SDA-70553-0002

SDA-70553-0002

  • 厂商:

    MOLEX8

  • 封装:

  • 描述:

    SDA-70553-0002 - 2.54mm (.100") Pitch SL™ Header, Low Profile - Molex Electronics Ltd.

  • 详情介绍
  • 数据手册
  • 价格&库存
SDA-70553-0002 数据手册
This document was generated on 06/07/2010 PLEASE CHECK WWW.MOLEX.COM FOR LATEST PART INFORMATION Part Number: Status: Overview: Description: 0705530002 Active cgrid__sl_products 2.54mm (.100") Pitch SL™ Header, Low Profile, Single Row, Right Angle, .120" Pocket, Shrouded, 3 Circuits, 0.38µm (15µ") Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating Series Product Specification PS-70400 (PDF) Product Specification PS-70541 (PDF) RoHS Certificate of Compliance (PDF) image - Reference only EU RoHS China RoHS ELV and RoHS Compliant REACH SVHC Not Reviewed Halogen-Free Status Not Halogen-Free Need more information on product environmental compliance? Email productcompliance@molex.com For a multiple part number RoHS Certificate of Compliance, click here Please visit the Contact Us section for any non-product compliance questions. Documents: 3D Model Drawing (PDF) Packaging Specification (PDF) Agency Certification CSA UL LR19980 E29179 General Product Family Series Application MolexKits Overview Product Name PCB Headers 70553 Wire-to-Board Yes cgrid__sl_products SL™ Physical Breakaway Circuits (Loaded) Circuits (maximum) Color - Resin Durability (mating cycles max) Flammability Glow-Wire Compliant Guide to Mating Part Lock to Mating Part Material - Metal Material - Plating Mating Material - Plating Termination Material - Resin Number of Rows Orientation PC Tail Length (in) PC Tail Length (mm) PCB Locator PCB Retention PCB Thickness Recommended (in) PCB Thickness Recommended (mm) Packaging Type Pitch - Mating Interface (in) Pitch - Mating Interface (mm) Plating min: Mating (µin) Plating min: Mating (µm) Plating min: Termination (µin) Plating min: Termination (µm) Polarized to Mating Part Shrouded Stackable No 3 3 Black 50 94V-0 No Yes Yes Brass, Phosphor Bronze Gold Tin High Temperature Thermoplastic 1 Right Angle 0.130 In 3.30 mm No None 0.062 In 1.60 mm Tube 0.100 In 2.54 mm 15 0.375 75 1.875 Yes Fully No Search Parts in this Series 70553Series Mates With 70066n , 70066g , 70430g , 70400g Housing Temperature Range - Operating Termination Interface: Style -40°C to +105°C Through Hole Electrical Current - Maximum per Contact Voltage - Maximum 3A 250V Solder Process Data Duration at Max. Process Temperature (seconds) Lead-free Process Capability Max. Cycles at Max. Process Temperature Process Temperature max. C 3 Wave Capable (TH only) 1 260 Material Info Reference - Drawing Numbers Packaging Specification Product Specification Sales Drawing PK-70873-0015 PS-70400, PS-70541 SDA-70553-**** This document was generated on 06/07/2010 PLEASE CHECK WWW.MOLEX.COM FOR LATEST PART INFORMATION
SDA-70553-0002
1. 物料型号: - 型号:0705530002 - 状态:Active(活跃)

2. 器件简介: - 描述:Shrouded, 3 Circuits, 0.38um (15 ") Gold (Au) Selective Plating, Tin (Sn) PC Tail - 产品名称:SLTM - 系列:70553 - 应用:Wire-to-Board(线对板) - Molex Kits:Yes(是)

3. 引脚分配: - 电路数(已加载):3 - 最大电路数:3 - 引脚排列:右角

4. 参数特性: - 颜色 - 树脂耐用性(最大插拔次数):黑色 - 50次 - 阻燃性:94V-0 - 符合灼热丝测试:否 - 导向配合部件:是 - 锁定到配合部件:是 - 金属材质:黄铜,磷青铜 - 镀层配合:金 - 镀层终止:锡 - 树脂材质:高温热塑性塑料 - PCB尾长:0.130英寸(3.30毫米) - PCB厚度推荐:0.062英寸(1.60毫米) - 间距 - 配合接口:0.100英寸(2.54毫米) - 镀层最小:配合(微英寸):15 - 镀层最小:配合(微米):0.375 - 镀层最小:终止(微英寸):75 - 镀层最小:终止(微米):1.875 - 极化到配合部件:是 - 全覆盖:完全 - 可堆叠:否

5. 功能详解: - 工作温度范围:-40°C至+105°C - 电气:最大电流每接触3A,最大电压250V - 焊接过程数据:最大过程温度下持续时间3秒,波峰焊能力(仅限TH)260,无铅过程能力,最大过程温度下的周期数,最大过程温度C

6. 应用信息: - 与70066n、70066g、70430g、70400g外壳配合使用

7. 封装信息: - 包装类型:管装 - 引脚间距:2.54毫米
SDA-70553-0002 价格&库存

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