75237-4104

厂商：
MOLEX9
封装：
描述：
75237-4104 - 1.85mm by 1.85mm (.073 by .073") Pitch 5-Pair GbX Backplane Connector System, Right Gui...

数据手册：

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75237-4104 数据手册

This document was generated on 05/13/2010 PLEASE CHECK WWW.MOLEX.COM FOR LATEST PART INFORMATION Part Number: Status: Overview: Description: 0752374104 Active gbx_backplane_connector_system 1.85mm by 1.85mm (.073 by .073") Pitch 5-Pair GbX® Backplane Connector System, Right Guide Header, 100 Circuits, Pin Length 4.55mm (.179") Documents: Drawing (PDF) Product Specification PS-75221-999 (PDF) RoHS Certificate of Compliance (PDF) Series Agency Certification UL E29179 image - Reference only EU RoHS China RoHS RoHS Compliant by Exemption REACH SVHC Not Reviewed Halogen-Free Status Not Reviewed Need more information on product environmental compliance? Email productcompliance@molex.com For a multiple part number RoHS Certificate of Compliance, click here Please visit the Contact Us section for any non-product compliance questions. General Product Family Series Application Application Tooling Documents Comments Component Type Overview Product Name Style Backplane Connectors 75237 Backplane Tooling Manual Right Guide Header, No Keying Position PCB Header gbx_backplane_connector_system GbX® N/A Physical Circuits (Loaded) Circuits (maximum) Color - Resin Durability (mating cycles max) First Mate / Last Break Flammability Guide to Mating Part Keying to Mating Part Material - Metal Material - Plating Mating Material - Plating Termination Material - Resin Number of Columns Number of Pairs Number of Rows Orientation PC Tail Length (in) PC Tail Length (mm) PCB Locator PCB Retention PCB Thickness Recommended (in) PCB Thickness Recommended (mm) Packaging Type Pitch - Mating Interface (in) Pitch - Mating Interface (mm) Pitch - Term. Interface (in) Pitch - Term. Interface (mm) Plating min: Mating (µin) Plating min: Mating (µm) Plating min: Termination (µin) 100 100 Gray (Dark) 200 No 94V-0 Yes Yes High Performance Alloy (HPA), Stainless Steel Gold Tin-Lead High Temperature Thermoplastic 10 5 10 Vertical 0.091 In 2.30 mm No Yes 0.063 In 1.60 mm Tray 0.073 In 1.85 mm 0.073 In 1.85 mm 30 0.76 30 Search Parts in this Series 75237Series Mates With 75360 GbX® Daughtercard Application Tooling | FAQ Tooling specifications and manuals are found by selecting the products below. Crimp Height Specifications are then contained in the Application Tooling Specification document. Global Description Product # Insertion Tool, GbX® 0622022030 5 pair by 10 wide Insertion Tool, GbX® 0622022040 5 pair by 20 wide GbX® Single Pin 0622022090 Repair Tool GbX® Shield 0622022100 Removal Tool Plating min: Termination (µm) Polarized to PCB Stackable Surface Mount Compatible (SMC) Temperature Range - Operating Termination Interface: Style 0.76 No No Yes 105°C Through Hole - Compliant Pin Electrical Current - Maximum per Contact Data Rate Real Signals (per 25mm) Shield Type Shielded Voltage - Maximum 1A 8.0 Gbps 135 Ground Plane Shield Yes 120V AC (RMS)/DC Material Info Reference - Drawing Numbers Product Specification PS-75221-999 Sales Drawing SD-75237-410 GbX is a registered trademark of Amphenol Corporation. This document was generated on 05/13/2010 PLEASE CHECK WWW.MOLEX.COM FOR LATEST PART INFORMATION

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75237-4104

1. 物料型号： - 型号：0752374104 - 状态：Active（活跃）

2. 器件简介： - 描述：1.85mm x 1.85mm (0.073" x 0.073") 间距，5对GbX®背板连接器系统，右导向头，100路，引脚长度4.55mm (0.179")。 - 产品系列：75237 - 应用：背板 - 组件类型：PCB头 - 产品名称：GbXR

3. 引脚分配： - 电路（已加载）：100 - 列数：10 - 行数：10

4. 参数特性： - 颜色 - 树脂：深灰色 - 耐久性（最大插配次数）：200 - 阻燃性：94V-0 - 引脚到配合件的导向：是 - 金属材质：高性能合金（HPA），不锈钢 - 配合件镀层：金 - 端子镀层：锡-铅 - 树脂材质：高温热塑性塑料 - PCB厚度推荐（英寸）：0.063 - PCB厚度推荐（毫米）：1.60

5. 功能详解： - 配合件：75360 GbX®子卡 - 电气特性：最大每接触点电流1A，数据速率8.0 Gbps，实信号（每25mm）135，屏蔽类型：地平面屏蔽，最大电压：120V AC（RMS）/DC。

6. 应用信息： - 应用工具文档：Tooling Manual Right Guide Header, No Keying Position - 应用工具：5对10宽插入工具，GbX® 0622022030；5对20宽插入工具，GbX® 0622022040；GbX®单针修复工具0622022090；GbX®屏蔽移除工具0622022100。

7. 封装信息： - 包装类型：Tray（托盘） - 配合界面间距（英寸）：0.073 - 配合界面间距（毫米）：1.85 - 端子界面间距（英寸）：0.073 - 端子界面间距（毫米）：1.85 - 配合界面镀层最小厚度（微英寸）：30 - 配合界面镀层最小厚度（微米）：0.76 - 端子界面镀层最小厚度（微英寸）：30 - 端子界面镀层最小厚度（微米）：0.76

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