0780610052

厂商：
MOLEX9
封装：
描述：
0780610052 - 1.00mm (.039) Pitch Fully Buffered DIMM Socket, Vertical, Through Hole, 0.38Î¼m (15Î¼) ...

数据手册：

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数据手册
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0780610052 数据手册

This document was generated on 04/13/2010 PLEASE CHECK WWW.MOLEX.COM FOR LATEST PART INFORMATION Part Number: Status: Description: 0780610052 Active 1.00mm (.039") Pitch Fully Buffered DIMM Socket, Vertical, Through Hole, 0.38µm (15µ") Gold(Au) Selective Plating, 240 Circuits, with Beveled Metal Pins, with Black Latches, 3.18mm (.125") Solder Tail Length, Lead-free Documents: 3D Model Drawing (PDF) Product Specification PS-78061-001 (PDF) RoHS Certificate of Compliance (PDF) Series image - Reference only LR 19980 E29179 EU RoHS China RoHS ELV and RoHS Compliant REACH SVHC Contains SVHC: No Halogen-Free Status Not Halogen-Free Need more information on product environmental compliance? Email productcompliance@molex.com For a multiple part number RoHS Certificate of Compliance, click here Please visit the Contact Us section for any non-product compliance questions. Agency Certification CSA UL General Product Family Series Comments Component Type JEDEC Outline Product Name Memory Module Sockets 78061 Latches in Black Color Solder Tail Length at 3.18mm (.125") Memory Module MO-256 FB DIMM Physical Circuits (Loaded) Color - Resin Durability (mating cycles max) Entry Angle Flammability Keying to Mating Part Material - Metal Material - Plating Mating Material - Plating Termination Material - Resin PC Tail Length (in) PC Tail Length (mm) PCB Locator PCB Retention PCB Thickness Recommended (in) PCB Thickness Recommended (mm) Packaging Type Pitch - Mating Interface (in) Pitch - Mating Interface (mm) Plating min: Mating (µin) Plating min: Mating (µm) Temperature Range - Operating Termination Interface: Style 240 Black 25 Vertical (Top Entry) 94V-0 Yes Brass, Phosphor Bronze Gold Tin High Temperature Thermoplastic 0.125 In 3.18 mm Yes Yes 0.093 In 2.40 mm Tray 0.039 In 1.00 mm 15 0.38 -55°C to +85°C Through Hole Search Parts in this Series 78061Series Mates With JEDEC MO-256 modules Electrical Current - Maximum per Contact Voltage - Maximum Voltage Key 1A 30V 1.8V, Center Solder Process Data Duration at Max. Process Temperature (seconds) Lead-free Process Capability Max. Cycles at Max. Process Temperature 5 SMC & Wave Capable (TH only) 1 Process Temperature max. C 265 Material Info Reference - Drawing Numbers Product Specification Sales Drawing PS-78061-001, RPS-78061-001 SD-78061-001 This document was generated on 04/13/2010 PLEASE CHECK WWW.MOLEX.COM FOR LATEST PART INFORMATION

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0780610052

1. 物料型号： - 型号：0780610052 - 状态：Active（活跃）

2. 器件简介： - 描述：1.00mm (0.039") 间距全缓冲DIMM插座，垂直，通孔，0.38µm - 特点：15"金（Au）选择性镀层，240路，带斜面金属引脚，带黑色锁扣，3.18mm (0.125") 焊尾长度，无铅

3. 引脚分配： - 电路（已加载）：240 - 引脚间距（英寸）：0.039 In - 引脚间距（毫米）：1.00 mm - 镀层最小：配合（微英寸）：15 - 镀层最小：配合（微米）：0.38

4. 参数特性： - 颜色 - 树脂：黑色 - 耐用性（最大插拔次数）：25 - 进入角度：垂直（顶部进入） - 阻燃性：94V-0 - 与配合部件的键合：是 - 材料 - 金属：黄铜，磷青铜 - 材料 - 镀层配合：金 - 材料 - 镀层终止：锡 - 材料 - 树脂：高温热塑性塑料 - PCB尾长（英寸）：0.125 In - PCB尾长（毫米）：3.18 mm - PCB定位器：是 - PCB保持：是 - 推荐PCB厚度（英寸）：0.093 In - 推荐PCB厚度（毫米）：2.40 mm - 包装类型：托盘 - 工作温度范围：-55°C至+85°C - 终止接口：样式 - 通孔

5. 功能详解： - 产品系列：内存模块插座 - JEDEC轮廓产品名称：MO-256 FB DIMM - 电气特性： - 每个接触点最大电流：1A - 最大电压：30V - 电压键：1.8V, 中心

6. 应用信息： - 与JEDEC MO-256模块配合使用

7. 封装信息： - 封装类型：Tray（托盘）

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