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74649-1007

74649-1007

  • 厂商:

    MOLEX8

  • 封装:

  • 描述:

    74649-1007 - 2.00mm (.079") Pitch 8-Row VHDM-HSD™ Backplane Header, Open Module, 80Circuits, Pin Len...

  • 详情介绍
  • 数据手册
  • 价格&库存
74649-1007 数据手册
This document was generated on 05/27/2010 PLEASE CHECK WWW.MOLEX.COM FOR LATEST PART INFORMATION Part Number: Status: Overview: Description: 0746491007 Active vhdm__hsd 2.00mm (.079") Pitch 8-Row VHDM-HSD™ Backplane Header, Open Module, 80 Circuits, Pin Length 6.25mm (.246") Documents: Drawing (PDF) RoHS Certificate of Compliance (PDF) Series LR19980 E29179 image - Reference only EU RoHS China RoHS RoHS Compliant by Exemption REACH SVHC Contains SVHC: No Halogen-Free Status Halogen-Free Need more information on product environmental compliance? Email productcompliance@molex.com For a multiple part number RoHS Certificate of Compliance, click here Please visit the Contact Us section for any non-product compliance questions. Agency Certification CSA UL General Product Family Series Application Application Tooling Documents Comments Component Type Overview Product Name Style Backplane Connectors 74649 Backplane Tooling Manual Open Header PCB Header vhdm__hsd VHDM-HSD™ N/A Physical Circuits (Loaded) Circuits (maximum) Color - Resin Durability (mating cycles max) First Mate / Last Break Flammability Guide to Mating Part Keying to Mating Part Material - Metal Material - Plating Mating Material - Plating Termination Material - Resin Number of Columns Number of Pairs Number of Rows Orientation PC Tail Length (in) PC Tail Length (mm) PCB Locator PCB Retention PCB Thickness Recommended (in) PCB Thickness Recommended (mm) Packaging Type Pitch - Mating Interface (in) Pitch - Mating Interface (mm) Pitch - Term. Interface (in) Pitch - Term. Interface (mm) Plating min: Mating (µin) Plating min: Mating (µm) Plating min: Termination (µin) 80 80 Black 200 No 94V-0 No None Copper-Nickel-Silicon, High Performance Alloy (HPA) Gold Tin-Lead High Temperature Thermoplastic 10 Open Pin Field 8 Vertical 0.098 In 2.50 mm No None 0.070 In 1.80 mm Tube 0.079 In 2.00 mm 0.079 In 2.00 mm 50 1.25 30 Search Parts in this Series 74649Series Mates With HSD Daughtercards 74680 , 74686 Use With Daughtercard Modules Application Tooling | FAQ Tooling specifications and manuals are found by selecting the products below. Crimp Height Specifications are then contained in the Application Tooling Specification document. Global Description Product # VHDM® Insertion 0622020205 Module for Advanced Mate Signal Header, 8 Row by 10 Wide, 20.00mm (.787") Plating min: Termination (µm) Polarized to PCB Stackable Surface Mount Compatible (SMC) Temperature Range - Operating Termination Interface: Style 0.75 No No Yes -55°C to +105°C Through Hole - Compliant Pin Electrical Current - Maximum per Contact Data Rate Real Signals (per 25mm) Shield Type Shielded Voltage - Maximum 3A 5.0 Gbps 100 Ground Plane Shield Yes 250V Material Info Reference - Drawing Numbers Packaging Specification Sales Drawing VHDM-HSD is a trademark of Amphenol Corporation PK-74060-003 SD-74649-002 This document was generated on 05/27/2010 PLEASE CHECK WWW.MOLEX.COM FOR LATEST PART INFORMATION
74649-1007
### 物料型号 - 型号:0746491007 - 系列:74649

### 器件简介 - 产品名称:VHDM-HSDTM - 类型:PCB Header - 概述:vhdm hsd 2.00mm (.079") 间距,8行VHDM-HSD TM背板头,开模,80个电路,引脚长度6.25mm (.246")。

### 引脚分配 - 电路(已加载):80 - 列数:10 - 行数:8 - 引脚场:开模

### 参数特性 - 耐用性(最大配对周期):200次 - 首次配对/最后断裂:无 - 94V-0可燃性:无 - 金属材质:铜镍-硅,高性能合金(HPA) - 镀层材质:金 - 镀层终止:锡-铅 - 树脂材质:高温热塑性塑料 - 推荐PCB厚度:0.070英寸(1.80毫米)

### 功能详解 - 该连接器适用于背板应用,具有高数据传输率和高电气性能。 - 与HSD女儿卡74680、74686兼容。 - 可与女儿卡模块一起使用。

### 应用信息 - 适用于背板应用,提供高数据率传输和高电气性能。 - 工作温度范围:-55°C至+105°C。 - 符合250V标准。 - 3A引脚电流容量。 - 数据速率:5.0 Gbps。 - 有地平面屏蔽,支持堆叠。

### 封装信息 - 包装类型:管装 - 间距:2.00mm(接口配对和终止界面) - 镀层最小厚度:配对界面1.25微米(50微英寸),终止界面0.30微米(12微英寸)
74649-1007 价格&库存

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