0751972503

0751972503

  • 厂商:

    MOLEX9

  • 封装:

  • 描述:

    0751972503 - 2.00mm (.079) Pitch VHDM® Lite Board-to-Board Backplane Header, Vertical, 8-Row, Open ...

  • 详情介绍
  • 数据手册
  • 价格&库存
0751972503 数据手册
This document was generated on 05/28/2010 PLEASE CHECK WWW.MOLEX.COM FOR LATEST PART INFORMATION Part Number: Status: Overview: Description: 0751972503 Active vhdm__hsd 2.00mm (.079") Pitch VHDM® Lite Board-to-Board Backplane Header, Vertical, 8-Row, Open Signal Module, 200 circuits, Pin Length 4.25mm (.167") Documents: Drawing (PDF) Product Specification PS-74031-999 (PDF) RoHS Certificate of Compliance (PDF) Series General Product Family Series Application Application Tooling Documents Comments Component Type Overview Product Name Style Backplane Connectors 75197 Backplane Tooling Manual Open Header PCB Header vhdm__hsd VHDM Lite® N/A image - Reference only EU RoHS China RoHS RoHS Compliant by Exemption REACH SVHC Contains SVHC: No Halogen-Free Status Not Reviewed Need more information on product environmental compliance? Email productcompliance@molex.com For a multiple part number RoHS Certificate of Compliance, click here Please visit the Contact Us section for any non-product compliance questions. Physical Circuits (Loaded) Circuits (maximum) Color - Resin Durability (mating cycles max) First Mate / Last Break Guide to Mating Part Keying to Mating Part Material - Metal Material - Plating Mating Material - Plating Termination Material - Resin Number of Columns Number of Pairs Number of Rows Orientation PCB Retention PCB Thickness Recommended (in) PCB Thickness Recommended (mm) Packaging Type Pitch - Mating Interface (in) Pitch - Mating Interface (mm) Plating min: Mating (µin) Plating min: Mating (µm) Plating min: Termination (µin) Plating min: Termination (µm) Polarized to PCB Stackable Surface Mount Compatible (SMC) Temperature Range - Operating Termination Interface: Style 200 200 Black 200 No No None High Performance Alloy (HPA) Gold Tin-Lead High Temperature Thermoplastic 25 Open Pin Field 8 Vertical Yes 0.070 In 1.80 mm Tube 0.079 In 2.00 mm 30 0.75 30 0.75 Yes Yes Yes -55°C to +105°C Through Hole - Compliant Pin Search Parts in this Series 75197Series Mates With 75191 VHDM® Lite-Series Board-to-Board Daughtercard Use With Daughtercard Modules Application Tooling | FAQ Tooling specifications and manuals are found by selecting the products below. Crimp Height Specifications are then contained in the Application Tooling Specification document. Global Description Product # VHDM® Signal Pin 0622015700 Inserter Repair Tool VHDM® Insertion 0622020210 Module for Standard Shield Signal Header, 8 Row by Electrical Current - Maximum per Contact 1A Data Rate Real Signals (per 25mm) Voltage - Maximum 622.0 Mbps 72 120V AC (RMS)/DC 25 Wide, 50.00mm (1.97") Material Info Reference - Drawing Numbers Packaging Specification PK-74060-003 Product Specification PS-74031-999 Sales Drawing SD-75197-001 VHDM and Very High Density Metric are trademarks of Amphenol Corporation This document was generated on 05/28/2010 PLEASE CHECK WWW.MOLEX.COM FOR LATEST PART INFORMATION
0751972503
物料型号: - 型号:0751972503 - 状态:Active(激活)

器件简介: - 产品家族:Backplane Connectors(背板连接器) - 系列:75197 - 应用:Backplane(背板) - 组件类型:PCB Header(PCB连接器) - 概述:vhdm hsd(超高频差分信号处理) - 产品名称风格:VHDM Lite(VHDM轻量级) - 物理电路:200(已加载)

引脚分配: - 列数:25 - 行数:8 - 引脚类型:Open Pin Field(开放引脚区域)

参数特性: - 电路(最大):200 - 树脂颜色:Black(黑色) - 耐久性(最大配对周期):200 - 金属材质:High Performance Alloy(高性能合金) - 镀层材质:Gold(金) - 镀层终止:Tin-Lead(锡铅) - 树脂材质:High Temperature Thermoplastic(高温热塑性塑料) - PCB厚度推荐:1.80mm - 接口配对间距:2.00mm - 工作温度范围:-55°C至+105°C - 最大每接触电流:1A

功能详解: - VHDM Lite系列背板连接器,适用于高密度信号传输。 - 通过垂直安装,实现200个电路的连接。 - 支持多种PCB厚度和多种引脚配置。

应用信息: - 适用于背板应用。 - 与75191 VHDM® Lite系列板对板女儿卡配合使用。

封装信息: - 包装类型:Tube(管装) - 接口风格:Through Hole - Compliant Pin(通孔-合规引脚)
0751972503 价格&库存

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