74695-2501

厂商：
MOLEX8
封装：
描述：
74695-2501 - 2.00mm (.079") Pitch 5-Row VHDM-HSD™ Backplane Header, Open Module, 100Circuits, Pin Le...

数据手册：

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数据手册
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74695-2501 数据手册

This document was generated on 06/08/2010 PLEASE CHECK WWW.MOLEX.COM FOR LATEST PART INFORMATION Part Number: Status: Overview: Description: 0746952501 Active vhdm__hsd 2.00mm (.079") Pitch 5-Row VHDM-HSD™ Backplane Header, Open Module, 100 Circuits, Pin Length 4.75mm (.187") Documents: Drawing (PDF) RoHS Certificate of Compliance (PDF) Series LR19880 image - Reference only EU RoHS China RoHS RoHS Compliant by Exemption REACH SVHC Not Reviewed Halogen-Free Status Not Reviewed Need more information on product environmental compliance? Email productcompliance@molex.com For a multiple part number RoHS Certificate of Compliance, click here Please visit the Contact Us section for any non-product compliance questions. Agency Certification CSA General Product Family Series Application Application Tooling Documents Comments Component Type Overview Product Name Style Backplane Connectors 74695 Backplane Tooling Manual Open Header PCB Header vhdm__hsd VHDM-HSD™ N/A Physical Circuits (Loaded) Circuits (maximum) Color - Resin Durability (mating cycles max) First Mate / Last Break Flammability Guide to Mating Part Keying to Mating Part Material - Metal Material - Plating Mating Material - Plating Termination Material - Resin Number of Columns Number of Pairs Number of Rows Orientation PCB Retention PCB Thickness Recommended (in) PCB Thickness Recommended (mm) Packaging Type Pitch - Mating Interface (in) Pitch - Mating Interface (mm) Plating min: Mating (µin) Plating min: Mating (µm) Plating min: Termination (µin) Plating min: Termination (µm) Polarized to PCB Surface Mount Compatible (SMC) Temperature Range - Operating Termination Interface: Style 100 100 Black 200 No 94V-0 No None High Performance Alloy (HPA) Gold Tin-Lead High Temperature Thermoplastic 25 Open Pin Field 5 Vertical None 0.070 In 1.80 mm Tube 0.079 In 2.00 mm 30 0.75 30 0.75 Yes Yes -55°C to +105°C Through Hole - Compliant Pin Search Parts in this Series 74695Series Mates With 74670 HSD Daughtercard Application Tooling | FAQ Tooling specifications and manuals are found by selecting the products below. Crimp Height Specifications are then contained in the Application Tooling Specification document. Global Description Product # VHDM® Signal Pin 0622015700 Inserter Repair Tool VHDM® 5 Row Pin 0622015810 and Shield Repair Tool VHDM® 5 Row 0622016010 Shield Extraction Tool VHDM-HSD™ Signal 0622020202 Header, 5 Row by Electrical Current - Maximum per Contact Data Rate Shielded Voltage - Maximum 1A 5.0 Gbps Yes 120V AC (RMS)/DC 25 Wide, 50.00mm (1.97") Material Info Reference - Drawing Numbers Packaging Specification Sales Drawing VHDM-HSD is a trademark of Amphenol Corporation PK-74695-003 SD-74695-002 This document was generated on 06/08/2010 PLEASE CHECK WWW.MOLEX.COM FOR LATEST PART INFORMATION

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74695-2501

1. 物料型号： - 型号：0746952501 - 状态：Active - 描述：5-Row VHDM-HSD™ Backplane Header, Open Module, 100 Circuits, Pin Length 4.75mm (.187")。

2. 器件简介： - 产品家族：Backplane Connectors - 系列：74695 - 应用：Backplane - 组件类型：PCB Header - 产品名称：VHDM-HSD™ - 物理电路（已加载）：100 - 最大电路数：100 - 颜色：黑色树脂 - 耐用性（最大插拔次数）：200次 - 阻燃等级：94V-0 - 材料：金属部分为高性能合金（HPA），树脂部分为高温热塑性塑料。 - 镀层：接触区域为金，PCB尾部为锡铅或亚光锡，整体镍镀层。

3. 引脚分配： - 列数：25 - 行数：5 - 开放引脚场：无 - 垂直方向。

4. 参数特性： - 配合界面间距：2.00mm（0.079"） - 推荐PCB厚度：1.80mm（0.070"） - 镀层最小厚度：接触区域金0.75µm（30µin），尾部锡铅0.75µm（30µin）。 - 极性：是，与PCB极性匹配。 - 表面贴装兼容性：是。

5. 功能详解： - 该连接器支持高达5.0 Gbps的数据传输速率，并且每个接触点最大电流为1A。 - 电压：屏蔽电压最大120V AC（RMS）/DC。

6. 应用信息： - 与74670 HSD Daughtercard配合使用。 - 工具文档提供了修理工具和安装工具的详细信息。

7. 封装信息： - 包装类型：管装。 - 配合界面间距：2.00mm（0.079"）。

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