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0875872158

0875872158

  • 厂商:

    MOLEX9

  • 封装:

  • 描述:

    0875872158 - 1.27mm (.050) Pitch DIMM 8-Byte Socket, Low Profile (25°), Multi-Key, with Beveled Met...

  • 详情介绍
  • 数据手册
  • 价格&库存
0875872158 数据手册
This document was generated on 04/13/2010 PLEASE CHECK WWW.MOLEX.COM FOR LATEST PART INFORMATION Part Number: Status: Description: 0875872158 Active 1.27mm (.050") Pitch DIMM 8-Byte Socket, Low Profile (25°), Multi-Key, with Beveled Metal Pins and Plastic Peg, Center Function Key, 3.18mm (.125") Tail Length, 0.76µm (30µ") Gold (Au) Selective Plating, 168 Circuits, Leadfree Documents: 3D Model Drawing (PDF) Product Specification PS-87587-007 (PDF) RoHS Certificate of Compliance (PDF) Series image - Reference only EU RoHS China RoHS ELV and RoHS Compliant REACH SVHC Contains SVHC: No Halogen-Free Status Not Halogen-Free Need more information on product environmental compliance? Email productcompliance@molex.com For a multiple part number RoHS Certificate of Compliance, click here Please visit the Contact Us section for any non-product compliance questions. General Product Family Series Component Type JEDEC Outline Product Name Memory Module Sockets 87587 Memory Module MO-161 DIMM Physical Circuits (Loaded) Color - Resin Durability (mating cycles max) Entry Angle Function Key Keying to Mating Part Material - Metal Material - Plating Mating Material - Plating Termination Material - Resin PC Tail Length (in) PC Tail Length (mm) PCB Locator PCB Retention PCB Thickness Recommended (in) PCB Thickness Recommended (mm) Packaging Type Pitch - Mating Interface (in) Pitch - Mating Interface (mm) Plating min: Mating (µin) Plating min: Mating (µm) Plating min: Termination (µin) Plating min: Termination (µm) Temperature Range - Operating Termination Interface: Style 168 Black, Natural 25 25° Angle Center Yes Phosphor Bronze Gold Tin High Temperature Thermoplastic 0.125 In 3.18 mm Yes Yes 0.062 In 1.60 mm Tray 0.050 In 1.27 mm 30, 30.4 0.76 100, 101.6 2.54 -40°C to +85°C Through Hole Search Parts in this Series 87587Series Mates With JEDEC MO-161 modules Electrical Current - Maximum per Contact Voltage - Maximum Voltage Key 1A 50V 3.3V, Center Solder Process Data Lead-free Process Capability Wave Capable (TH only) Material Info Reference - Drawing Numbers Product Specification Sales Drawing PS-87587-007 SD-87587-001 This document was generated on 04/13/2010 PLEASE CHECK WWW.MOLEX.COM FOR LATEST PART INFORMATION
0875872158
1. 物料型号: - 型号:0875872158 - 状态:Active(活跃) - 描述:1.27mm (.050") 间距 DIMM 8-Byte 插座,低轮廓(25°),多键,带斜面 - 金属引脚和塑料销,中心功能键,3.18mm (.125") 尾长(30")金(Au)选择性镀层,168路,无铅

2. 器件简介: - 产品家族:Memory Module Sockets(内存模块插座) - 系列:87587 - 组件类型:Memory Module(内存模块) - JEDEC轮廓:MO-161 - 产品名称:1.27mm间距DIMM芯片

3. 引脚分配: - 电路(已加载):168 - 引脚间距:1.27mm(0.050英寸)

4. 参数特性: - 颜色 - 树脂:黑色,自然色 - 耐用性(最大插拔次数):25次 - 进入角度:25°角 - 功能键:中心 - 与配对部件的键控:是 - 金属材质:磷青铜 - 镀层 - 配对:金 - 镀层 - 终止:锡 - 树脂材质:高温热塑性塑料 - PCB尾长(英寸):0.125英寸 - PCB尾长(毫米):3.18毫米 - PCB定位器:是 - PCB保持:是 - 推荐PCB厚度(英寸):0.062英寸 - 推荐PCB厚度(毫米):1.60毫米 - 包装类型:托盘 - 配对接口间距(英寸):0.050英寸 - 配对接口间距(毫米):1.27毫米 - 镀层最小:配对(微英寸):30, 30.4 - 镀层最小:配对(微米):0.76 - 镀层最小:终止(微英寸):100,101.6 - 镀层最小:终止(微米):2.54 - 工作温度范围:-40°C至+85°C - 终止接口样式:通孔

5. 功能详解: - 最大每接触电流:1A - 最大电压:50V - 电压键:3.3V,中心

6. 应用信息: - 与JEDEC MO-161模块配合使用

7. 封装信息: - 封装类型:Tray(托盘)
0875872158 价格&库存

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