74301-5209

厂商：
MOLEX8
封装：
描述：
74301-5209 - 2.00mm (.079") Pitch HDM® Board-to-Board Backplane Header, Vertical, SMC, PressFit, Ext...

数据手册：

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数据手册
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74301-5209 数据手册

This document was generated on 05/15/2010 PLEASE CHECK WWW.MOLEX.COM FOR LATEST PART INFORMATION Part Number: Status: Overview: Description: 0743015209 Active hdm 2.00mm (.079") Pitch HDM® Board-to-Board Backplane Header, Vertical, SMC, PressFit, Extended PC Tail, Polar/Guide Option, 144 Circuits Documents: Drawing (PDF) RoHS Certificate of Compliance (PDF) Series Backplane Connectors 74301 Backplane PCB Header hdm HDM® N/A image - Reference only EU RoHS China RoHS Compliance Status Not Reviewed REACH SVHC Not Reviewed Halogen-Free Status Not Reviewed Need more information on product environmental compliance? Email productcompliance@molex.com For a multiple part number RoHS Certificate of Compliance, click here Please visit the Contact Us section for any non-product compliance questions. General Product Family Series Application Component Type Overview Product Name Style Physical Circuits (Loaded) Circuits (maximum) Color - Resin Durability (mating cycles max) First Mate / Last Break Guide to Mating Part Keying to Mating Part Material - Metal Material - Plating Mating Material - Plating Termination Material - Resin Number of Columns Number of Pairs Number of Rows Orientation PC Tail Length (in) PC Tail Length (mm) PCB Locator PCB Retention PCB Thickness Recommended (in) PCB Thickness Recommended (mm) Packaging Type Pitch - Mating Interface (in) Pitch - Mating Interface (mm) Pitch - Term. Interface (in) Pitch - Term. Interface (mm) Plating min: Mating (µin) Plating min: Mating (µm) Plating min: Termination (µin) Plating min: Termination (µm) Polarized to PCB Stackable Surface Mount Compatible (SMC) Temperature Range - Operating Termination Interface: Style 144 144 Black, Natural 250 No No None Phosphor Bronze, Stainless Steel Gold Tin-Lead High Temperature Thermoplastic 24 Open Pin Field 6 Vertical 0.276 In 7.00 mm No Yes 0.098 In 2.50 mm Tube 0.079 In 2.00 mm 0.079 In 2.00 mm 30 0.75 15 0.375 No No Yes -55°C to +105°C Through Hole - Compliant Pin Search Parts in this Series 74301Series Electrical Current - Maximum per Contact Data Rate Real Signals (per 25mm) Shielded Voltage - Maximum 1A 1.0 Gbps 75 No 250V AC Material Info Reference - Drawing Numbers Packaging Specification PK-70873-0868 Sales Drawing SD-74301-001 HDM and High Density Metric are trademarks of Amphenol Corporation This document was generated on 05/15/2010 PLEASE CHECK WWW.MOLEX.COM FOR LATEST PART INFORMATION

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74301-5209

1. 物料型号： - 型号：0743015209 - 状态：Active（活跃）

2. 器件简介： - 产品家族：Backplane Connectors（背板连接器） - 系列：74301 - 应用：Backplane（背板） - 组件类型：PCB Header（PCB插座） - 概述：hdm - 产品名称：Active hdm 2.00mm (.079") Pitch HDM® Board-to-Board Backplane Header, Vertical, SMC, PressFit, Extended PC Tail, Polar/Guide Option, 144 Circuits（活动hdm 2.00mm (.079") 间距HDM®板对板背板插座，垂直，SMC，PressFit，扩展PC尾，极性/导向选项，144路）

3. 引脚分配： - 电路（最大）：144 - 列数：24 - 行数：6 - 开放引脚场：对数

4. 参数特性： - 颜色 - 树脂：黑色，自然色 - 耐久性（最大配对周期）：250 - 材料 - 金属：磷青铜，不锈钢 - 材料 - 镀层配对：金 - 材料 - 镀层终止：锡铅 - 材料 - 树脂：高温热塑性塑料 - PCB尾长（英寸）：0.276英寸 - PCB尾长（毫米）PCB定位器：7.00mm否 - PCB保持：是 - PCB厚度推荐（英寸）：0.098英寸 - PCB厚度推荐（毫米）：2.50毫米 - 间距 - 配对界面（英寸）：0.079英寸 - 间距 - 配对界面（毫米）：2.00毫米 - 镀层最小：配对（微英寸）：30 - 镀层最小：配对（微米）：0.75 - 镀层最小：终止（微英寸）：15 - 镀层最小：终止（微米）：0.375

5. 功能详解： - 表面安装兼容（SMC）：是 - 温度范围 - 操作：-55°C至+105°C - 终止接口：通孔 - 合规销

6. 应用信息： - 应用：Backplane（背板）

7. 封装信息： - 包装类型：管装 - 定位：垂直

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