0751171018

0751171018

  • 厂商:

    MOLEX9

  • 封装:

  • 描述:

    0751171018 - 2.00mm (.079") Pitch VHDM Board-to-Board Stacker Receptacle, Vertical, 8-Row, 400 Circu...

  • 详情介绍
  • 数据手册
  • 价格&库存
0751171018 数据手册
This document was generated on 05/17/2010 PLEASE CHECK WWW.MOLEX.COM FOR LATEST PART INFORMATION Part Number: Status: Overview: Description: 0751171018 Active vhdm 2.00mm (.079") Pitch VHDM® Board-to-Board Stacker Receptacle, Vertical, 8-Row, 400 Circuits, 1.27µm (50µ") Gold (Au) Documents: Packaging Specification (PDF) Drawing (PDF) Product Specification PS-74031-999 (PDF) RoHS Certificate of Compliance (PDF) image - Reference only Backplane Connectors 75117 Daughtercard Tooling Manual Stack Height 18mm (.708"), Lead Free PCB Receptacle vhdm VHDM® N/A EU RoHS China RoHS RoHS Compliant by Exemption REACH SVHC Not Reviewed Halogen-Free Status Not Reviewed Need more information on product environmental compliance? Series General Product Family Series Application Application Tooling Documents Comments Component Type Overview Product Name Style Physical Circuits (Loaded) Circuits (maximum) Color - Resin Durability (mating cycles max) First Mate / Last Break Guide to Mating Part Keying to Mating Part Material - Metal Material - Plating Mating Material - Plating Termination Material - Resin Number of Columns Number of Pairs Number of Rows Orientation PCB Retention PCB Thickness Recommended (in) PCB Thickness Recommended (mm) Packaging Type Pitch - Mating Interface (in) Pitch - Mating Interface (mm) Plating min: Mating (µin) Plating min: Mating (µm) Plating min: Termination (µin) Plating min: Termination (µm) Polarized to PCB Surface Mount Compatible (SMC) Temperature Range - Operating Termination Interface: Style 400 400 Black 200 No No None Copper-Nickel-Silicon, High Performance Alloy (HPA) Gold Tin-Lead High Temperature Thermoplastic N/A Open Pin Field 8 Vertical None 0.070 In 1.80 mm Tube 0.079 In 2.00 mm 50 1.25 30 0.75 No Yes -55°C to +105°C Through Hole - Compliant Pin Email productcompliance@molex.com For a multiple part number RoHS Certificate of Compliance, click here Please visit the Contact Us section for any non-product compliance questions. Search Parts in this Series 75117Series Mates With 74060 VHDM® Board-to-Board Backplane Header Application Tooling | FAQ Tooling specifications and manuals are found by selecting the products below. Crimp Height Specifications are then contained in the Application Tooling Specification document. Global Description Product # VHDM® Single 0622021450 Wafer Removal Tool, 8 Row Electrical Current - Maximum per Contact Data Rate 1A 3.125 Gbps Real Signals (per 25mm) Voltage - Maximum 100 120V AC (RMS)/DC Material Info Reference - Drawing Numbers Product Specification PS-74031-999 Sales Drawing SD-75117-001 VHDM and Very High Density Metric are trademarks of Amphenol Corporation This document was generated on 05/17/2010 PLEASE CHECK WWW.MOLEX.COM FOR LATEST PART INFORMATION
0751171018
1. 物料型号: - 型号:0751171018 - 状态:Active(活跃) - 概述:vhdm 2.00mm (.079") 间距 VHDM® 板对板堆叠插座,垂直,8行,400路,1.27µm (50µ") 金 (Au)。

2. 器件简介: - 产品家族:Backplane Connectors(背板连接器) - 系列:75117 - 应用:Daughtercard(子卡) - 组件类型:PCB Receptacle(PCB插座)

3. 引脚分配: - 电路(已加载):400 - 最大电路:400 - 行数:8 - 列数:N/A(不适用) - 开放引脚场的对数:N/A(不适用)

4. 参数特性: - 颜色 - 树脂:黑色 - 耐久性(最大插拔次数):200 - 材料 - 金属:铜镍硅,高性能合金(HPA) - 材料 - 镀层:接触金,终止锡铅 - 材料 - 树脂:高温热塑性塑料 - PCB厚度推荐:1.80 mm - 间距 - 接口:2.00 mm - 镀层最小值:接触1.25 µm,终止0.75 µm - 极性到PCB:否 - 表面贴装兼容(SMC):是 - 温度范围 - 操作:-55°C至+105°C - 电气电流 - 每个接触最大:1A - 数据速率:3.125 Gbps

5. 功能详解: - VHDM®系列连接器,提供高速数据传输,支持3.125 Gbps的数据速率。 - 适用于需要高密度连接的应用场景。

6. 应用信息: - 与74060 VHDM®板对板背板头配合使用。

7. 封装信息: - 包装类型:管装 - 接口风格:通孔 - 符合销钉
0751171018 价格&库存

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