0749934100

厂商：
MOLEX9
封装：
描述：
0749934100 - 2.00mm (.079) Pitch HDMÂ® Board-to-Board Stacking Header, High Rise Vertical, SMC, Doub...

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0749934100 数据手册

This document was generated on 05/17/2010 PLEASE CHECK WWW.MOLEX.COM FOR LATEST PART INFORMATION Part Number: Status: Overview: Description: 0749934100 Active hdm 2.00mm (.079") Pitch HDM® Board-to-Board Stacking Header, High Rise Vertical, SMC, Double End Wall Option, Solder Tail, 72 Circuits Documents: Drawing (PDF) Product Specification PS-73780-999 (PDF) RoHS Certificate of Compliance (PDF) Series General Product Family Series Application Component Type Overview Product Name Style Backplane Connectors 74993 Backplane, Mezzanine PCB Header hdm HDM® N/A image - Reference only EU RoHS China RoHS RoHS Compliant by Exemption REACH SVHC Contains SVHC: No Halogen-Free Status Halogen-Free Need more information on product environmental compliance? Email productcompliance@molex.com For a multiple part number RoHS Certificate of Compliance, click here Please visit the Contact Us section for any non-product compliance questions. Physical Circuits (Loaded) Circuits (maximum) Color - Resin Durability (mating cycles max) First Mate / Last Break Guide to Mating Part Keying to Mating Part Material - Metal Material - Plating Mating Material - Plating Termination Material - Resin Number of Columns Number of Pairs Number of Rows Orientation PC Tail Length (in) PC Tail Length (mm) PCB Locator PCB Retention PCB Thickness Recommended (in) PCB Thickness Recommended (mm) Packaging Type Pitch - Mating Interface (in) Pitch - Mating Interface (mm) Pitch - Term. Interface (in) Pitch - Term. Interface (mm) Plating min: Mating (µin) Plating min: Mating (µm) Plating min: Termination (µin) Plating min: Termination (µm) Polarized to PCB Stackable Surface Mount Compatible (SMC) Temperature Range - Operating Termination Interface: Style 72 72 Black 250 No No None Phosphor Bronze Gold Tin-Lead High Temperature Thermoplastic 12 Open Pin Field 6 Vertical 0.138 In 3.50 mm No None 0.098 In 2.50 mm Tube 0.079 In 2.00 mm 0.079 In 2.00 mm 30 0.75 15 0.375 No No Yes -55°C to +105°C Through Hole - Compliant Pin Search Parts in this Series 74993Series Electrical Current - Maximum per Contact Data Rate Real Signals (per 25mm) Shielded Voltage - Maximum 1A 1.0 Gbps 75 No 250V AC Material Info Reference - Drawing Numbers Application Specification AS-73642-9998 Packaging Specification PK-70873-0871 Product Specification PS-73780-999 Sales Drawing SD-74993-001 HDM and High Density Metric are trademarks of Amphenol Corporation This document was generated on 05/17/2010 PLEASE CHECK WWW.MOLEX.COM FOR LATEST PART INFORMATION

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0749934100

1. 物料型号： - 型号：0749934100 - 状态：Active（活跃） - 产品系列：74993

2. 器件简介： - 产品家族：Backplane Connectors（背板连接器） - 组件类型：PCB Header（PCB插座） - 概述：2.00mm (.079") 间距 HDM® Board-to-Board Stacking Header, High Rise Vertical, SMC, Double End Wall Option, Solder Tail, 72 Circuits（2.00mm间距的HDM®板对板堆叠插座，高垂直上升，表面贴装兼容（SMC），双端壁选项，焊接尾，72路）

3. 引脚分配： - 电路数（已加载）：72 - 电路数（最大）：72 - 列数：12 - 行数：6 - 引脚风格：垂直

4. 参数特性： - 颜色 - 树脂：黑色 - 耐久性（最大插拔次数）：250 - 材料 - 金属：钹青铜 - 材料 - 镀层接触：金 - 材料 - 镀层终止：锡-铅 - 材料 - 树脂：高温热塑性塑料 - 推荐PCB厚度：0.098英寸（2.50毫米） - 接口 - 间距（接触）：0.079英寸（2.00毫米） - 接口 - 间距（终止）：0.079英寸（2.00毫米） - 镀层最小值：接触3.0微米，终止1.5微米

5. 功能详解： - 该产品支持高达1A的电流，数据速率为1.0 Gbps，75个实际信号每25毫米，无屏蔽，最大电压250V AC。

6. 应用信息： - 应用规范：AS-73642-9998 - 包装规范：PK-70873-0871 - 产品规范：PS-73780-999 - 销售图纸：SD-74993-001

7. 封装信息： - 封装类型：Tube（管装） - 极化到PCB：否 - 堆叠：否 - 表面贴装兼容（SMC）：是 - 工作温度范围：-55°C至+105°C - 终止接口风格：Through Hole - Compliant Pin（通孔 - 顺从销）

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