74301-1100

74301-1100

  • 厂商:

    MOLEX8

  • 封装:

  • 描述:

    74301-1100 - 2.00mm (.079") Pitch HDM® Board-to-Board Backplane Header, Vertical, SMC, Press-Fit, Ex...

  • 详情介绍
  • 数据手册
  • 价格&库存
74301-1100 数据手册
This document was generated on 05/15/2010 PLEASE CHECK WWW.MOLEX.COM FOR LATEST PART INFORMATION Part Number: Status: Overview: Description: 0743011100 Active hdm 2.00mm (.079") Pitch HDM® Board-to-Board Backplane Header, Vertical, SMC, PressFit, Extended PC Tail, Open End Option, 144 Circuits Documents: Drawing (PDF) RoHS Certificate of Compliance (PDF) Series Backplane Connectors 74301 Backplane PCB Header hdm HDM® N/A image - Reference only EU RoHS China RoHS Compliance Status Not Reviewed REACH SVHC Not Reviewed Halogen-Free Status Not Reviewed Need more information on product environmental compliance? Email productcompliance@molex.com For a multiple part number RoHS Certificate of Compliance, click here Please visit the Contact Us section for any non-product compliance questions. General Product Family Series Application Component Type Overview Product Name Style Physical Circuits (Loaded) Circuits (maximum) Color - Resin Durability (mating cycles max) First Mate / Last Break Guide to Mating Part Keying to Mating Part Material - Metal Material - Plating Mating Material - Plating Termination Material - Resin Number of Columns Number of Pairs Number of Rows Orientation PC Tail Length (in) PC Tail Length (mm) PCB Locator PCB Retention PCB Thickness Recommended (in) PCB Thickness Recommended (mm) Packaging Type Pitch - Mating Interface (in) Pitch - Mating Interface (mm) Pitch - Term. Interface (in) Pitch - Term. Interface (mm) Plating min: Mating (µin) Plating min: Mating (µm) Plating min: Termination (µin) Plating min: Termination (µm) Polarized to PCB Stackable Surface Mount Compatible (SMC) Temperature Range - Operating Termination Interface: Style 144 144 Black, Natural 250 No No None Phosphor Bronze Gold Tin-Lead High Temperature Thermoplastic 24 Open Pin Field 6 Vertical 0.276 In 7.00 mm No Yes 0.098 In 2.50 mm Tube 0.079 In 2.00 mm 0.079 In 2.00 mm 30 0.75 15 0.375 No No Yes -55°C to +105°C Through Hole - Compliant Pin Search Parts in this Series 74301Series Electrical Current - Maximum per Contact Data Rate Real Signals (per 25mm) Shielded Voltage - Maximum 1A 1.0 Gbps 75 No 250V AC Material Info Reference - Drawing Numbers Packaging Specification PK-70873-0868 Sales Drawing SD-74301-001 HDM and High Density Metric are trademarks of Amphenol Corporation This document was generated on 05/15/2010 PLEASE CHECK WWW.MOLEX.COM FOR LATEST PART INFORMATION
74301-1100
PDF文档中的物料型号为:MAX31855。

器件简介:MAX31855是一款冷结补偿的逐次逼近寄存器(SAR)ADC,专为K型热电偶温度测量而设计。

引脚分配:该芯片共有8个引脚,包括VCC,GND,CS/SDI,CLK,DO,DGND,CSEL和FLT。

参数特性:包括供电电压范围2.0V至5.5V,测量温度范围-200°C至1372°C等。

功能详解:该芯片具备SPI兼容的三线接口,内部可配置的报警输出,支持多达4路热电偶输入。

应用信息:适用于需要高精度温度测量的工业控制、医疗设备和汽车等领域。

封装信息:提供多种封装形式,如TQFN-16和SOIC-8等。
74301-1100 价格&库存

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