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SDA-70553-0118

SDA-70553-0118

  • 厂商:

    MOLEX8

  • 封装:

  • 描述:

    SDA-70553-0118 - 2.54mm (.100") Pitch SL™ Header - Molex Electronics Ltd.

  • 详情介绍
  • 数据手册
  • 价格&库存
SDA-70553-0118 数据手册
This document was generated on 05/28/2010 PLEASE CHECK WWW.MOLEX.COM FOR LATEST PART INFORMATION Part Number: Status: Overview: Description: 0705530118 Active cgrid__sl_products 2.54mm (.100") Pitch SL™ Header, Low Profile, Single Row, Right Angle, .120" Pocket, Shrouded, 14 Circuits, 0.76µm (30µ") Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating Series Product Specification PS-70400 (PDF) Product Specification PS-70541 (PDF) RoHS Certificate of Compliance (PDF) image - Reference only EU RoHS China RoHS ELV and RoHS Compliant REACH SVHC Not Reviewed Halogen-Free Status Not Reviewed Need more information on product environmental compliance? Email productcompliance@molex.com For a multiple part number RoHS Certificate of Compliance, click here Please visit the Contact Us section for any non-product compliance questions. Documents: 3D Model Drawing (PDF) Packaging Specification (PDF) Agency Certification CSA UL LR19980 E29179 General Product Family Series Application Overview Product Name PCB Headers 70553 Wire-to-Board cgrid__sl_products SL™ Physical Breakaway Circuits (Loaded) Circuits (maximum) Color - Resin Durability (mating cycles max) Flammability Glow-Wire Compliant Guide to Mating Part Lock to Mating Part Material - Metal Material - Plating Mating Material - Plating Termination Material - Resin Number of Rows Orientation PC Tail Length (in) PC Tail Length (mm) PCB Locator PCB Retention PCB Thickness Recommended (in) PCB Thickness Recommended (mm) Packaging Type Pitch - Mating Interface (in) Pitch - Mating Interface (mm) Plating min: Mating (µin) Plating min: Mating (µm) Plating min: Termination (µin) Plating min: Termination (µm) Polarized to Mating Part Shrouded Stackable Temperature Range - Operating No 14 14 Black 50 94V-0 No Yes Yes Brass, Phosphor Bronze Gold Tin High Temperature Thermoplastic 1 Right Angle 0.130 In 3.30 mm No None 0.062 In 1.60 mm Tube 0.100 In 2.54 mm 30 0.75 75 1.875 Yes Fully No -40°C to +105°C Search Parts in this Series 70553Series Mates With 70066n , 70066g , 70430g , 70400g Housing Termination Interface: Style Through Hole Electrical Current - Maximum per Contact Voltage - Maximum 3A 250V Solder Process Data Lead-free Process Capability Wave Capable (TH only) Material Info Reference - Drawing Numbers Packaging Specification Product Specification Sales Drawing PK-70873-0015 PS-70400, PS-70541 SDA-70553-**** This document was generated on 05/28/2010 PLEASE CHECK WWW.MOLEX.COM FOR LATEST PART INFORMATION
SDA-70553-0118
物料型号: - 型号:0705530118

器件简介: - 状态:Active(活跃) - 描述:cgrid si products Plating,Shrouded(带护罩),14 Circuits(14个电路),0.76um(30)Gold(Au)Selective Plating(选择性镀金),Tin(Sn)PC Tai(锡)

引脚分配: - 电路(已加载):14 - 最大电路数:14

参数特性: - 颜色 - 树脂:黑色 - 耐用性(最大插拔次数):50 - 阻燃性:94V-0 - 符合灼热丝测试:否 - 导向到配合部件锁定到配合部件:是 - 材料 - 金属:黄铜,磷青铜 - 材料 - 镀层 - 配合:金 - 材料 - 镀层 - 终止:锡 - 材料 - 树脂:高温热塑性塑料 - 行数:1 - 方向:直角 - PC尾长(英寸):0.130 In - PC尾长(毫米):3.30 mm - PCB定位器:否 - PCB保持:无 - 推荐PCB厚度(英寸):0.062 In - 推荐PCB厚度(毫米):1.60 mm - 包装类型:管装 - 间距 - 配合接口(英寸):0.100 In - 间距 - 配合接口(毫米):2.54 mm - 镀层最小:配合(um):0.75 - 镀层最小:终止(um):1.875 - 极化到配合部件:是 - 带护罩:完全 - 可堆叠:否 - 工作温度范围:-40°C至+105°C

功能详解: - 产品系列:PCB Headers 70553 - 应用:Wire-to-Board(线对板) - 产品名称:SLTM - 分离式:否

应用信息: - 适用于线对板连接

封装信息: - 封装类型:管装 - 间距:2.54 mm - 镀层:最小0.75um配合,1.875um终止
SDA-70553-0118 价格&库存

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