors(背板连接器) - 系列:74300 - 应用:Daughtercard, Mezzanine(子卡,夹层) - 组件类型:PCB Receptacle(PCB插座) - 概述:2.00mm (.079") 间距 HDM® 板对板女儿卡插座,垂直,信号模块,带导向,144路,安装高度14.00mm (.551"),压接针长3.00mm (.118")。

### 引脚分配 - 电路(已加载):144 - 电路(最大):144 - 列数:24 - 行数:6 - 开放引脚场的对数:N/A

### 参数特性 - 颜色 - 树脂:黑色 - 耐久性(最大插配次数):250 - 首次配对/最后断开:否 - 导向配合部件:是 - 键控配合部件:无 - 金属材质:铜镍锡 - 配合界面镀层:金 - 终止界面镀层:锡铅 - 树脂材质:高温热塑性塑料 - 垂直方向:垂直 - PC尾长(英寸):0.118英寸 - PC尾长(毫米):3.00毫米 - PCB厚度推荐(英寸):0.063英寸 - PCB厚度推荐(毫米):1.60毫米 - 间距 - 配合界面(英寸):0.079英寸 - 间距 - 配合界面(毫米):2.00毫米 - 镀层最小值:配合界面(微英寸):30,配合界面(微米):0.76,终止界面(微英寸):30,终止界面(微米):0.88

### 功能详解 - 该产品为HDM®板对板女儿卡插座,支持垂直安装,具有144个电路,适用于子卡和夹层应用。产品具有高耐久性和良好的信号传输性能,适用于需要高密度连接的应用场景。

### 应用信息 - 与HDM®板对板背板插座配合使用,如73642、73643、73644、74349、74428、73769、73781、73770、73782、73783、73771等型号。

### 封装信息 - 封装类型:Tube(管装) - 操作温度范围:-55°C至+105°C - 表面贴装兼容(SMC):是
74300-3144 价格&库存

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