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SD-74300-004

SD-74300-004

  • 厂商:

    MOLEX8

  • 封装:

  • 描述:

    SD-74300-004 - 2.00mm (.079") Pitch HDM® Board-to-Board Daughtercard - Molex Electronics Ltd.

  • 详情介绍
  • 数据手册
  • 价格&库存
SD-74300-004 数据手册
This document was generated on 05/15/2010 PLEASE CHECK WWW.MOLEX.COM FOR LATEST PART INFORMATION Part Number: Status: Overview: Description: 0743000123 Active hdm 2.00mm (.079") Pitch HDM® Board-to-Board Daughtercard Receptacle, Vertical, Signal Module, with Guide, 72 Circuits, Mounted Height 13.00mm (.512"), Pin Length 2.00mm (.079"), Lead-Free Documents: 3D Model Drawing (PDF) Product Specification PS-73780-999 (PDF) RoHS Certificate of Compliance (PDF) image - Reference only Series General Product Family Series Application Component Type Overview Product Name Style Backplane Connectors 74300 Daughtercard, Mezzanine PCB Receptacle hdm HDM® N/A EU RoHS China RoHS ELV and RoHS Compliant REACH SVHC Not Reviewed Halogen-Free Status Not Reviewed Need more information on product environmental compliance? Email productcompliance@molex.com For a multiple part number RoHS Certificate of Compliance, click here Please visit the Contact Us section for any non-product compliance questions. Physical Circuits (Loaded) Circuits (maximum) Color - Resin Durability (mating cycles max) First Mate / Last Break Guide to Mating Part Keying to Mating Part Material - Metal Material - Plating Mating Material - Plating Termination Material - Resin Number of Columns Number of Pairs Number of Rows Orientation PC Tail Length (in) PC Tail Length (mm) PCB Locator PCB Retention PCB Thickness Recommended (in) PCB Thickness Recommended (mm) Packaging Type Pitch - Mating Interface (in) Pitch - Mating Interface (mm) Pitch - Term. Interface (in) Pitch - Term. Interface (mm) Plating min: Mating (µin) Plating min: Mating (µm) Plating min: Termination (µin) Plating min: Termination (µm) Polarized to PCB Stackable Surface Mount Compatible (SMC) Temperature Range - Operating Termination Interface: Style 72 72 Black 250 No Yes None Copper-Nickel-Tin Gold Matte Tin High Temperature Thermoplastic 12 Open Pin Field 6 Vertical 0.079 In 2.00 mm No None 0.063 In 1.60 mm Tube 0.079 In 2.00 mm 0.079 In 2.00 mm 30 0.76 100 2.50 No Yes Yes -55°C to +105°C Through Hole - Compliant Pin Search Parts in this Series 74300Series Mates With HDM® Board-to-Board Backplane Header 73642 , 73643 , 73644 , 74349 , 74428 , 73769 , 73781 , 73770 , 73782 , 73783 , 73771 Electrical Current - Maximum per Contact Data Rate Real Signals (per 25mm) Shielded Voltage - Maximum 1A 1.0 Gbps 76 Yes 250V AC Material Info Reference - Drawing Numbers Product Specification PS-73780-999 Sales Drawing SD-74300-004 HDM and High Density Metric are trademarks of Amphenol Corporation This document was generated on 05/15/2010 PLEASE CHECK WWW.MOLEX.COM FOR LATEST PART INFORMATION
SD-74300-004
1. 物料型号: - 型号:0743000123

2. 器件简介: - 产品家族:Backplane Connectors - 系列:74300 - 应用:Daughtercard, Mezzanine - 组件类型:PCB Receptacle - 概述:HDM 2.00mm (.079") Pitch HDM® Board-to-Board Daughtercard Receptacle, Vertical, Signal Module, with Guide, 72 Circuits, Mounted Height 13.00mm (.512"), Pin Length 2.00mm (.079"), Lead-Free

3. 引脚分配: - 引脚数:72 - 列数:12 - 行数:6 - 引脚间距:2.00mm (0.079") Pitch

4. 参数特性: - 颜色 - 树脂:黑色 - 耐久性(最大插拔次数):250 - 导向配合部分:是 - 金属材质:铜镍锡 - 配合接口镀层:金 - 终止接口镀层:亚光锡 - 树脂材质:高温热塑性塑料 - PCB厚度推荐:1.60mm - 配合接口间距:2.00mm - 终止接口间距:2.00mm - 镀层最小厚度-配合:0.76um - 镀层最小厚度-终止:2.50um - 极性到PCB:否 - 可堆叠:是 - 表面安装兼容(SMC):是 - 操作温度范围:-55°C到+105°C

5. 功能详解: - 该器件是一个垂直安装的HDM®板对板女儿卡插座,具有72个电路,支持高密度连接。

6. 应用信息: - 适用于板卡、夹层卡等应用。
SD-74300-004 价格&库存

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