0756490105

厂商：
MOLEX9
封装：
描述：
0756490105 - 1.85mm by 1.85mm (.073" by .073") Pitch 3-Pair GbX Backplane L-Series Connector System ...

数据手册：

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数据手册
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0756490105 数据手册

This document was generated on 05/14/2010 PLEASE CHECK WWW.MOLEX.COM FOR LATEST PART INFORMATION Part Number: Status: Overview: Description: 0756490105 Active gbx_backplane_connector_system 1.85mm by 1.85mm (.073" by .073") Pitch 3-Pair GbX® Backplane L-Series Connector System, Open Header, 80 Circuits, Gold (Au) 0.76µm (30µ"), Pin Length 5.55mm (.219") Documents: Drawing (PDF) Packaging Specification (PDF) RoHS Certificate of Compliance (PDF) Series image - Reference only E29179 EU RoHS China RoHS RoHS Compliant by Exemption REACH SVHC Contains SVHC: No Halogen-Free Status Not Reviewed Need more information on product environmental compliance? Email productcompliance@molex.com For a multiple part number RoHS Certificate of Compliance, click here Please visit the Contact Us section for any non-product compliance questions. Agency Certification UL General Product Family Series Application Application Tooling Documents Comments Component Type Overview Product Name Style Backplane Connectors 75649 Backplane Tooling Manual Open Header PCB Header gbx_backplane_connector_system GbX® N/A Physical Circuits (Loaded) Circuits (maximum) Color - Resin Durability (mating cycles max) First Mate / Last Break Flammability Guide to Mating Part Keying to Mating Part Material - Metal Material - Plating Mating Material - Plating Termination Material - Resin Number of Columns Number of Pairs Number of Rows Orientation PC Tail Length (in) PC Tail Length (mm) PCB Locator PCB Retention PCB Thickness Recommended (in) PCB Thickness Recommended (mm) Packaging Type Pitch - Mating Interface (in) Pitch - Mating Interface (mm) Pitch - Term. Interface (in) Pitch - Term. Interface (mm) Plating min: Mating (µin) Plating min: Mating (µm) 80 80 Black 200 No 94V-0 No None High Performance Alloy (HPA) Gold Tin-Lead High Temperature Thermoplastic 10 3 8 Vertical 0.091 In 2.30 mm No Yes 0.063 In 1.60 mm Tube 0.073 In 1.85 mm 0.073 In 1.85 mm 30 0.76 Search Parts in this Series 75649Series Mates With 75731 GbX® L-Series Daughtercard Wafer Module Application Tooling | FAQ Tooling specifications and manuals are found by selecting the products below. Crimp Height Specifications are then contained in the Application Tooling Specification document. Global Description Product # GbX® 3 Pair by 25 0622022550 Wide Differential Insertion Tool Plating min: Termination (µin) Plating min: Termination (µm) Polarized to PCB Stackable Surface Mount Compatible (SMC) Temperature Range - Operating Termination Interface: Style 30 0.76 No No Yes 105°C Through Hole - Compliant Pin Electrical Current - Maximum per Contact Data Rate Real Signals (per 25mm) Shielded Voltage - Maximum 1A 8.0 Gbps 108 No 120V AC (RMS)/DC Material Info Reference - Drawing Numbers Packaging Specification PK-70873-576 Sales Drawing SD-75649-010 GbX is a registered trademark of Amphenol Corporation. This document was generated on 05/14/2010 PLEASE CHECK WWW.MOLEX.COM FOR LATEST PART INFORMATION

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0756490105

1. 物料型号： - 型号：0756490105 - 状态：Active（活跃）

2. 器件简介： - 描述：1.85mm x 1.85mm (0.073" x 0.073") 间距，3对GbX® Backplane L系列连接器系统，开放式头部，80路，金（Au）0.76µm（30µ"），引脚长度5.55mm（0.219"）。

3. 引脚分配： - 列数：10 - 对数：3 - 行数：8 - 引脚总数：80

4. 参数特性： - 电路（已加载）：80 - 最大电路数：80 - 树脂颜色：黑色 - 耐久性（最大插拔次数）：200 - 阻燃等级：94V-0 - 金属材质：高性能合金（HPA） - 接触镀层：金 - 接触镀层终止：锡铅 - 树脂材质：耐高温热塑性塑料 - PCB厚度推荐：0.063英寸（1.60mm）

5. 功能详解： - 产品名称：GbXR - 风格：N/A - PCB尾部长度：0.091英寸（2.30mm） - PCB定位：无 - PCB保持：是 - 间距-配合界面（英寸）：0.073英寸 - 间距-配合界面（mm）：1.85mm - 镀层最小值：配合（µin）：30 - 镀层最小值：配合（um）：0.76

6. 应用信息： - 应用：背板 - 与75731 GbX® L系列Daughtercard Wafer Module配合使用

7. 封装信息： - 包装类型：管装 - 间距-配合界面（英寸）：0.073英寸 - 间距-配合界面（mm）：1.85mm - 间距-端子界面（英寸）：0.073英寸 - 间距-端子界面（mm）：1.85mm

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