74649-2507

厂商：
MOLEX8
封装：
描述：
74649-2507 - 2.00mm (.079") Pitch 8-Row VHDM-HSD™ Backplane Header, Open Module, 150Circuits, Pin Le...

数据手册：

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74649-2507 数据手册

This document was generated on 05/27/2010 PLEASE CHECK WWW.MOLEX.COM FOR LATEST PART INFORMATION Part Number: Status: Overview: Description: 0746492507 Active vhdm__hsd 2.00mm (.079") Pitch 8-Row VHDM-HSD™ Backplane Header, Open Module, 150 Circuits, Pin Length 6.25mm (.246") Documents: Drawing (PDF) RoHS Certificate of Compliance (PDF) Series LR19980 image - Reference only EU RoHS China RoHS RoHS Compliant by Exemption REACH SVHC Contains SVHC: No Halogen-Free Status Halogen-Free Need more information on product environmental compliance? Email productcompliance@molex.com For a multiple part number RoHS Certificate of Compliance, click here Please visit the Contact Us section for any non-product compliance questions. Agency Certification CSA General Product Family Series Application Application Tooling Documents Comments Component Type Overview Product Name Style Backplane Connectors 74649 Backplane Tooling Manual Open Header PCB Header vhdm__hsd VHDM-HSD™ N/A Physical Circuits (Loaded) Circuits (maximum) Color - Resin Durability (mating cycles max) First Mate / Last Break Flammability Guide to Mating Part Keying to Mating Part Material - Metal Material - Plating Mating Material - Plating Termination Material - Resin Number of Columns Number of Pairs Number of Rows Orientation PC Tail Length (in) PC Tail Length (mm) PCB Locator PCB Retention PCB Thickness Recommended (in) PCB Thickness Recommended (mm) Packaging Type Pitch - Mating Interface (in) Pitch - Mating Interface (mm) Pitch - Term. Interface (in) Pitch - Term. Interface (mm) Plating min: Mating (µin) Plating min: Mating (µm) Plating min: Termination (µin) Plating min: Termination (µm) 150 150 Black 200 No 94V-0 No None Copper-Nickel-Silicon, High Performance Alloy (HPA) Gold Tin-Lead High Temperature Thermoplastic 25 Open Pin Field 8 Vertical 0.098 In 2.50 mm No None 0.070 In 1.80 mm Tube 0.079 In 2.00 mm 0.079 In 2.00 mm 50 1.25 30 0.75 Search Parts in this Series 74649Series Mates With HSD Daughtercards 74680 , 74686 Use With Daughtercard Modules Application Tooling | FAQ Tooling specifications and manuals are found by selecting the products below. Crimp Height Specifications are then contained in the Application Tooling Specification document. Global Description Product # VHDM® Insertion 0622020206 Module for Advanced Mate Signal Header, 6 Row by 25 Wide, 50.00mm (1.97") Polarized to PCB Stackable Surface Mount Compatible (SMC) Temperature Range - Operating Termination Interface: Style No No Yes -55°C to +105°C Through Hole - Compliant Pin Electrical Current - Maximum per Contact Data Rate Real Signals (per 25mm) Shield Type Shielded Voltage - Maximum 3A 5.0 Gbps 100 Ground Plane Shield Yes 250V Material Info Reference - Drawing Numbers Packaging Specification Sales Drawing VHDM-HSD is a trademark of Amphenol Corporation PK-74060-003 SD-74649-002 This document was generated on 05/27/2010 PLEASE CHECK WWW.MOLEX.COM FOR LATEST PART INFORMATION

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74649-2507

1. 物料型号： - 型号：0746492507 - 系列：74649 - 状态：Active（活跃）

2. 器件简介： - 描述：2.00mm (.079") 间距，8排VHDM-HSD TM背板插座，开放式模块，150电路，引脚长度6.25mm (.246")。 - 产品家族：背板连接器 - 应用：背板 - 组件类型：PCB插座

3. 引脚分配： - 电路（已加载）：150 - 电路（最大）：150 - 列数：25 - 行数：8 - 引脚场：开放式

4. 参数特性： - 颜色 - 树脂：黑色 - 耐用性（最大配对周期）：200 - 首次配对/最后断开：否 - 阻燃性：94V-0 - 金属材质：铜镍硅，高性能合金（HPA） - 配对金属材质：金 - 终止金属材质：锡铅 - 树脂材质：高温热塑性

5. 功能详解： - VHDM®插入模块，用于高级配对信号插座，6行×25宽，50.00mm (1.97")。 - 极化至PCB堆叠，可堆叠表面安装兼容（SMC）。 - 温度范围 - 操作：-55°C至+105°C。 - 接口：通孔合规销3A，5.0 Gbps，100每个25mm的实信号（屏蔽）。 - 屏蔽类型：屏蔽。

6. 应用信息： - 与HSD女儿卡74680、74686配对使用。 - 与女儿卡模块一起使用。

7. 封装信息： - 包装类型：管装。 - 接口间距（英寸）：0.079英寸。 - 接口间距（毫米）：2.00毫米。 - 尾长（英寸）：0.098英寸。 - 尾长（毫米）：2.50毫米。 - PCB厚度推荐（英寸）：0.070英寸。 - PCB厚度推荐（毫米）：1.80毫米。

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