74650-2504

74650-2504

  • 厂商:

    MOLEX8

  • 封装:

  • 描述:

    74650-2504 - 2.00mm (.079") Pitch 8-Row VHDM-HSD™ Backplane Header, Guide Pin SignalModule, Pin End ...

  • 详情介绍
  • 数据手册
  • 价格&库存
74650-2504 数据手册
This document was generated on 06/02/2010 PLEASE CHECK WWW.MOLEX.COM FOR LATEST PART INFORMATION Part Number: Status: Overview: Description: 0746502504 Active vhdm__hsd 2.00mm (.079") Pitch 8-Row VHDM-HSD™ Backplane Header, Guide Pin Signal Module, Pin End Version, 150 Circuits, Pin Length 5.15mm (.203") Documents: Drawing (PDF) RoHS Certificate of Compliance (PDF) Series LR19980 image - Reference only EU RoHS China RoHS RoHS Compliant by Exemption REACH SVHC Not Reviewed Halogen-Free Status Halogen-Free Need more information on product environmental compliance? Email productcompliance@molex.com For a multiple part number RoHS Certificate of Compliance, click here Please visit the Contact Us section for any non-product compliance questions. Agency Certification CSA General Product Family Series Application Application Tooling Documents Comments Component Type Overview Product Name Style Backplane Connectors 74650 Backplane Tooling Manual No Keying Position PCB Header vhdm__hsd VHDM-HSD™ N/A Physical Circuits (Loaded) Circuits (maximum) Color - Resin Durability (mating cycles max) First Mate / Last Break Flammability Guide to Mating Part Keying to Mating Part Material - Metal Material - Plating Mating Material - Plating Termination Material - Resin Number of Columns Number of Pairs Number of Rows Orientation PC Tail Length (in) PC Tail Length (mm) PCB Locator PCB Retention PCB Thickness Recommended (in) PCB Thickness Recommended (mm) Packaging Type Pitch - Mating Interface (in) Pitch - Mating Interface (mm) Pitch - Term. Interface (in) Pitch - Term. Interface (mm) Plating min: Mating (µin) Plating min: Mating (µm) Plating min: Termination (µin) 150 150 Black 200 No 94V-0 Yes None Copper-Nickel-Silicon, High Performance Alloy (HPA), Stainless Steel Gold Tin-Lead High Temperature Thermoplastic 25 Open Pin Field 8 Vertical 0.098 In 2.50 mm No None 0.070 In 1.80 mm Tube 0.079 In 2.00 mm 0.079 In 2.00 mm 30 0.75 30 Search Parts in this Series 74650Series Mates With HSD Daughtercards 74680 , 74686 Use With Daughtercard Modules Application Tooling | FAQ Tooling specifications and manuals are found by selecting the products below. Crimp Height Specifications are then contained in the Application Tooling Specification document. Global Description Product # VHDM® Signal Pin 0622015700 Inserter Repair Tool VHDM® Insertion 0622020206 Module for Advanced Mate Signal Header, 6 Row by 25 Wide, 50.00mm (1.97") Plating min: Termination (µm) Polarized to PCB Stackable Surface Mount Compatible (SMC) Temperature Range - Operating Termination Interface: Style 0.75 Yes Yes Yes -55°C to +105°C Through Hole - Compliant Pin Electrical Current - Maximum per Contact Data Rate Real Signals (per 25mm) Shield Type Shielded Voltage - Maximum 1A 5.0 Gbps 72 Ground Plane Shield Yes 250V Material Info Reference - Drawing Numbers Packaging Specification Sales Drawing VHDM-HSD is a trademark of Amphenol Corporation PK-74061-003 SD-74650-002 This document was generated on 06/02/2010 PLEASE CHECK WWW.MOLEX.COM FOR LATEST PART INFORMATION
74650-2504
1. 物料型号: - 型号:0746502504 - 状态:Active(活跃)

2. 器件简介: - 描述:2.00mm (.079") 间距,8排VHDM-HSD™背板插座头,导向销信号模块,销端版本,150路,销长5.15mm (.203")。 - 产品系列:74650 - 应用:背板 - 组件类型:PCB插座头

3. 引脚分配: - 列数:25 - 行数:8 - 垂直方向 - PCB尾长:0.098英寸(2.50mm) - PCB厚度推荐:0.070英寸(1.80mm)

4. 参数特性: - 物理电路(已加载):150 - 最大电路数:150 - 颜色 - 树脂:黑色 - 耐久性(最大插拔次数):200 - 阻燃等级:94V-0 - 金属材质:铜镍硅,高性能合金(HPA),不锈钢 - 镀层:接触金,接触锡铅 - 树脂材质:高温热塑性塑料 - 间距 - 接口:0.079英寸(2.00mm)

5. 功能详解应用信息: - 与HSD女儿卡74680、74686配合使用 - 工作温度范围:-55°C至+105°C - 电气电流 - 每个接触最大:1A - 数据速率:5.0 Gbps - 真实信号(每25mm):72 - 屏蔽类型:有地平面屏蔽 - 最大电压:250V

6. 封装信息: - 包装类型:管装 - 引脚极性:极化至PCB
74650-2504 价格&库存

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