0749792501

厂商：
MOLEX9
封装：
描述：
0749792501 - 2.00mm (.079") Pitch 6-Row VHDM-HSD Backplane Header, Open Module, 100 Circuits - Molex...

数据手册：

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0749792501 数据手册

This document was generated on 05/28/2010 PLEASE CHECK WWW.MOLEX.COM FOR LATEST PART INFORMATION Part Number: Status: Overview: Description: 0749792501 Active vhdm__hsd 2.00mm (.079") Pitch 6-Row VHDM-HSD™ Backplane Header, Open Module, 100 Circuits, Gold (Au) Selective 0.76µm (30µ"), Pin Length 4.75mm (.187") Documents: Drawing (PDF) Product Specification PS-74031-999 (PDF) RoHS Certificate of Compliance (PDF) Series General Product Family Series Application Application Tooling Documents Comments Component Type Overview Product Name Style Backplane Connectors 74979 Backplane Tooling Manual Open Header PCB Header vhdm__hsd VHDM-HSD™ N/A image - Reference only EU RoHS China RoHS RoHS Compliant by Exemption REACH SVHC Not Reviewed Halogen-Free Status Not Reviewed Need more information on product environmental compliance? Email productcompliance@molex.com For a multiple part number RoHS Certificate of Compliance, click here Please visit the Contact Us section for any non-product compliance questions. Physical Circuits (Loaded) Circuits (maximum) Color - Resin Durability (mating cycles max) First Mate / Last Break Guide to Mating Part Keying to Mating Part Material - Metal Material - Plating Mating Material - Plating Termination Material - Resin Number of Columns Number of Pairs Number of Rows Orientation PCB Retention PCB Thickness Recommended (in) PCB Thickness Recommended (mm) Packaging Type Pitch - Mating Interface (in) Pitch - Mating Interface (mm) Plating min: Mating (µin) Plating min: Mating (µm) Plating min: Termination (µin) Plating min: Termination (µm) Polarized to PCB Stackable Surface Mount Compatible (SMC) Temperature Range - Operating Termination Interface: Style 100 100 Black 200 No No None Copper-Nickel-Silicon, High Performance Alloy (HPA) Gold Tin-Lead High Temperature Thermoplastic 25 Open Pin Field 6 Vertical None 0.070 In 1.80 mm Tube 0.079 In 2.00 mm 30 0.75 30 0.75 Yes Yes Yes -55°C to +105°C Through Hole - Compliant Pin Search Parts in this Series 74979Series Mates With 74880 VHDM\HSD Daughtercard. 74886 VHDM\HSD Hybrid Daughtercard Application Tooling | FAQ Tooling specifications and manuals are found by selecting the products below. Crimp Height Specifications are then contained in the Application Tooling Specification document. Global Description Product # VHDM® Signal Pin 0622015700 Inserter Repair Tool VHDM-HSD™ Signal 0622020217 Header, 6 Row by 25 Wide, 50.00mm (1.97") Electrical Current - Maximum per Contact 1A Data Rate Real Signals (per 25mm) Voltage - Maximum 5.0 Gbps 48 120V AC (RMS)/DC Material Info Reference - Drawing Numbers Packaging Specification Product Specification Sales Drawing VHDM-HSD is a trademark of Amphenol Corporation PK-74057-003 PS-74031-999 SD-74979-010 This document was generated on 05/28/2010 PLEASE CHECK WWW.MOLEX.COM FOR LATEST PART INFORMATION

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0749792501

1. 物料型号： - 型号：0749792501 Activevhdm__hsd - 描述：2.00mm (.079") 间距 6-Row VHDM-HSD™ Backplane Header, Open Module, 100 Circuits, Gold (Au) Selective 0.76µm (30µ"), Pin Length 4.75mm (.187")。

2. 器件简介： - 产品名称：VHDM-HSD™ Backplane Header - 应用：用于背板连接，支持高密度信号传输。

3. 引脚分配： - 引脚数量：100个电路 - 排列：6行

4. 参数特性： - 电路（最大）：100 - 颜色 - 树脂：黑色 - 耐用性（最大插拔次数）：200次 - 材料 - 金属：铜-镍-硅高性能合金（HPA） - 材料 - 镀层：金、锡-铅 - 材料 - 树脂：高温热塑性塑料 - 列数：25 - 行数：6 - 引脚场：开放 - 垂直：无 - PCB厚度推荐（英寸）：0.070 In - PCB厚度推荐（毫米）：1.80 mm - 配合界面（英寸）：0.079 In - 配合界面（毫米）：2.00 mm

5. 功能详解： - 电气特性：每个接触点最大电流1A - 操作温度范围：-55°C至+105°C - 接口：通孔兼容引脚

6. 应用信息： - 与74880 VHDM/HSD Daughtercard和74886 VHDM/HSD Hybrid Daughtercard配合使用。

7. 封装信息： - 封装类型：开放式 - 堆叠：可堆叠 - 表面安装兼容（SMC）：是

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