0751171218

0751171218

  • 厂商:

    MOLEX9

  • 封装:

  • 描述:

    0751171218 - 2.00mm (.079) Pitch VHDM® Board-to-Board Stacker Receptacle, Vertical, 8-Row, 200 Circ...

  • 详情介绍
  • 数据手册
  • 价格&库存
0751171218 数据手册
This document was generated on 05/28/2010 PLEASE CHECK WWW.MOLEX.COM FOR LATEST PART INFORMATION Part Number: Status: Overview: Description: 0751171218 Active vhdm 2.00mm (.079") Pitch VHDM® Board-to-Board Stacker Receptacle, Vertical, 8-Row, 200 Circuits, 1.27µm (50µ") Gold (Au) Documents: Packaging Specification (PDF) Drawing (PDF) Product Specification PS-74031-999 (PDF) RoHS Certificate of Compliance (PDF) image - Reference only Backplane Connectors 75117 Daughtercard Tooling Manual Stack Height 18mm (.708"), Lead Free PCB Receptacle vhdm VHDM® N/A EU RoHS China RoHS RoHS Compliant by Exemption REACH SVHC Not Reviewed Halogen-Free Status Not Reviewed Need more information on product environmental compliance? Series General Product Family Series Application Application Tooling Documents Comments Component Type Overview Product Name Style Physical Circuits (Loaded) Circuits (maximum) Color - Resin Durability (mating cycles max) First Mate / Last Break Guide to Mating Part Keying to Mating Part Material - Metal Material - Plating Mating Material - Plating Termination Material - Resin Number of Columns Number of Pairs Number of Rows Orientation PCB Retention PCB Thickness Recommended (in) PCB Thickness Recommended (mm) Packaging Type Pitch - Mating Interface (in) Pitch - Mating Interface (mm) Plating min: Mating (µin) Plating min: Mating (µm) Plating min: Termination (µin) Plating min: Termination (µm) Polarized to PCB Surface Mount Compatible (SMC) Temperature Range - Operating Termination Interface: Style 200 200 Black 200 No No None Copper-Nickel-Silicon, High Performance Alloy (HPA) Gold Tin-Lead High Temperature Thermoplastic N/A Open Pin Field 8 Vertical None 0.070 In 1.80 mm Tube 0.079 In 2.00 mm 50 1.25 30 0.75 No Yes -55°C to +105°C Through Hole - Compliant Pin Email productcompliance@molex.com For a multiple part number RoHS Certificate of Compliance, click here Please visit the Contact Us section for any non-product compliance questions. Search Parts in this Series 75117Series Mates With 74060 VHDM® Board-to-Board Backplane Header Electrical Current - Maximum per Contact Data Rate 1A 3.125 Gbps Real Signals (per 25mm) Voltage - Maximum 100 120V AC (RMS)/DC Material Info Reference - Drawing Numbers Product Specification PS-74031-999 Sales Drawing SD-75117-001 VHDM and Very High Density Metric are trademarks of Amphenol Corporation This document was generated on 05/28/2010 PLEASE CHECK WWW.MOLEX.COM FOR LATEST PART INFORMATION
0751171218
1. 物料型号: - 型号:0751171218 - 状态:Active(活跃)

2. 器件简介: - 产品家族:Backplane Connectors(背板连接器) - 系列:75117 - 应用:Daughtercard(子卡) - 组件类型:PCB Receptacle(PCB插座)

3. 引脚分配: - 电路(已加载):200 - 电路(最大):200 - 行数:8 - 列数:N/A(不适用) - 开放引脚场:是

4. 参数特性: - 颜色 - 树脂:黑色 - 耐用性(最大插拔次数):200 - 金属材质:铜镍硅,高性能合金(HPA) - 镀层 - 插接:金 - 镀层 - 终止:锡铅 - 树脂材质:高温热塑性塑料 - 推荐PCB厚度:1.80 mm - 插接界面间距:2.00 mm(0.079英寸) - 镀层最小厚度 - 插接:1.25 µm(50 µin) - 镀层最小厚度 - 终止:0.75 µm(30 µin) - 极性到PCB:否 - 表面贴装兼容(SMC):是 - 工作温度范围:-55°C至+105°C - 终止接口样式:通孔 - 弹性针

5. 功能详解: - 最大每接触电流:1A - 数据速率:3.125 Gbps

6. 应用信息: - 应用:Daughtercard(子卡) - 配合型号:74060 VHDM® Board-to-Board Backplane Header(背板插座)

7. 封装信息: - 封装类型:Tube(管装) - 垂直方向:是 - PCB保持:无
0751171218 价格&库存

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