74651-2503

74651-2503

  • 厂商:

    MOLEX8

  • 封装:

  • 描述:

    74651-2503 - 2.00mm (.079") Pitch 8-Row VHDM-HSD™ Backplane Header, Guide Pin Signal Module, Shield ...

  • 详情介绍
  • 数据手册
  • 价格&库存
74651-2503 数据手册
This document was generated on 05/27/2010 PLEASE CHECK WWW.MOLEX.COM FOR LATEST PART INFORMATION Part Number: Status: Overview: Description: 0746512503 Active vhdm__hsd 2.00mm (.079") Pitch 8-Row VHDM-HSD™ Backplane Header, Guide Pin Signal Module, Shield End Version, 150 Circuits, Pin Length 4.25mm (.167") Documents: Drawing (PDF) RoHS Certificate of Compliance (PDF) Series LR19980 E29179 image - Reference only EU RoHS China RoHS RoHS Compliant by Exemption REACH SVHC Not Reviewed Halogen-Free Status Not Reviewed Need more information on product environmental compliance? Email productcompliance@molex.com For a multiple part number RoHS Certificate of Compliance, click here Please visit the Contact Us section for any non-product compliance questions. Agency Certification CSA UL General Product Family Series Application Application Tooling Documents Comments Component Type Overview Product Name Style Backplane Connectors 74651 Backplane Tooling Manual No Keying Position PCB Header vhdm__hsd VHDM-HSD™ N/A Physical Circuits (Loaded) Circuits (maximum) Color - Resin Durability (mating cycles max) First Mate / Last Break Flammability Guide to Mating Part Keying to Mating Part Material - Metal Material - Plating Mating Material - Plating Termination Material - Resin Number of Columns Number of Pairs Number of Rows Orientation PC Tail Length (in) PC Tail Length (mm) PCB Locator PCB Retention PCB Thickness Recommended (in) PCB Thickness Recommended (mm) Packaging Type Pitch - Mating Interface (in) Pitch - Mating Interface (mm) Pitch - Term. Interface (in) Pitch - Term. Interface (mm) Plating min: Mating (µin) Plating min: Mating (µm) 150 150 Black 200 No 94V-0 Yes None Copper-Nickel-Silicon, High Performance Alloy (HPA), Stainless Steel Gold Tin-Lead High Temperature Thermoplastic 25 Open Pin Field 8 Vertical 0.098 In 2.50 mm No None 0.070 In 1.80 mm Tube 0.079 In 2.00 mm 0.079 In 2.00 mm 30 0.75 Search Parts in this Series 74651Series Mates With HSD Daughtercards 74680 , 74686 Application Tooling | FAQ Tooling specifications and manuals are found by selecting the products below. Crimp Height Specifications are then contained in the Application Tooling Specification document. Global Description Product # VHDM® Signal Pin 0622015700 Inserter Repair Tool VHDM® Insertion 0622020206 Module for Advanced Mate Signal Header, 6 Row by 25 Wide, 50.00mm (1.97") Plating min: Termination (µin) Plating min: Termination (µm) Polarized to PCB Stackable Surface Mount Compatible (SMC) Temperature Range - Operating Termination Interface: Style 30 0.75 Yes Yes Yes -55°C to +105°C Through Hole - Compliant Pin Electrical Current - Maximum per Contact Data Rate Real Signals (per 25mm) Shield Type Shielded Voltage - Maximum 1A 5.0 Gbps 72 Ground Plane Shield Yes 120V AC (RMS)/DC Material Info Reference - Drawing Numbers Packaging Specification Sales Drawing VHDM-HSD is a trademark of Amphenol Corporation PK-74061-003 SD-74651-002 This document was generated on 05/27/2010 PLEASE CHECK WWW.MOLEX.COM FOR LATEST PART INFORMATION
74651-2503
物料型号: - 型号:0746512503

器件简介: - 描述:2.00mm (.079") 间距 8-行 VHDM-HSD TM 背板插座,导向销信号模块,屏蔽端版本,150路,引脚长度4.25mm (.167")。 - 产品系列:74651 - 应用:背板 - 组件类型:PCB插座

引脚分配: - 电路数(已装填):150 - 电路数(最大):150 - 无键位位置

参数特性: - 耐用性(最大插拔次数):200次 - 首次配对/最后断开:否 - 材料-金属:铜-镍-硅,高性能合金(HPA) - 材料-镀层配对:不锈钢金 - 材料-镀层终止:锡-铅 - 材料-树脂:高温热塑性塑料 - 列数:25 - 对数:开引脚场 - 行数:8 - 方向:垂直 - PCB尾长(英寸):0.098英寸 - PCB尾长(毫米):2.50毫米 - PCB厚度推荐(英寸):0.070英寸 - PCB厚度推荐(毫米):1.80毫米 - 包装类型:管装 - 接口间距-配对接口(英寸):0.079英寸 - 接口间距-配对接口(毫米):2.00毫米 - 接口间距-终端接口(英寸):0.079英寸 - 接口间距-终端接口(毫米):2.00毫米 - 镀层最小:配对(微英寸):30 - 镀层最小:配对(微米):0.75

功能详解: - 极化至PCB:是 - 可堆叠:是 - 表面安装兼容(SMC):是 - 工作温度范围:-55°C至+105°C - 电气电流-每个接触最大:1A - 数据速率:5.0 Gbps - 72接地平面屏蔽 - 屏蔽类型:屏蔽电压-最大:120V交流(RMS)/直流

应用信息: - 与HSD母卡兼容:74680、74686

封装信息: - 封装类型:PK-74061-003 - 销售图纸:SD-74651-002
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