0780790101

厂商：
MOLEX9
封装：
描述：
0780790101 - 1.00mm (.039) Pitch DDR3 DIMM Socket, Vertical, Through Hole, with Beveled Metal Pins, ...

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0780790101 数据手册

This document was generated on 05/10/2010 PLEASE CHECK WWW.MOLEX.COM FOR LATEST PART INFORMATION Part Number: Status: Description: 0780790101 Active 1.00mm (.039") Pitch DDR3 DIMM Socket, Vertical, Through Hole, with Beveled Metal Pins, Off-White Housing and Latches, 0.38µm (15µ") Gold (Au) Plating, 2.67mm(.105") Soldertail, 240 Circuits, Lead free Documents: 3D Model Drawing (PDF) Product Specification PS-78079-001 (PDF) RoHS Certificate of Compliance (PDF) Series image - Reference only LR19980 E29179 EU RoHS China RoHS ELV and RoHS Compliant REACH SVHC Contains SVHC: No Halogen-Free Status Not Halogen-Free Need more information on product environmental compliance? Email productcompliance@molex.com For a multiple part number RoHS Certificate of Compliance, click here Please visit the Contact Us section for any non-product compliance questions. Agency Certification CSA UL General Product Family Series Component Type JEDEC Outline Product Name Memory Module Sockets 78079 Socket MO-269 DDR3 DIMM Physical Circuits (Loaded) Circuits (maximum) Color - Resin Durability (mating cycles max) Entry Angle Flammability Keying to Mating Part Material - Metal Material - Plating Mating Material - Plating Termination Material - Resin PC Tail Length (in) PC Tail Length (mm) PCB Locator PCB Retention PCB Thickness Recommended (in) PCB Thickness Recommended (mm) Packaging Type Pitch - Mating Interface (in) Pitch - Mating Interface (mm) Pitch - Term. Interface (in) Pitch - Term. Interface (mm) Plating min: Mating (µin) Plating min: Mating (µm) Plating min: Termination (µin) Plating min: Termination (µm) Temperature Range - Operating Termination Interface: Style 240 240 Natural 25 Vertical 94V-0 Yes Copper Alloy Gold Tin High Temperature Thermoplastic 0.105 In 2.67 mm Yes Yes 0.062 In 1.57 mm Tray 0.039 In 1.00 mm 0.039 In 1.00 mm 15 0.38 100 2.54 -55°C to +85°C Through Hole Search Parts in this Series 78079Series Mates With JEDEC standard 1.27mm modules Electrical Current - Maximum per Contact Voltage - Maximum Voltage Key 1A 30V AC (RMS)/DC Center Solder Process Data Duration at Max. Process Temperature (seconds) Lead-free Process Capability Max. Cycles at Max. Process Temperature Process Temperature max. C 10 SMC & Wave Capable (TH only) 2 260 Material Info Reference - Drawing Numbers Packaging Specification Product Specification Sales Drawing PK-78079-001 PS-78079-001 SD-78079-001 This document was generated on 05/10/2010 PLEASE CHECK WWW.MOLEX.COM FOR LATEST PART INFORMATION

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0780790101

1. 物料型号： - 型号：0780790101 - 状态：Active - 描述：1.00mm (.039") Pitch DDR3 DIMM Socket, Vertical, Through Hole, with Beveled Metal Pins, Off-White Housing and Latches, 0.38µm (15µ") Gold (Au) Plating, 2.67mm(.105") Soldertail, 240 Circuits, Lead free

2. 器件简介： - 产品家族：Memory Module Sockets - 系列：78079 - 组件类型：Socket - JEDEC Outline：MO-269 - 产品名称：DDR3 DIMM

3. 引脚分配： - 引脚数量：240 - 引脚间距：1.00mm (0.039") Pitch

4. 参数特性： - 电路（已加载）：240 - 最大电路：240 - 树脂颜色：Natural - 耐久性（最大插拔次数）：25 - 进入角度：Vertical - 阻燃等级：94V-0 - 金属材质：Copper Alloy - 金属镀层：Gold - 镀层终止：Imm Tin - 树脂材质：High Temperature Thermoplastic - PCB尾长：2.67mm (0.105") / 1.00mm (0.039") Pitch - PCB厚度推荐：1.57mm (0.062") / 1.00mm (0.039") Pitch - 镀层最小：Mating 0.38µm (15µ"), Termination 2.54µm (100µ") 5. 功能详解： - 电气特性：最大电流每接触点1A，最大电压30V AC (RMS)/DC - 焊接过程数据：请通过Email productcompliance@molex.com获取

6. 应用信息： - 与JEDEC标准1.27mm模块兼容 - 操作温度范围：-55°C至+85°C

7. 封装信息： - 封装类型：Tray - 封装接口间距：1.00mm (0.039") Pitch

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