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74649-1101

74649-1101

  • 厂商:

    MOLEX8

  • 封装:

  • 描述:

    74649-1101 - 2.00mm (.079") Pitch 8-Row VHDM-HSD™ Backplane Header, Guide Pin SignalModule, Open End...

  • 详情介绍
  • 数据手册
  • 价格&库存
74649-1101 数据手册
This document was generated on 05/27/2010 PLEASE CHECK WWW.MOLEX.COM FOR LATEST PART INFORMATION Part Number: Status: Overview: Description: 0746491101 Active vhdm__hsd 2.00mm (.079") Pitch 8-Row VHDM-HSD™ Backplane Header, Guide Pin Signal Module, Open End Version, Advanced Mate Shield, 80 Circuits Documents: Drawing (PDF) RoHS Certificate of Compliance (PDF) Series LR19980 image - Reference only EU RoHS China RoHS RoHS Compliant by Exemption REACH SVHC Not Reviewed Halogen-Free Status Not Reviewed Need more information on product environmental compliance? Email productcompliance@molex.com For a multiple part number RoHS Certificate of Compliance, click here Please visit the Contact Us section for any non-product compliance questions. Agency Certification CSA General Product Family Series Application Application Tooling Documents Comments Component Type Overview Product Name Style Backplane Connectors 74649 Backplane Tooling Manual Open Header PCB Header vhdm__hsd VHDM-HSD™ N/A Physical Circuits (Loaded) Circuits (maximum) Color - Resin Durability (mating cycles max) First Mate / Last Break Flammability Guide to Mating Part Keying to Mating Part Material - Metal Material - Plating Mating Material - Plating Termination Material - Resin Number of Columns Number of Pairs Number of Rows Orientation PC Tail Length (in) PC Tail Length (mm) PCB Locator PCB Retention PCB Thickness Recommended (in) PCB Thickness Recommended (mm) Packaging Type Pitch - Mating Interface (in) Pitch - Mating Interface (mm) Pitch - Term. Interface (in) Pitch - Term. Interface (mm) Plating min: Mating (µin) Plating min: Mating (µm) Plating min: Termination (µin) Plating min: Termination (µm) 80 80 Black 200 No 94V-0 No None Copper-Nickel-Silicon, High Performance Alloy (HPA) Gold Tin-Lead High Temperature Thermoplastic 10 Open Pin Field 8 Vertical 0.098 In 2.50 mm No None 0.070 In 1.80 mm Tube 0.079 In 2.00 mm 0.079 In 2.00 mm 30 0.75 30 0.75 Search Parts in this Series 74649Series Mates With HSD Daughtercards 74680 , 74686 Use With Daughtercard Modules Application Tooling | FAQ Tooling specifications and manuals are found by selecting the products below. Crimp Height Specifications are then contained in the Application Tooling Specification document. Global Description Product # VHDM® Insertion 0622020205 Module for Advanced Mate Signal Header, 8 Row by 10 Wide, 20.00mm (.787") Polarized to PCB Stackable Surface Mount Compatible (SMC) Temperature Range - Operating Termination Interface: Style Yes Yes Yes -55°C to +105°C Through Hole - Compliant Pin Electrical Current - Maximum per Contact Data Rate Real Signals (per 25mm) Shield Type Shielded Voltage - Maximum 1A 5.0 Gbps 72 Ground Plane Shield Yes 250V Material Info Reference - Drawing Numbers Packaging Specification Sales Drawing VHDM-HSD is a trademark of Amphenol Corporation PK-74060-003 SD-74649-003 This document was generated on 05/27/2010 PLEASE CHECK WWW.MOLEX.COM FOR LATEST PART INFORMATION
74649-1101
1. 物料型号: - 型号:0746491101 - 状态:Active(激活)

2. 器件简介: - 描述:2.00mm (.079") 间距 8 行 VHDM-HSD™ 背板插座头,导向销信号模块,开口端版本,高级配对防护,80 路。 - 产品家族:背板连接器 - 系列:74649 - 应用:背板 - 组件类型:PCB插座头

3. 引脚分配: - 物理电路(已加载):80 - 最大电路数:80 - 列数:10 - 行数:8 - 垂直方向

4. 参数特性: - 颜色 - 树脂:黑色 - 耐用性(最大插拔次数):200 - 阻燃性:94V-0 - 金属材质:铜镍硅,高性能合金(HPA) - 金属镀层:接触金 - 金属镀层:端子锡铅 - 树脂材质:高温热塑性塑料 - PCB推荐厚度:0.070英寸(1.80毫米) - 接口间距:0.079英寸(2.00毫米)

5. 功能详解应用信息: - VHDM-HSD™ 是 Amphenol Corporation 的注册商标。 - 与HSD女儿卡74680、74686配合使用。 - 与女儿卡模块一起使用。 - 环境合规性:符合EU RoHS、中国RoHS,无卤素状态未审核,REACH SVHC未审核。

6. 封装信息: - 包装类型:管装 - 引脚间距:2.00mm - PCB尾长:0.098英寸(2.50毫米)
74649-1101 价格&库存

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