74697-1102

厂商：
MOLEX9
封装：
描述：
74697-1102 - 2.00mm (.079) Pitch 5-Row VHDM-HSD™ Backplane Header, Guide Pin Signal Module, Shield P...

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74697-1102 数据手册

This document was generated on 05/27/2010 PLEASE CHECK WWW.MOLEX.COM FOR LATEST PART INFORMATION Part Number: Status: Overview: Description: 0746971102 Active vhdm__hsd 2.00mm (.079") Pitch 5-Row VHDM-HSD™ Backplane Header, Guide Pin Signal Module, Shield Pin End Version, Advanced Mate Shield, 40 Circuits, Pin Length 6.25mm (.246") Documents: Drawing (PDF) RoHS Certificate of Compliance (PDF) Series image - Reference only LR19980 EU RoHS China RoHS RoHS Compliant by Exemption REACH SVHC Contains SVHC: No Halogen-Free Status Halogen-Free Need more information on product environmental compliance? Email productcompliance@molex.com For a multiple part number RoHS Certificate of Compliance, click here Please visit the Contact Us section for any non-product compliance questions. Agency Certification CSA General Product Family Series Application Application Tooling Documents Comments Component Type Overview Product Name Style Backplane Connectors 74697 Backplane Tooling Manual No Keying Position PCB Header vhdm__hsd VHDM-HSD™ N/A Physical Circuits (Loaded) Circuits (maximum) Color - Resin Durability (mating cycles max) First Mate / Last Break Flammability Guide to Mating Part Keying to Mating Part Material - Metal Material - Plating Mating Material - Plating Termination Material - Resin Number of Columns Number of Pairs Number of Rows Orientation PCB Retention PCB Thickness Recommended (in) PCB Thickness Recommended (mm) Packaging Type Pitch - Mating Interface (in) Pitch - Mating Interface (mm) Plating min: Mating (µin) Plating min: Mating (µm) Plating min: Termination (µin) Plating min: Termination (µm) Polarized to PCB Stackable Surface Mount Compatible (SMC) Temperature Range - Operating 40 40 Black 200 No 94V-0 Yes None High Performance Alloy (HPA), Stainless Steel Gold Tin-Lead High Temperature Thermoplastic 10 Open Pin Field 5 Vertical None 0.070 In 1.80 mm Tube 0.079 In 2.00 mm 30 0.75 30 0.75 Yes Yes Yes -55°C to +105°C Search Parts in this Series 74697Series Mates With 74670 HSD Daughtercard Application Tooling | FAQ Tooling specifications and manuals are found by selecting the products below. Crimp Height Specifications are then contained in the Application Tooling Specification document. Global Description Product # VHDM® 5 Row Pin 0622015810 and Shield Repair Tool VHDM® 5 Row 0622016010 Shield Extraction Tool VHDM-HSD™ Signal 0622020201 Header, 5 Row by 10 Wide, 20.00mm (.787") Termination Interface: Style Through Hole - Compliant Pin Electrical Current - Maximum per Contact Data Rate Real Signals (per 25mm) Voltage - Maximum 1A 5.0 Gbps 48 120V AC (RMS)/DC Material Info Reference - Drawing Numbers Packaging Specification Sales Drawing VHDM-HSD is a trademark of Amphenol Corporation PK-74696-003 SD-74697-003 This document was generated on 05/27/2010 PLEASE CHECK WWW.MOLEX.COM FOR LATEST PART INFORMATION

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74697-1102

1. 物料型号： - 型号：0746971102 - 状态：Active（活跃）

2. 器件简介： - 描述：2.00mm (.079") 间距 5-行 VHDM-HSD™ 背板头，引导销信号模块，屏蔽销端版本，高级配对屏蔽，40 路，引脚长度 6.25mm (.246")。 - 产品家族：背板连接器 - 系列：74697 - 应用：背板 - 组件类型：PCB头

3. 引脚分配： - 列数：10 - 行数：5 - 电路（已加载）：40 - 电路（最大）：40

4. 参数特性： - 颜色 - 树脂：黑色 - 耐久性（最大配对周期）：200 - 阻燃性：94V-0 - 材料 - 金属：高性能合金（HPA），不锈钢 - 材料 - 镀层配对：金 - 材料 - 镀层终止：锡铅 - 材料 - 树脂：高温热塑性塑料 - 推荐PCB厚度（英寸）：0.070 In - 推荐PCB厚度（毫米）：1.80 mm - 间距 - 配对接口（英寸）：0.079 In - 间距 - 配对接口（毫米）：2.00 mm - 镀层最小：配对（微英寸）：30 - 镀层最小：配对（微米）：0.75 - 镀层最小：终止（微英寸）：30 - 镀层最小：终止（微米）：0.75

5. 功能详解： - VHDM-HSD™ 信号头，5行×10宽，20.00mm (.787")。 - 电气最大电流 - 每接触：1A - 数据速率：5.0 Gbps - 真实信号（每25mm）：48

6. 应用信息： - 与74670 HSD女儿卡配对使用。

7. 封装信息： - 包装类型：管装 - 极化到PCB：是 - 可堆叠：是 - 表面贴装兼容（SMC）：是 - 工作温度范围：-55°C至+105°C

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