SD-73780-001

SD-73780-001

  • 厂商:

    MOLEX8

  • 封装:

  • 描述:

    SD-73780-001 - 2.00mm (.079") Pitch HDM® Board-to-Board Daughtercard Receptacle - Molex Electronics ...

  • 详情介绍
  • 数据手册
  • 价格&库存
SD-73780-001 数据手册
This document was generated on 05/14/2010 PLEASE CHECK WWW.MOLEX.COM FOR LATEST PART INFORMATION Part Number: Status: Overview: Description: 0737803156 Active hdm 2.00mm (.079") Pitch HDM® Board-to-Board Daughtercard Receptacle, Vertical, Signal Module, 144 Circuits, Mounted Height 16.00mm (.630"), Pin Length 3.50mm (.138"), Press Fit Documents: Drawing (PDF) Product Specification PS-73780-999 (PDF) RoHS Certificate of Compliance (PDF) Series image - Reference only General Product Family Series Application Comments Component Type Overview Product Name Style Backplane Connectors 73780 Daughtercard, Mezzanine Press Fit Tail PCB Receptacle hdm HDM® N/A EU RoHS China RoHS Compliance Status Not Reviewed REACH SVHC Not Reviewed Halogen-Free Status Not Reviewed Need more information on product environmental compliance? Email productcompliance@molex.com For a multiple part number RoHS Certificate of Compliance, click here Please visit the Contact Us section for any non-product compliance questions. Physical Circuits (Loaded) Circuits (maximum) Color - Resin Durability (mating cycles max) First Mate / Last Break Guide to Mating Part Keying to Mating Part Material - Metal Material - Plating Mating Material - Plating Termination Material - Resin Number of Columns Number of Pairs Number of Rows Orientation PC Tail Length (in) PC Tail Length (mm) PCB Locator PCB Retention PCB Thickness Recommended (in) PCB Thickness Recommended (mm) Packaging Type Pitch - Mating Interface (in) Pitch - Mating Interface (mm) Pitch - Term. Interface (in) Pitch - Term. Interface (mm) Plating min: Mating (µin) Plating min: Mating (µm) Plating min: Termination (µin) Plating min: Termination (µm) Polarized to PCB Stackable Surface Mount Compatible (SMC) Temperature Range - Operating 144 144 Black 250 No No None Copper-Nickel-Tin Gold Tin-Lead High Temperature Thermoplastic 24 Open Pin Field 6 Vertical 0.138 In 3.50 mm No None 0.063 In 1.60 mm Tube 0.079 In 2.00 mm 0.079 In 2.00 mm 30 0.75 35 0.88 No Yes Yes -55°C to +105°C Search Parts in this Series 73780Series Mates With HDM® Board-to-Board Backplane Header 73642 , 73643 , 73644 , 73942 , 73943 , 73944 , 74349 , 74428. HDM® Board-toBoard Stacking Header 73769 , 73770 , 73782 , 73783 , 73771 Termination Interface: Style Through Hole - Compliant Pin Electrical Current - Maximum per Contact Data Rate Real Signals (per 25mm) Shielded Voltage - Maximum 15A, 1A 1.0 Gbps 75 No 250V AC Material Info Reference - Drawing Numbers Product Specification PS-73780-999 Sales Drawing SD-73780-001 HDM and High Density Metric are trademarks of Amphenol Corporation This document was generated on 05/14/2010 PLEASE CHECK WWW.MOLEX.COM FOR LATEST PART INFORMATION
SD-73780-001
物料型号:0737803156

器件简介: - 产品系列:73780 - 应用:Daughtercard, Mezzanine - 组件类型:PCB Receptacle - 概述:2.00mm (.079") Pitch HDM® Board-to-Board Daughtercard Receptacle, Vertical, Signal Module, 144 Circuits, Mounted Height 16.00mm (.630"), Pin Length 3.50mm (.138"), Press Fit

引脚分配: - 列数:24 - 行数:6 - 电路数(已加载):144

参数特性: - 颜色 - 树脂:黑色 - 耐久性(最大插配次数):250 - 金属材质:铜镍锡合金 - 插配接口镀层:金 - 终止接口镀层:锡铅 - 树脂材质:耐高温热塑性塑料 - 推荐PCB厚度:1.60mm (0.063 In) - 接口间距:2.00mm (0.079 In) - 插配接口镀层最小厚度:0.75um (30uin) - 终止接口镀层最小厚度:0.88um (35uin) - 操作温度范围:-55°C 至 +105°C

功能详解: - 最大每接触电流:15A, 1A - 数据速率:1.0 Gbps - 屏蔽:否 - 电压 - 最大:250V AC

应用信息: - 与HDM® Board-to-Board Backplane Header 73642, 73643, 73644, 73942, 73943, 73944, 74349, 74428和HDM® Board-to-Board Stacking Header 73769, 73770, 73782, 73783, 73771兼容

封装信息: - 封装类型:Tube - 引脚长度:3.50mm (0.138 In) - 垂直方向:是
SD-73780-001 价格&库存

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