74300-3153

74300-3153

  • 厂商:

    MOLEX8

  • 封装:

  • 描述:

    74300-3153 - 2.00mm (.079") Pitch HDM® Board-to-Board Daughtercard Receptacle, Vertical, SignalModul...

  • 详情介绍
  • 数据手册
  • 价格&库存
74300-3153 数据手册
This document was generated on 05/15/2010 PLEASE CHECK WWW.MOLEX.COM FOR LATEST PART INFORMATION Part Number: Status: Overview: Description: 0743003153 Active hdm 2.00mm (.079") Pitch HDM® Board-to-Board Daughtercard Receptacle, Vertical, Signal Module, with Guide, 144 Circuits, Mounted Height 13.00mm (.512"), Press-Fit Pin Length 3.50mm (.138") Documents: 3D Model Drawing (PDF) Product Specification PS-73780-999 (PDF) RoHS Certificate of Compliance (PDF) image - Reference only Series General Product Family Series Application Component Type Overview Product Name Style Backplane Connectors 74300 Daughtercard, Mezzanine PCB Receptacle hdm HDM® N/A EU RoHS China RoHS RoHS Compliant by Exemption REACH SVHC Contains SVHC: No Halogen-Free Status Not Reviewed Need more information on product environmental compliance? Email productcompliance@molex.com For a multiple part number RoHS Certificate of Compliance, click here Please visit the Contact Us section for any non-product compliance questions. Physical Circuits (Loaded) Circuits (maximum) Color - Resin Durability (mating cycles max) First Mate / Last Break Guide to Mating Part Keying to Mating Part Material - Metal Material - Plating Mating Material - Plating Termination Material - Resin Number of Columns Number of Pairs Number of Rows Orientation PC Tail Length (in) PC Tail Length (mm) PCB Locator PCB Retention PCB Thickness Recommended (in) PCB Thickness Recommended (mm) Packaging Type Pitch - Mating Interface (in) Pitch - Mating Interface (mm) Pitch - Term. Interface (in) Pitch - Term. Interface (mm) Plating min: Mating (µin) Plating min: Mating (µm) Plating min: Termination (µin) Plating min: Termination (µm) Polarized to PCB Stackable Surface Mount Compatible (SMC) Temperature Range - Operating Termination Interface: Style 144 144 Black 250 No Yes None Copper-Nickel-Tin Gold Tin-Lead High Temperature Thermoplastic 24 Open Pin Field 6 Vertical 0.138 In 3.50 mm No None 0.063 In 1.60 mm Tube 0.079 In 2.00 mm 0.079 In 2.00 mm 30 0.76 30 .88 No Yes Yes -55°C to +105°C Through Hole - Compliant Pin Search Parts in this Series 74300Series Mates With HDM® Board-to-Board Backplane Header 73642 , 73643 , 73644 , 74349 , 74428 , 73769 , 73781 , 73770 , 73782 , 73783 , 73771 Electrical Current - Maximum per Contact Data Rate Real Signals (per 25mm) Shielded Voltage - Maximum 1A 1.0 Gbps 76 Yes 250V AC Material Info Reference - Drawing Numbers Product Specification PS-73780-999 Sales Drawing SD-74300-002 HDM and High Density Metric are trademarks of Amphenol Corporation This document was generated on 05/15/2010 PLEASE CHECK WWW.MOLEX.COM FOR LATEST PART INFORMATION
74300-3153
1. 物料型号: - 型号:0743003153 - 描述:ActiveHDM 2.00mm (.079") Pitch HDM® Board-to-Board Daughtercard Receptacle, Vertical, Signal Module, with Guide, 144 Circuits, Mounted Height 13.00mm (.512"), Press-Fit Pin Length 3.50mm (.138")。

2. 器件简介: - 产品系列:HDM® - 应用:Board-to-Board Daughtercard Receptacle - 物理电路:144 - 最大电路:144 - 颜色:Black - 耐用性:250次插拔 - 导向:有 - 与配对部分的键合:无 - 材料:铜镍锡、金锡铅、高温热塑性材料 - 列数:24 - 对数:6 - 行数:垂直 - PCB尾长:0.138英寸(3.50毫米) - PCB定位器:无 - PCB保持:无 - PCB厚度推荐:0.063英寸(1.60毫米) - 包装类型:管装

3. 引脚分配: - 引脚间距:2.00mm(.079") - 配对接口间距:0.079英寸(2.00mm) - 终止接口间距:0.079英寸(2.00mm) - 镀层最小厚度:配对(µin)、配对(µm)、终止(µin)

4. 参数特性: - 最大电流每接触点:1A - 数据速率:1.0 Gbps - 真实信号(每25mm):76 - 屏蔽:是 - 最大电压:- - 材料信息参考:产品规格销售绘图PS-73780-999

5. 功能详解: - 该器件符合Molex产品规格PS-73780-999。 - 144 CKT堆叠模块仅用于说明目的,具体尺寸见图表。 - 根据应用,可能需要此孔以清除后面板导向销,孔的位置将取决于导向销的位置。

6. 应用信息: - 与HDM® Board-to-Board Backplane Header配对的型号:73642, 73643, 73644, 74349, 74428, 73769, 73781, 73770, 73782, 73783, 73771。

7. 封装信息: - 封装:通过孔 - 符合EU RoHS和中国RoHS,豁免。 - 无SVHC,无卤素状态未审核。
74300-3153 价格&库存

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