SD-74650-002

厂商：
MOLEX8
封装：
描述：
SD-74650-002 - 2.00mm (.079") Pitch 8-Row VHDM-HSD™ Backplane Header - Molex Electronics Ltd.

数据手册：

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数据手册
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SD-74650-002 数据手册

This document was generated on 06/02/2010 PLEASE CHECK WWW.MOLEX.COM FOR LATEST PART INFORMATION Part Number: Status: Overview: Description: 0746501004 Active vhdm__hsd 2.00mm (.079") Pitch 8-Row VHDM-HSD™ Backplane Header, Guide Pin Signal Module, Pin End Version, 60 Circuits, Pin Length 5.15mm (.203") Documents: Drawing (PDF) RoHS Certificate of Compliance (PDF) Series LR19980 E29179 image - Reference only EU RoHS China RoHS RoHS Compliant by Exemption REACH SVHC Not Reviewed Halogen-Free Status Halogen-Free Need more information on product environmental compliance? Email productcompliance@molex.com For a multiple part number RoHS Certificate of Compliance, click here Please visit the Contact Us section for any non-product compliance questions. Agency Certification CSA UL General Product Family Series Application Application Tooling Documents Comments Component Type Overview Product Name Style Backplane Connectors 74650 Backplane Tooling Manual No Keying Position PCB Header vhdm__hsd VHDM-HSD™ N/A Physical Circuits (Loaded) Circuits (maximum) Color - Resin Durability (mating cycles max) First Mate / Last Break Flammability Guide to Mating Part Keying to Mating Part Material - Metal Material - Plating Mating Material - Plating Termination Material - Resin Number of Columns Number of Pairs Number of Rows Orientation PC Tail Length (in) PC Tail Length (mm) PCB Locator PCB Retention PCB Thickness Recommended (in) PCB Thickness Recommended (mm) Packaging Type Pitch - Mating Interface (in) Pitch - Mating Interface (mm) Pitch - Term. Interface (in) Pitch - Term. Interface (mm) Plating min: Mating (µin) Plating min: Mating (µm) 60 60 Black 200 No 94V-0 Yes None Copper-Nickel-Silicon, High Performance Alloy (HPA), Stainless Steel Gold Tin-Lead High Temperature Thermoplastic 10 Open Pin Field 8 Vertical 0.098 In 2.50 mm No None 0.070 In 1.80 mm Tube 0.079 In 2.00 mm 0.079 In 2.00 mm 30 0.75 Search Parts in this Series 74650Series Mates With HSD Daughtercards 74680 , 74686 Use With Daughtercard Modules Application Tooling | FAQ Tooling specifications and manuals are found by selecting the products below. Crimp Height Specifications are then contained in the Application Tooling Specification document. Global Description Product # VHDM® Signal Pin 0622015700 Inserter Repair Tool VHDM® Insertion 0622020205 Module for Advanced Mate Signal Header, 8 Row by 10 Wide, 20.00mm (.787") Plating min: Termination (µin) Plating min: Termination (µm) Polarized to PCB Stackable Surface Mount Compatible (SMC) Temperature Range - Operating Termination Interface: Style 30 0.75 Yes Yes Yes -55°C to +105°C Through Hole - Compliant Pin Electrical Current - Maximum per Contact Data Rate Real Signals (per 25mm) Shield Type Shielded Voltage - Maximum 1A 5.0 Gbps 72 Ground Plane Shield Yes 250V Material Info Reference - Drawing Numbers Packaging Specification Sales Drawing VHDM-HSD is a trademark of Amphenol Corporation PK-74061-003 SD-74650-002 This document was generated on 06/02/2010 PLEASE CHECK WWW.MOLEX.COM FOR LATEST PART INFORMATION

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SD-74650-002

1. 物料型号： - 型号：0746501004 - 符合中国RoHS标准。

2. 器件简介： - 产品名称：VHDM-HSD™ Backplane Header - 描述：2.00mm (.079") 间距，8行VHDM-HSD™背板头，导向销信号模块，销端版本，60路，销长5.15mm (.203")。

3. 引脚分配： - 电路（已加载）：60 - 电路（最大）：60 - 列数：10 - 行数：8 - 垂直方向。

4. 参数特性： - 颜色 - 树脂：黑色 - 耐久性（最大插拔次数）：200次 - 阻燃性：94V-0 - 金属材质：铜-镍-硅，高性能合金（HPA），不锈钢 - 镀层 - 插接：金 - 镀层 - 终止：锡-铅 - 树脂材质：高温热塑性塑料 - PCB厚度推荐：0.070英寸（1.80毫米）

5. 功能详解： - VHDM-HSD™是一种高密度信号背板连接器，适用于背板应用。 - 无键位位置。 - 无PCB定位器。 - 无PCB固定。 - 包装类型：管装。

6. 应用信息： - 应用：背板 - 与HSD女儿卡74680、74686配合使用。 - 与女儿卡模块一起使用。

7. 封装信息： - 插脚长度：0.098英寸（2.50毫米） - 间距 - 插接界面：0.079英寸（2.00毫米） - 间距 - 终止界面：0.079英寸（2.00毫米）

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