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74650-1051

74650-1051

  • 厂商:

    MOLEX8

  • 封装:

  • 描述:

    74650-1051 - 2.00mm (.079") Pitch 8-Row VHDM-HSD Backplane Header, Guide Pin Signal Module, Pin End ...

  • 详情介绍
  • 数据手册
  • 价格&库存
74650-1051 数据手册
This document was generated on 05/27/2010 PLEASE CHECK WWW.MOLEX.COM FOR LATEST PART INFORMATION Part Number: Status: Overview: Description: 0746501051 Active vhdm__hsd 2.00mm (.079") Pitch 8-Row VHDM-HSD™ Backplane Header, Guide Pin Signal Module, Pin End Version, 60 Circuits, Pin Length Pin Length 4.75mm (.187") Documents: Drawing (PDF) RoHS Certificate of Compliance (PDF) Series LR19980 E29179 image - Reference only EU RoHS China RoHS RoHS Compliant by Exemption REACH SVHC Contains SVHC: No Halogen-Free Status Halogen-Free Need more information on product environmental compliance? Email productcompliance@molex.com For a multiple part number RoHS Certificate of Compliance, click here Please visit the Contact Us section for any non-product compliance questions. Agency Certification CSA UL General Product Family Series Application Application Tooling Documents Comments Component Type Overview Product Name Style Backplane Connectors 74650 Backplane Tooling Manual Keying Position E PCB Header vhdm__hsd VHDM-HSD™ N/A Physical Circuits (Loaded) Circuits (maximum) Color - Resin Durability (mating cycles max) First Mate / Last Break Flammability Guide to Mating Part Keying to Mating Part Material - Metal Material - Plating Mating Material - Plating Termination Material - Resin Number of Columns Number of Pairs Number of Rows Orientation PC Tail Length (in) PC Tail Length (mm) PCB Locator PCB Retention PCB Thickness Recommended (in) PCB Thickness Recommended (mm) Packaging Type Pitch - Mating Interface (in) Pitch - Mating Interface (mm) Pitch - Term. Interface (in) Pitch - Term. Interface (mm) Plating min: Mating (µin) Plating min: Mating (µm) 60 60 Black 200 No 94V-0 Yes Yes Copper-Nickel-Silicon, High Performance Alloy (HPA), Stainless Steel Gold Tin-Lead High Temperature Thermoplastic 10 Open Pin Field 8 Vertical 0.098 In 2.50 mm No None 0.070 In 1.80 mm Tube 0.079 In 2.00 mm 0.079 In 2.00 mm 30 0.75 Search Parts in this Series 74650Series Mates With HSD Daughtercards 74680 , 74686 Use With Daughtercard Modules Application Tooling | FAQ Tooling specifications and manuals are found by selecting the products below. Crimp Height Specifications are then contained in the Application Tooling Specification document. Global Description Product # VHDM® Signal Pin 0622015700 Inserter Repair Tool VHDM® Insertion 0622020205 Module for Advanced Mate Signal Header, 8 Row by 10 Wide, 20.00mm (.787") Plating min: Termination (µin) Plating min: Termination (µm) Polarized to PCB Stackable Surface Mount Compatible (SMC) Temperature Range - Operating Termination Interface: Style 30 0.75 Yes Yes Yes -55°C to +105°C Through Hole - Compliant Pin Electrical Current - Maximum per Contact Data Rate Real Signals (per 25mm) Shield Type Shielded Voltage - Maximum 1A 5.0 Gbps 72 Ground Plane Shield Yes 250V Material Info Reference - Drawing Numbers Packaging Specification Sales Drawing VHDM-HSD is a trademark of Amphenol Corporation PK-74061-003 SD-74650-002 This document was generated on 05/27/2010 PLEASE CHECK WWW.MOLEX.COM FOR LATEST PART INFORMATION
74650-1051
1. 物料型号: - 型号:0746501051

2. 器件简介: - 产品名称:VHDM-HSDTM - 描述:2.00mm (.079") 间距,8行VHDM-HSDTM背板插座,导向销信号模块,销端版本,60路,引脚长度4.75mm (.187")。

3. 引脚分配: - 电路(已加载):60 - 列数:10 - 行数:8 - 开放引脚场:是

4. 参数特性: - 颜色 - 树脂耐用性(最大插拔周期):黑色 - 阻燃性:94V-0 - 导向配合部件:是 - 配合部件键控:是 - 金属材质:铜-镍-硅,高性能合金(HPA),不锈钢 - 配合镀层:金 - 终止镀层:锡-铅 - 树脂材质:高温热塑性塑料 - 垂直方向:垂直 - PCB尾长:2.50mm - 推荐PCB厚度:1.80mm - 包装类型:管装 - 配合界面间距:2.00mm - 终止界面间距:2.00mm - 配合镀层最小厚度:0.75um(30uin)

5. 功能详解: - 极化到PCB:是 - 堆叠:是 - 表面贴装兼容(SMC):是 - 工作温度范围:-55°C至+105°C - 电气电流 - 每个接触最大:1A - 数据速率真实信号(每25mm):5.0 Gbps - 屏蔽类型:地面平面屏蔽 - 屏蔽电压 - 最大:250V

6. 应用信息: - 应用:背板 - 配合使用的HSD女儿卡:74680, 74686

7. 封装信息: - 封装:VHDM-HSDTM - 引脚:垂直 - PCB定位:无 - PCB保持:无
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